Difference between revisions of "Taiwan Semiconductor Manufacturing Company, Ltd. patent applications published on November 30th, 2023"

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'''Summary of the patent applications from Taiwan Semiconductor Manufacturing Company, Ltd. on November 30th, 2023'''
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Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC) has recently filed several patents related to the formation and structure of memory devices and semiconductor devices. These patents aim to improve the performance, functionality, and efficiency of these devices.
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Summary:
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- TSMC has filed patents for methods of forming memory devices, semiconductor devices, and magnetic memory devices.
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- The methods involve the formation of specific layers, plugs, and structures to enhance the functionality and performance of the devices.
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- The patents also describe the use of magnetic materials, spin-orbit torque induction structures, and magnetic tunnel junction stacks to improve the operation of the devices.
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- TSMC's patents also include methods for etching magnetic tunneling junction structures and creating ultra-large height top electrodes for MRAM devices.
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- The organization has also filed patents for semiconductor structures with optical components and thermal control mechanisms.
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- Notable applications of these patents include data storage, magnetic sensors, and magnetoresistive random-access memory (MRAM) devices.
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Bullet points:
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* TSMC has filed patents for memory devices, semiconductor devices, and magnetic memory devices.
 +
* The patents describe methods for forming specific layers, plugs, and structures to enhance device performance.
 +
* Magnetic materials, spin-orbit torque induction structures, and magnetic tunnel junction stacks are used in the devices.
 +
* Patents also cover methods for etching magnetic tunneling junction structures and creating large height top electrodes for MRAM devices.
 +
* Semiconductor structures with optical components and thermal control mechanisms are also described.
 +
* Applications include data storage, magnetic sensors, and MRAM devices.
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 +
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==Patent applications for Taiwan Semiconductor Manufacturing Company, Ltd. on November 30th, 2023==
 
==Patent applications for Taiwan Semiconductor Manufacturing Company, Ltd. on November 30th, 2023==

Revision as of 07:25, 6 December 2023

Summary of the patent applications from Taiwan Semiconductor Manufacturing Company, Ltd. on November 30th, 2023

Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC) has recently filed several patents related to the formation and structure of memory devices and semiconductor devices. These patents aim to improve the performance, functionality, and efficiency of these devices.

Summary: - TSMC has filed patents for methods of forming memory devices, semiconductor devices, and magnetic memory devices. - The methods involve the formation of specific layers, plugs, and structures to enhance the functionality and performance of the devices. - The patents also describe the use of magnetic materials, spin-orbit torque induction structures, and magnetic tunnel junction stacks to improve the operation of the devices. - TSMC's patents also include methods for etching magnetic tunneling junction structures and creating ultra-large height top electrodes for MRAM devices. - The organization has also filed patents for semiconductor structures with optical components and thermal control mechanisms. - Notable applications of these patents include data storage, magnetic sensors, and magnetoresistive random-access memory (MRAM) devices.

Bullet points:

  • TSMC has filed patents for memory devices, semiconductor devices, and magnetic memory devices.
  • The patents describe methods for forming specific layers, plugs, and structures to enhance device performance.
  • Magnetic materials, spin-orbit torque induction structures, and magnetic tunnel junction stacks are used in the devices.
  • Patents also cover methods for etching magnetic tunneling junction structures and creating large height top electrodes for MRAM devices.
  • Semiconductor structures with optical components and thermal control mechanisms are also described.
  • Applications include data storage, magnetic sensors, and MRAM devices.



Patent applications for Taiwan Semiconductor Manufacturing Company, Ltd. on November 30th, 2023

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