Taiwan Semiconductor Manufacturing Company Limited patent applications published on March 21st, 2024
Contents
- 1 Patent applications for Taiwan Semiconductor Manufacturing Company Limited on March 21st, 2024
- 1.1 TEST STRUCTURES TO DETERMINE INTEGRATED CIRCUIT BONDING ENERGIES AND METHODS OF MAKING AND USING THE SAME (18303647)
- 1.2 SHIELDING FOR REDUCING ELECTROMAGNETIC INTERFERENCE AND MAGNETIC INTERFERENCE AND METHODS FOR FORMING THE SAME (18303659)
- 1.3 SYSTEM AND METHOD OF BUMP MAP DETERMINATION AND BUMP ARRAY FORMATION (18126767)
- 1.4 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF (18518670)
- 1.5 CHIP PACKAGE AND METHODS FOR FORMING THE SAME (18303641)
- 1.6 PHASE CHANGE MATERIAL SWITCH WITH IMPROVED THERMAL DISSIPATION AND METHODS FOR FORMING THE SAME (18303692)
Patent applications for Taiwan Semiconductor Manufacturing Company Limited on March 21st, 2024
TEST STRUCTURES TO DETERMINE INTEGRATED CIRCUIT BONDING ENERGIES AND METHODS OF MAKING AND USING THE SAME (18303647)
Main Inventor
Yu-Sheng Lin
SHIELDING FOR REDUCING ELECTROMAGNETIC INTERFERENCE AND MAGNETIC INTERFERENCE AND METHODS FOR FORMING THE SAME (18303659)
Main Inventor
Harry-Hak-Lay Chuang
SYSTEM AND METHOD OF BUMP MAP DETERMINATION AND BUMP ARRAY FORMATION (18126767)
Main Inventor
Shih Hsuan HSU
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF (18518670)
Main Inventor
Shih-Yao Lin
CHIP PACKAGE AND METHODS FOR FORMING THE SAME (18303641)
Main Inventor
Kuan-Yu Huang
PHASE CHANGE MATERIAL SWITCH WITH IMPROVED THERMAL DISSIPATION AND METHODS FOR FORMING THE SAME (18303692)
Main Inventor
Fu-Hai Li
