Taiwan Semiconductor Manufacturing Company Limited patent applications published on March 21st, 2024
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Summary of the patent applications from Taiwan Semiconductor Manufacturing Company Limited on March 21st, 2024
Taiwan Semiconductor Manufacturing Company Limited has recently filed patents for innovative technologies in the field of semiconductor devices. These patents include a phase change material (PCM) switch, a bonded assembly design, a semiconductor device with a unique gate structure, and a method for creating bump maps with varying densities.
Summary in bullet points:
- PCM switch utilizing phase change material for rapid switching between conducting and insulating states.
- Bonded assembly design with contoured sidewall for stress reduction in high-performance computing devices.
- Semiconductor device featuring a fin, gate structure, and source/drain structure for improved performance and efficiency.
- Method for creating bump maps with varying densities for realistic textures and surfaces.
Notable applications:
- PCM switch: RF switches, sensors, and electronic devices requiring fast switching capabilities.
- Bonded assembly design: High-performance computing devices, data centers, and telecommunications equipment.
- Semiconductor device: Advanced integrated circuits, processors, and communication systems.
- Bump map creation method: Computer graphics, virtual reality, and 3D modeling for realistic textures and surfaces.
Contents
- 1 Patent applications for Taiwan Semiconductor Manufacturing Company Limited on March 21st, 2024
- 1.1 TEST STRUCTURES TO DETERMINE INTEGRATED CIRCUIT BONDING ENERGIES AND METHODS OF MAKING AND USING THE SAME (18303647)
- 1.2 SHIELDING FOR REDUCING ELECTROMAGNETIC INTERFERENCE AND MAGNETIC INTERFERENCE AND METHODS FOR FORMING THE SAME (18303659)
- 1.3 SYSTEM AND METHOD OF BUMP MAP DETERMINATION AND BUMP ARRAY FORMATION (18126767)
- 1.4 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF (18518670)
- 1.5 CHIP PACKAGE AND METHODS FOR FORMING THE SAME (18303641)
- 1.6 PHASE CHANGE MATERIAL SWITCH WITH IMPROVED THERMAL DISSIPATION AND METHODS FOR FORMING THE SAME (18303692)
Patent applications for Taiwan Semiconductor Manufacturing Company Limited on March 21st, 2024
TEST STRUCTURES TO DETERMINE INTEGRATED CIRCUIT BONDING ENERGIES AND METHODS OF MAKING AND USING THE SAME (18303647)
Main Inventor
Yu-Sheng Lin
SHIELDING FOR REDUCING ELECTROMAGNETIC INTERFERENCE AND MAGNETIC INTERFERENCE AND METHODS FOR FORMING THE SAME (18303659)
Main Inventor
Harry-Hak-Lay Chuang
SYSTEM AND METHOD OF BUMP MAP DETERMINATION AND BUMP ARRAY FORMATION (18126767)
Main Inventor
Shih Hsuan HSU
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF (18518670)
Main Inventor
Shih-Yao Lin
CHIP PACKAGE AND METHODS FOR FORMING THE SAME (18303641)
Main Inventor
Kuan-Yu Huang
PHASE CHANGE MATERIAL SWITCH WITH IMPROVED THERMAL DISSIPATION AND METHODS FOR FORMING THE SAME (18303692)
Main Inventor
Fu-Hai Li
