Taiwan semiconductor manufacturing co., ltd. (20240096825). BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING QUALITY simplified abstract

BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING QUALITY

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Chen-Hua Yu of Hsinchu City (TW)

Chih-Hang Tung of Hsinchu (TW)

Kuo-Chung Yee of Taoyuan City (TW)

Yian-Liang Kuo of Hsinchu City (TW)

Jiun-Yi Wu of Zhongli City (TW)

BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING QUALITY - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240096825 titled 'BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING QUALITY

Simplified Explanation

The bond head described in the patent application includes a bond base, a chuck member, and an elastic material. The chuck member protrudes from the bond base and has a chuck surface with vacuum holes for holding a die using air pressure. The width of the chuck surface is less than the width of the bond base but equal to or greater than the width of the die. The elastic material covers the chuck surface, including edges and corners.

• Bond head design for holding dies during bonding process
• Chuck member with vacuum holes for die placement
• Elastic material covering chuck surface for protection
• Optimization for die width and chuck surface width

Potential Applications

The technology can be applied in semiconductor manufacturing processes where precise die bonding is required. It can also be used in electronics assembly for accurate positioning of components.

Problems Solved

The bond head design solves the problem of securely holding delicate dies during the bonding process. It also addresses the issue of protecting the edges and corners of the chuck surface from damage.

Benefits

- Improved accuracy and precision in die bonding - Enhanced protection for fragile dies - Efficient and reliable performance in manufacturing processes

Potential Commercial Applications

- Semiconductor industry for die bonding - Electronics manufacturing for component assembly

Possible Prior Art

Prior art may include existing bond head designs with different configurations for holding and bonding dies. However, the specific combination of features described in this patent application may be novel.

How does this technology compare to existing bond head designs in terms of efficiency and reliability?

The article does not provide a direct comparison with existing bond head designs in terms of efficiency and reliability. Further research or testing may be needed to evaluate the performance of this technology against others in the market.

What are the potential cost implications of implementing this bond head design in manufacturing processes?

The article does not discuss the cost implications of implementing this bond head design in manufacturing processes. A cost-benefit analysis or feasibility study may be necessary to determine the economic impact of adopting this technology.

Original Abstract Submitted

a bond head is provided. the bond head includes a bond base, a chuck member, and an elastic material. the chuck member protrudes from a surface of the bond base, and has a chuck surface formed with vacuum holes for holding a die using differential air pressure. in the direction parallel to the chuck surface, the width of the chuck surface is less than the width of the bond base and is equal to or greater than the width of the die. the elastic material is disposed over the chuck surface. the elastic material is arranged around the periphery of the chuck surface to cover edges and/or corners of the chuck surface.