Taiwan semiconductor manufacturing co., ltd. (20240096778). SEMICONDUCTOR DIE PACKAGE WITH CONDUCTIVE LINE CRACK PREVENTION DESIGN simplified abstract

SEMICONDUCTOR DIE PACKAGE WITH CONDUCTIVE LINE CRACK PREVENTION DESIGN

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Ya-Huei Lee of Zhunan Township (TW)

Shu-Shen Yeh of Taoyuan City (TW)

Kuo-Ching Hsu of Taipei (TW)

Shyue-Ter Leu of Hsinchu City (TW)

Po-Yao Lin of Zhudong Township (TW)

Shin-Puu Jeng of Po-Shan Village (TW)

SEMICONDUCTOR DIE PACKAGE WITH CONDUCTIVE LINE CRACK PREVENTION DESIGN - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240096778 titled 'SEMICONDUCTOR DIE PACKAGE WITH CONDUCTIVE LINE CRACK PREVENTION DESIGN

Simplified Explanation

The semiconductor die package described in the patent application includes a semiconductor die and a package substrate that supports and is electrically connected to the die. The package substrate contains several conductive lines, with one of the lines positioned under a corner of the semiconductor die. This particular conductive line consists of a linear first line segment and a non-linear second line segment that is connected to the first segment. The first line segment extends in a specific direction, while the second line segment varies in its extension direction.

• The semiconductor die package includes a semiconductor die and a package substrate.
• The package substrate supports and is electrically connected to the semiconductor die.
• The package substrate contains several conductive lines, with one positioned under a corner of the semiconductor die.
• The conductive line under the corner consists of a linear first line segment and a non-linear second line segment.
• The first line segment extends in a first direction, while the second line segment has a varying extension direction.

Potential Applications

The technology described in this patent application could be applied in various electronic devices such as smartphones, tablets, and computers where semiconductor die packages are used.

Problems Solved

This technology helps in improving the electrical connection and support for semiconductor dies within packages, particularly in cases where space constraints or specific corner configurations are present.

Benefits

The benefits of this technology include enhanced reliability and performance of semiconductor die packages, as well as potentially reducing manufacturing costs and improving overall device functionality.

Potential Commercial Applications

• "Enhancing Semiconductor Die Package Support and Connectivity for Improved Device Performance"

Possible Prior Art

There may be prior art related to the design and configuration of conductive lines within semiconductor die packages, particularly focusing on optimizing electrical connections and support for the die.

How does this technology compare to existing solutions in terms of cost-effectiveness?

The article does not provide specific information on the cost-effectiveness of implementing this technology compared to existing solutions.

What specific electronic devices could benefit the most from this technology?

The article does not mention any specific electronic devices that could benefit the most from the technology described.

Original Abstract Submitted

a semiconductor die package is provided. the semiconductor die package includes a semiconductor die and a package substrate supporting and electrically connected to the semiconductor die. the semiconductor die has a corner. the package substrate includes several conductive lines, and one of the conductive lines under the corner of the semiconductor die includes a first line segment and a second line segment connected to the first line segment. the first line segment is linear and extends in a first direction. the second line segment is non-linear and has a varying extension direction.