Taiwan Semiconductor Manufacturing Company Limited patent applications published on November 30th, 2023
Contents
- 1 Patent applications for Taiwan Semiconductor Manufacturing Company Limited on November 30th, 2023
- 1.1 Systems and Methods for Classifying PUF Signature Modules of Integrated Circuits (18446838)
- 1.2 Mixed Poly Pitch Design Solution for Power Trim (18361948)
- 1.3 INTEGRATED CHIP PACKAGE INCLUDING A CRACK-RESISTANT LID STRUCTURE AND METHODS OF FORMING THE SAME (17898834)
- 1.4 PACKAGING SUBSTRATE INCLUDING A STRESS-ABSORPTION TRENCH AND METHODS OF FORMING THE SAME (17828064)
- 1.5 SEMICONDUCTOR PACKAGE INCLUDING LID WITH INTEGRATED HEAT PIPE FOR THERMAL MANAGEMENT AND METHODS FOR FORMING THE SAME (18366788)
- 1.6 SEMICONDUCTOR DIE INCLUDING THROUGH SUBSTRATE VIA BARRIER STRUCTURE AND METHODS FOR FORMING THE SAME (18230135)
- 1.7 REDISTRIBUTION STRUCTURE WITH COPPER BUMPS ON PLANAR METAL INTERCONNECTS AND METHODS OF FORMING THE SAME (17826223)
- 1.8 SEMICONDUCTOR PACKAGE WITH VARIABLE PILLAR HEIGHT AND METHODS FOR FORMING THE SAME (17828066)
- 1.9 DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR DIE PACKAGING (18446554)
- 1.10 VERTICAL SEMICONDUCTOR PACKAGE INCLUDING HORIZONTALLY STACKED DIES AND METHODS OF FORMING THE SAME (18230147)
- 1.11 Device with a High Efficiency Voltage Multiplier (18447367)
- 1.12 SEMICONDUCTOR ARRANGEMENT WITH ISOLATION STRUCTURE (18232085)
- 1.13 FERROELECTRIC MFM CAPACITOR ARRAY AND METHODS OF MAKING THE SAME (18363217)
- 1.14 SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING (18231847)
- 1.15 SELF-ALIGNED ACTIVE REGIONS AND PASSIVATION LAYER AND METHODS OF MAKING THE SAME (18446541)
- 1.16 TRANSISTOR INCLUDING HYDROGEN DIFFUSION BARRIER FILM AND METHODS OF FORMING SAME (18230864)
- 1.17 RAISED SOURCE/DRAIN OXIDE SEMICONDUCTING THIN FILM TRANSISTOR AND METHODS OF MAKING THE SAME (18366725)
- 1.18 Semiconductor Device Including a Layer Between a Source/Drain Region and a Substrate (18366733)
- 1.19 MOBILITY ENHANCEMENT BY SOURCE AND DRAIN STRESS LAYER OR IMPLANTATION IN THIN FILM TRANSISTORS (18446755)
- 1.20 MEMORY CHIPLET HAVING MULTIPLE ARRAYS OF MEMORY DEVICES AND METHODS OF FORMING THE SAME (18362192)
- 1.21 ENCAPSULATED PHASE CHANGE MATERIAL SWITCH AND METHODS FOR FORMING THE SAME (17826815)
Patent applications for Taiwan Semiconductor Manufacturing Company Limited on November 30th, 2023
Systems and Methods for Classifying PUF Signature Modules of Integrated Circuits (18446838)
Main Inventor
Cheng-En Lee
Mixed Poly Pitch Design Solution for Power Trim (18361948)
Main Inventor
Shih-Wei Peng
INTEGRATED CHIP PACKAGE INCLUDING A CRACK-RESISTANT LID STRUCTURE AND METHODS OF FORMING THE SAME (17898834)
Main Inventor
Wensen Hung
PACKAGING SUBSTRATE INCLUDING A STRESS-ABSORPTION TRENCH AND METHODS OF FORMING THE SAME (17828064)
Main Inventor
Hsien-Wei Chen
SEMICONDUCTOR PACKAGE INCLUDING LID WITH INTEGRATED HEAT PIPE FOR THERMAL MANAGEMENT AND METHODS FOR FORMING THE SAME (18366788)
Main Inventor
Yu-Sheng LIN
SEMICONDUCTOR DIE INCLUDING THROUGH SUBSTRATE VIA BARRIER STRUCTURE AND METHODS FOR FORMING THE SAME (18230135)
Main Inventor
Jen-Yuan CHANG
REDISTRIBUTION STRUCTURE WITH COPPER BUMPS ON PLANAR METAL INTERCONNECTS AND METHODS OF FORMING THE SAME (17826223)
Main Inventor
Hsien-Wei Chen
SEMICONDUCTOR PACKAGE WITH VARIABLE PILLAR HEIGHT AND METHODS FOR FORMING THE SAME (17828066)
Main Inventor
Li-Ling Liao
DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR DIE PACKAGING (18446554)
Main Inventor
Wei-Yu CHEN
VERTICAL SEMICONDUCTOR PACKAGE INCLUDING HORIZONTALLY STACKED DIES AND METHODS OF FORMING THE SAME (18230147)
Main Inventor
Jen-Yuan CHANG
Device with a High Efficiency Voltage Multiplier (18447367)
Main Inventor
Yu-Tso Lin
SEMICONDUCTOR ARRANGEMENT WITH ISOLATION STRUCTURE (18232085)
Main Inventor
Feng-Chien HSIEH
FERROELECTRIC MFM CAPACITOR ARRAY AND METHODS OF MAKING THE SAME (18363217)
Main Inventor
Chun-Chieh LU
SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING (18231847)
Main Inventor
Shih-Wei PENG
SELF-ALIGNED ACTIVE REGIONS AND PASSIVATION LAYER AND METHODS OF MAKING THE SAME (18446541)
Main Inventor
Hung Wei LI
TRANSISTOR INCLUDING HYDROGEN DIFFUSION BARRIER FILM AND METHODS OF FORMING SAME (18230864)
Main Inventor
Hung Wei LI
RAISED SOURCE/DRAIN OXIDE SEMICONDUCTING THIN FILM TRANSISTOR AND METHODS OF MAKING THE SAME (18366725)
Main Inventor
Gerben Doornbos
Semiconductor Device Including a Layer Between a Source/Drain Region and a Substrate (18366733)
Main Inventor
Kam-Tou Sio
MOBILITY ENHANCEMENT BY SOURCE AND DRAIN STRESS LAYER OR IMPLANTATION IN THIN FILM TRANSISTORS (18446755)
Main Inventor
Hui-Hsien WEI
MEMORY CHIPLET HAVING MULTIPLE ARRAYS OF MEMORY DEVICES AND METHODS OF FORMING THE SAME (18362192)
Main Inventor
Chao-I WU
ENCAPSULATED PHASE CHANGE MATERIAL SWITCH AND METHODS FOR FORMING THE SAME (17826815)
Main Inventor
Tsung-Hsueh Yang
