Taiwan Semiconductor Manufacturing Company, Ltd. patent applications published on October 5th, 2023

Summary of the patent applications from Taiwan Semiconductor Manufacturing Company, Ltd. on October 5th, 2023

Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC) has filed several recent patents related to memory cells, integrated chips, non-volatile memory devices, semiconductor devices, memory and logic device optimization, laminated structures, analog-to-digital converting devices, and fabrication methods for semiconductor devices. These patents demonstrate TSMC's focus on advancing semiconductor technology and improving memory and logic devices.

Notable applications include:

A resistive random-access memory (RRAM) cell with a barrier layer to prevent the movement of non-metal elements, reducing parasitic resistance.
An integrated chip with multiple layers of interconnect dielectric material, a ferroelectric layer, and a sidewall portion connecting the lower and upper portions.
A method to integrate non-volatile memory (NVM) devices with logic or BCD devices, involving forming an isolation structure and creating memory and peripheral device structures.
A semiconductor device with a memory structure consisting of conductive lines, a channel element with an air gap, and memory elements for data storage.
Methods and structures for optimizing the use of memory and logic devices, utilizing gate structures and source/drain features at different distances.
A laminated structure with an interconnect substrate, encapsulant, and redistribution structure with protective patterns.
An analog-to-digital converting device with multiple stages of ADCs, calibration circuits, a data recovery circuit, and an output circuit.
A method and device involving a substrate with two transistor terminals connected by a non-linear via with a wave-like shape.
A method for fabricating a semiconductor device, including forming a 2-D semiconductor layer, source/drain contacts, and a gate structure.
A method of manufacturing a semiconductor device with a fin structure, sacrificial gate structure, isolation region, and void region for electrical isolation.

These recent patents demonstrate TSMC's commitment to innovation in semiconductor technology, particularly in memory cells, integrated chips, and fabrication methods. TSMC's focus on improving memory and logic devices through optimization and advanced structures highlights their dedication to advancing the semiconductor industry.

Patent applications for Taiwan Semiconductor Manufacturing Company, Ltd. on October 5th, 2023

FACET PROFILE TO IMPROVE EDGE COUPLER BEAM POINTING AND COUPLING EFFICIENCY FOR PHOTONICS (17856382)

Inventor Wei-Kang Liu

OPTICAL DEVICE FOR COUPLING LIGHT AND METHOD FOR FABRICATING THE SAME (18331184)

Inventor Chan-Hong Chern

EUV PHOTO MASKS AND MANUFACTURING METHOD THEREOF (17833830)

Inventor Sheng-Min WANG

METHOD FOR LITHOGRAPHY USING MIDDLE LAYER WITH POROUS TOP SURFACE (17710218)

Inventor Yuan Chih LO

PARTICLE REMOVING ASSEMBLY AND METHOD OF CLEANING MASK FOR LITHOGRAPHY (18200951)

Inventor Chen-Yang LIN

COMPUTE-IN-MEMORY CELL (17855089)

Inventor Hidehiro Fujiwara

BOUNDARY CELL (18331576)

Inventor Yu-Jung Chang

MEMORY SYSTEM AND OPERATING METHOD OF MEMORY SYSTEM (17821187)

Inventor Win-San KHWA

RESISTIVE MEMORY WITH ENHANCED REDUNDANCY WRITING (17709662)

Inventor Yu-Der Chih

MEMORY SYSTEM WITH PHYSICAL UNCLONABLE FUNCTION (17710442)

Inventor Meng-Sheng CHANG

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES (17840480)

Inventor Shih-Ming CHANG

METHOD FOR DICING A SEMICONDUCTOR WAFER STRUCTURE (17709696)

Inventor Shu-Hui Su

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (17709766)

Inventor Pei Ying LAI

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME (17710815)

Inventor Tzu-Hsuan CHANG

TRIM WALL PROTECTION METHOD FOR MULTI-WAFER STACKING (18331249)

Inventor Sheng-Chan Li

SEMICONDUCTOR PACKAGES (17711060)

Inventor Yi-Jung Chen

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF (17709470)

Inventor Kai-Ming Chiang

HIGH VOLTAGE PASSIVE DEVICE STRUCTURE (17708998)

Inventor Yuan-Yang Hsiao

SEMICONDUCTOR MEMORY DEVICE HAVING WORD LINES SURROUNDED BY MEMORY LAYERS AND METHOD OF MAKING THE SEMICONDUCTOR MEMORY DEVICE (17708199)

Inventor Meng-Han LIN

DC AND AC MAGNETIC FIELD PROTECTION FOR MRAM DEVICE USING MAGNETIC-FIELD-SHIELDING STRUCTURE (18332047)

Inventor Harry-Hak-Lay Chuang

PASSIVE DEVICE STRUCTURE STRESS REDUCTION (17711740)

Inventor Yuan-Yang Hsiao

SEMICONDUCTOR DEVICE HAVING FUNCTIONAL PATTERNS IN REDUNDANT REGIONS OF DOUBLE SEAL RING (17711847)

Inventor Shan-Yu Huang

PACKAGE STRUCTURE WITH ANTENNA ELEMENT (18328915)

Inventor Yung-Ping CHIANG

A METHOD (AND RELATED APPARATUS) FOR FORMING A SEMICONDUCTOR DEVICE WITH REDUCED SPACING BETWEEN NANOSTRUCTURE FIELD-EFFECT TRANSISTORS (18328117)

Inventor Zhi-Chang Lin

Methods Of Forming Optical Modules (17899863)

Inventor Jung-Huei Peng

ISOLATION STRUCTURE TO INCREASE IMAGE SENSOR PERFORMANCE (17828346)

Inventor Yen-Ting Chiang

Structure and Method for Backside-Illuminated Image Device (17879536)

Inventor Hao-Lin Yang

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (17709583)

Inventor Tsung-Lin LEE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17711707)

Inventor Yan-Ting LIN

METHOD OF FORMING FULLY STRAINED CHANNELS (18329214)

Inventor Shahaji B. More

GATE STRUCTURES FOR MULTI-GATE DEVICES (17750842)

Inventor Shih-Hang Chiu

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME (17700357)

Inventor Shih-Che LIN

HEAT SINK LAYOUT DESIGNS FOR ADVANCED FINFET INTEGRATED CIRCUITS (18322908)

Inventor Amit KUNDU

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF (17890571)

Inventor Chi-Ming HUANG

SEMICONDUCTOR DEVICE STRUCTURE WITH FIN AND METHOD FOR FORMING THE SAME (17710499)

Inventor Zhiqiang WU

METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE WITH LOCAL ISOLATION AND A SEMICONDUCTOR DEVICE WITH LOCAL ISOLATION (17710592)