Taiwan semiconductor manufacturing co., ltd. (20240096732). SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Chih-Hao Chen of Taipei City (TW)
Li-Hui Cheng of New Taipei City (TW)
Ying-Ching Shih of Hsinchu City (TW)
SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096732 titled 'SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING
Simplified Explanation
The patent application describes a fixture for a semiconductor die package mounted on an interposer, including a lid component with footing structures for increased structural rigidity.
- The fixture includes a semiconductor die package mounted on an interposer.
- The fixture also includes a lid component with top and footing structures connecting it to the interposer.
- A thermal interface material is placed between the top surface of the semiconductor die package and the top structure of the lid component.
- The footing structures, connected to the interposer with epoxy deposits, enhance the structural rigidity of the fixture.
Potential Applications
The technology described in the patent application could be applied in the manufacturing of electronic devices, such as computers, smartphones, and other consumer electronics.
Problems Solved
This technology solves the problem of ensuring structural rigidity in fixtures for semiconductor die packages, which is crucial for maintaining the integrity of the components during operation.
Benefits
The benefits of this technology include improved reliability and performance of electronic devices, as well as potentially reducing the risk of damage to semiconductor components.
Potential Commercial Applications
The technology could be commercially applied in the semiconductor industry for the production of high-performance electronic devices.
Possible Prior Art
One possible prior art for this technology could be fixtures for semiconductor die packages that do not include the footing structures described in the patent application.
Unanswered Questions
How does this technology compare to existing fixtures for semiconductor die packages in terms of cost-effectiveness?
The patent application does not provide information on the cost-effectiveness of the described technology compared to existing fixtures.
What are the environmental implications of using the epoxy material for connecting the footing structures to the interposer?
The patent application does not address the environmental impact of using epoxy material in the manufacturing process.
Original Abstract Submitted
some implementations described herein provide techniques and apparatuses for a fixture including a semiconductor die package and methods of formation. the semiconductor die package is mounted to an interposer. in addition to the semiconductor die package, the fixture includes a lid component having a top structure and footing structures that connect the lid component to the interposer. the fixture includes a thermal interface material between a top surface of the semiconductor die package and the top structure of the lid component. the footing structures, connected to the interposer using deposits of an epoxy material, provide increase a structural rigidity of the fixture relative to another fixture not including the footing structures.
