Taiwan semiconductor manufacturing co., ltd. (20240094625). PHOTOMASK INCLUDING FIDUCIAL MARK AND METHOD OF MAKING A PHOTOMASK simplified abstract
Contents
- 1 PHOTOMASK INCLUDING FIDUCIAL MARK AND METHOD OF MAKING A PHOTOMASK
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PHOTOMASK INCLUDING FIDUCIAL MARK AND METHOD OF MAKING A PHOTOMASK - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PHOTOMASK INCLUDING FIDUCIAL MARK AND METHOD OF MAKING A PHOTOMASK
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Hsin-Chang Lee of Hsinchu (TW)
Chih-Cheng Lin of Hsinchu (TW)
PHOTOMASK INCLUDING FIDUCIAL MARK AND METHOD OF MAKING A PHOTOMASK - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240094625 titled 'PHOTOMASK INCLUDING FIDUCIAL MARK AND METHOD OF MAKING A PHOTOMASK
Simplified Explanation
The abstract describes a method of making a semiconductor device involving forming fiducial marks on a photomask and defining a pattern with different spacings between sub-patterns on the photomask.
- Fiducial marks are created on a photomask to assist in aligning different layers during the semiconductor device manufacturing process.
- The pattern on the photomask includes sub-patterns with varying spacings to control the layout and design of the semiconductor device.
Potential Applications
The technology can be applied in the manufacturing of various semiconductor devices such as integrated circuits, microprocessors, and memory chips.
Problems Solved
This method helps in achieving precise alignment and spacing between different layers of the semiconductor device, leading to improved performance and functionality.
Benefits
- Enhanced accuracy in the fabrication process - Increased efficiency in semiconductor device production - Improved overall quality and reliability of the final product
Potential Commercial Applications
"Optimizing Semiconductor Device Manufacturing Process for Enhanced Performance"
Possible Prior Art
Prior art may include similar methods of aligning layers and defining patterns in semiconductor device fabrication processes.
Unanswered Questions
How does this method compare to existing techniques in terms of cost-effectiveness?
The abstract does not provide information on the cost implications of implementing this method compared to traditional semiconductor manufacturing processes.
What specific types of semiconductor devices can benefit the most from this technology?
The abstract does not specify which types of semiconductor devices would see the greatest improvements from using this method.
Original Abstract Submitted
a method of making a semiconductor device includes forming at least one fiducial mark on a photomask. the method further includes defining a pattern including a plurality of sub-patterns on the photomask in a pattern region. the defining the pattern includes defining a first sub-pattern of the plurality of sub-patterns having a first spacing from a second sub-pattern of the plurality of sub-patterns, wherein the first spacing is different from a second spacing between the second sub-pattern and a third sub-pattern of the plurality of sub-patterns.
