Taiwan Semiconductor Manufacturing Company Limited patent applications published on November 30th, 2023

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Summary of the patent applications from Taiwan Semiconductor Manufacturing Company Limited on November 30th, 2023

Taiwan Semiconductor Manufacturing Company Limited (TSMC) has recently filed several patents related to various aspects of semiconductor technology. These patents cover methods for creating dielectric isolation layers, memory structures, enhancing charge carrier mobility, eliminating the need for read assist circuits, and fabricating transistors and capacitors. Notable applications of these patents include the creation of a dielectric isolation layer with electrodes and a phase change material (PCM) line, the development of a memory structure with multiple types of memory arrays and peripheral circuit devices, and the enhancement of charge carrier mobility in semiconducting material layers. Additionally, TSMC's patents describe devices and methods for eliminating the need for read assist circuits in semiconductor devices, as well as the fabrication of transistors and capacitors with specific design features. These patents demonstrate TSMC's commitment to advancing semiconductor technology and improving the performance and functionality of electronic devices.

Summary of patents filed by TSMC:

  • Methods for creating dielectric isolation layers with electrodes and phase change material lines.
  • Memory structures with multiple types of memory arrays and peripheral circuit devices.
  • Methods for enhancing charge carrier mobility in semiconducting material layers.
  • Devices and methods for eliminating the need for read assist circuits in semiconductor devices.
  • Fabrication of transistors and capacitors with specific design features.

Notable applications of TSMC's patents:

  • Creation of dielectric isolation layers with electrodes and phase change material lines.
  • Development of memory structures with multiple types of memory arrays and peripheral circuit devices.
  • Enhancement of charge carrier mobility in semiconducting material layers.
  • Elimination of the need for read assist circuits in semiconductor devices.
  • Fabrication of transistors and capacitors with specific design features.



Patent applications for taiwan semiconductor manufacturing limited on November 30th, 2023

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