Taiwan semiconductor manufacturing co., ltd. (20240096804). SEMICONDUCTOR DEVICE AND METHOD simplified abstract
Contents
- 1 SEMICONDUCTOR DEVICE AND METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE AND METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DEVICE AND METHOD
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Chung-Hui Chen of Hsinchu (TW)
SEMICONDUCTOR DEVICE AND METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096804 titled 'SEMICONDUCTOR DEVICE AND METHOD
Simplified Explanation
The semiconductor device described in the abstract includes a first conductive line on the front side of a semiconductor wafer, a first power rail on the back side of the wafer, and a first transistor with a gate structure, active regions, and a channel region. Vias are used to electrically connect the active regions to the conductive line and power rail.
- Explanation of the patent/innovation:
* The patent describes a semiconductor device with a unique structure that allows for efficient electrical connections between different components on the wafer. * By using vias to connect the active regions of the transistor to the conductive line and power rail, the device can function effectively and reliably.
Potential Applications
The technology described in this patent could be applied in various electronic devices and systems, such as:
- Integrated circuits
- Microprocessors
- Memory devices
Problems Solved
This technology addresses several issues in semiconductor device design, including:
- Ensuring proper electrical connections between components
- Improving the performance and reliability of the device
- Enhancing overall efficiency in electronic systems
Benefits
The benefits of this technology include:
- Increased functionality and performance of semiconductor devices
- Enhanced reliability and durability
- Improved efficiency in electronic systems
Potential Commercial Applications
The technology described in this patent has potential commercial applications in various industries, including:
- Consumer electronics
- Telecommunications
- Automotive
- Aerospace
Possible Prior Art
One possible prior art related to this technology is the use of vias in semiconductor devices for electrical connections. Previous patents or publications may exist that describe similar methods of connecting active regions to power sources in semiconductor devices.
Unanswered Questions
How does this technology compare to existing methods of connecting active regions in semiconductor devices?
This article does not provide a direct comparison between this technology and other methods of connecting active regions in semiconductor devices. Further research or analysis would be needed to determine the advantages and disadvantages of this approach.
What are the potential limitations or challenges in implementing this technology in practical applications?
The article does not discuss any potential limitations or challenges that may arise when implementing this technology in real-world applications. Additional information or testing may be required to identify and address any such issues.
Original Abstract Submitted
a semiconductor device includes a first conductive line extending in a first direction on a front side of a semiconductor wafer, a first power rail extending in the first direction on a back side of the semiconductor wafer, and a first transistor including a first gate structure extending in a second direction perpendicular to the first direction, first and second active regions adjacent to the first gate structure, and a first channel region extending between the first and second active regions through the first gate structure. a first via is positioned between and electrically connects the first active region and the first conductive line, and a second via is positioned between and electrically connects the second active region and the first power rail.
