Taiwan semiconductor manufacturing co., ltd. (20240096677). Wafer Positioning Method and Apparatus simplified abstract
Contents
- 1 Wafer Positioning Method and Apparatus
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Wafer Positioning Method and Apparatus - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
Wafer Positioning Method and Apparatus
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Liang-Yin Chen of Hsinchu (TW)
Wafer Positioning Method and Apparatus - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096677 titled 'Wafer Positioning Method and Apparatus
Simplified Explanation
The patent application describes a method and apparatus for correcting misalignment of a wafer on a wafer holder in a semiconductor alignment apparatus.
- Wafer stage for holding the wafer
- Wafer holder positioned over the wafer stage
- First position detector for detecting alignment in a first direction
- Second position detector for detecting alignment in a second direction
- Rotational detector for detecting rotational alignment of the wafer
Potential Applications
The technology can be applied in semiconductor manufacturing processes where precise alignment of wafers is crucial for accurate processing.
Problems Solved
This technology solves the problem of misalignment of wafers on wafer holders, which can lead to errors in semiconductor manufacturing processes.
Benefits
The benefits of this technology include improved accuracy and efficiency in semiconductor manufacturing, leading to higher quality products.
Potential Commercial Applications
A potential commercial application of this technology is in semiconductor fabrication facilities where precise alignment of wafers is essential for producing high-performance semiconductor devices.
Possible Prior Art
One possible prior art for this technology could be existing wafer alignment systems used in semiconductor manufacturing processes.
What is the cost of implementing this technology in semiconductor fabrication facilities?
The cost of implementing this technology in semiconductor fabrication facilities would depend on factors such as the size of the facility, the number of wafer holders that need to be equipped with the alignment apparatus, and the specific requirements of the manufacturing processes. Additional costs may include installation, training, and maintenance.
How does this technology compare to traditional methods of wafer alignment in terms of accuracy and efficiency?
This technology offers improved accuracy and efficiency compared to traditional methods of wafer alignment, as it utilizes multiple position detectors and a rotational detector to ensure precise alignment of the wafer on the wafer holder. This can result in higher quality semiconductor products and reduced waste in the manufacturing process.
Original Abstract Submitted
a method of correcting a misalignment of a wafer on a wafer holder and an apparatus for performing the same are disclosed. in an embodiment, a semiconductor alignment apparatus includes a wafer stage; a wafer holder over the wafer stage; a first position detector configured to detect an alignment of a wafer over the wafer holder in a first direction; a second position detector configured to detect an alignment of the wafer over the wafer holder in a second direction; and a rotational detector configured to detect a rotational alignment of the wafer over the wafer holder.
