Taiwan Semiconductor Manufacturing Company Limited patent applications published on November 30th, 2023

Summary of the patent applications from Taiwan Semiconductor Manufacturing Company Limited on November 30th, 2023

Taiwan Semiconductor Manufacturing Company Limited (TSMC) has recently filed several patents related to various aspects of semiconductor technology. These patents cover methods for creating dielectric isolation layers, memory structures, enhancing charge carrier mobility, eliminating the need for read assist circuits, and fabricating transistors and capacitors. Notable applications of these patents include the creation of a dielectric isolation layer with electrodes and a phase change material (PCM) line, the development of a memory structure with multiple types of memory arrays and peripheral circuit devices, and the enhancement of charge carrier mobility in semiconducting material layers. Additionally, TSMC's patents describe devices and methods for eliminating the need for read assist circuits in semiconductor devices, as well as the fabrication of transistors and capacitors with specific design features. These patents demonstrate TSMC's commitment to advancing semiconductor technology and improving the performance and functionality of electronic devices.

Summary of patents filed by TSMC:

• Methods for creating dielectric isolation layers with electrodes and phase change material lines.
• Memory structures with multiple types of memory arrays and peripheral circuit devices.
• Methods for enhancing charge carrier mobility in semiconducting material layers.
• Devices and methods for eliminating the need for read assist circuits in semiconductor devices.
• Fabrication of transistors and capacitors with specific design features.

Notable applications of TSMC's patents:

• Creation of dielectric isolation layers with electrodes and phase change material lines.
• Development of memory structures with multiple types of memory arrays and peripheral circuit devices.
• Enhancement of charge carrier mobility in semiconducting material layers.
• Elimination of the need for read assist circuits in semiconductor devices.
• Fabrication of transistors and capacitors with specific design features.

Patent applications for Taiwan Semiconductor Manufacturing Company Limited on November 30th, 2023

Systems and Methods for Classifying PUF Signature Modules of Integrated Circuits (18446838)

Main Inventor

Cheng-En Lee

Mixed Poly Pitch Design Solution for Power Trim (18361948)

Main Inventor

Shih-Wei Peng

INTEGRATED CHIP PACKAGE INCLUDING A CRACK-RESISTANT LID STRUCTURE AND METHODS OF FORMING THE SAME (17898834)

Main Inventor

Wensen Hung

PACKAGING SUBSTRATE INCLUDING A STRESS-ABSORPTION TRENCH AND METHODS OF FORMING THE SAME (17828064)

Main Inventor

Hsien-Wei Chen

SEMICONDUCTOR PACKAGE INCLUDING LID WITH INTEGRATED HEAT PIPE FOR THERMAL MANAGEMENT AND METHODS FOR FORMING THE SAME (18366788)

Main Inventor

Yu-Sheng LIN

SEMICONDUCTOR DIE INCLUDING THROUGH SUBSTRATE VIA BARRIER STRUCTURE AND METHODS FOR FORMING THE SAME (18230135)

Main Inventor

Jen-Yuan CHANG

REDISTRIBUTION STRUCTURE WITH COPPER BUMPS ON PLANAR METAL INTERCONNECTS AND METHODS OF FORMING THE SAME (17826223)

Main Inventor

Hsien-Wei Chen

SEMICONDUCTOR PACKAGE WITH VARIABLE PILLAR HEIGHT AND METHODS FOR FORMING THE SAME (17828066)

Main Inventor

Li-Ling Liao

DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR DIE PACKAGING (18446554)

Main Inventor

Wei-Yu CHEN

VERTICAL SEMICONDUCTOR PACKAGE INCLUDING HORIZONTALLY STACKED DIES AND METHODS OF FORMING THE SAME (18230147)

Main Inventor

Jen-Yuan CHANG

Device with a High Efficiency Voltage Multiplier (18447367)

Main Inventor

Yu-Tso Lin

SEMICONDUCTOR ARRANGEMENT WITH ISOLATION STRUCTURE (18232085)

Main Inventor

Feng-Chien HSIEH

FERROELECTRIC MFM CAPACITOR ARRAY AND METHODS OF MAKING THE SAME (18363217)

Main Inventor

Chun-Chieh LU

SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING (18231847)

Main Inventor

Shih-Wei PENG

SELF-ALIGNED ACTIVE REGIONS AND PASSIVATION LAYER AND METHODS OF MAKING THE SAME (18446541)

Main Inventor

Hung Wei LI

TRANSISTOR INCLUDING HYDROGEN DIFFUSION BARRIER FILM AND METHODS OF FORMING SAME (18230864)

Main Inventor

Hung Wei LI

RAISED SOURCE/DRAIN OXIDE SEMICONDUCTING THIN FILM TRANSISTOR AND METHODS OF MAKING THE SAME (18366725)

Main Inventor

Gerben Doornbos

Semiconductor Device Including a Layer Between a Source/Drain Region and a Substrate (18366733)

Main Inventor

Kam-Tou Sio

MOBILITY ENHANCEMENT BY SOURCE AND DRAIN STRESS LAYER OR IMPLANTATION IN THIN FILM TRANSISTORS (18446755)

Main Inventor

Hui-Hsien WEI

MEMORY CHIPLET HAVING MULTIPLE ARRAYS OF MEMORY DEVICES AND METHODS OF FORMING THE SAME (18362192)

Main Inventor

Chao-I WU

ENCAPSULATED PHASE CHANGE MATERIAL SWITCH AND METHODS FOR FORMING THE SAME (17826815)

Main Inventor

Tsung-Hsueh Yang