Taiwan Semiconductor Manufacturing Company, Ltd. patent applications published on November 30th, 2023
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Summary of the patent applications from Taiwan Semiconductor Manufacturing Company, Ltd. on November 30th, 2023
Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC) has recently filed several patents related to the formation and structure of memory devices and semiconductor devices. These patents aim to improve the performance, functionality, and efficiency of these devices.
Summary: - TSMC has filed patents for methods of forming memory devices, semiconductor devices, and magnetic memory devices. - The methods involve the formation of specific layers, plugs, and structures to enhance the functionality and performance of the devices. - The patents also describe the use of magnetic materials, spin-orbit torque induction structures, and magnetic tunnel junction stacks to improve the operation of the devices. - TSMC's patents also include methods for etching magnetic tunneling junction structures and creating ultra-large height top electrodes for MRAM devices. - The organization has also filed patents for semiconductor structures with optical components and thermal control mechanisms. - Notable applications of these patents include data storage, magnetic sensors, and magnetoresistive random-access memory (MRAM) devices.
Bullet points:
- TSMC has filed patents for memory devices, semiconductor devices, and magnetic memory devices.
- The patents describe methods for forming specific layers, plugs, and structures to enhance device performance.
- Magnetic materials, spin-orbit torque induction structures, and magnetic tunnel junction stacks are used in the devices.
- Patents also cover methods for etching magnetic tunneling junction structures and creating large height top electrodes for MRAM devices.
- Semiconductor structures with optical components and thermal control mechanisms are also described.
- Applications include data storage, magnetic sensors, and MRAM devices.
Contents
- 1 Patent applications for Taiwan Semiconductor Manufacturing Company, Ltd. on November 30th, 2023
- 1.1 PARTICLE REMOVER AND METHOD (18448963)
- 1.2 TRANSDUCER DEVICE AND METHOD OF MANUFACTURE (17752558)
- 1.3 DEVICE FOR FORMING CONDUCTIVE POWDER (18447161)
- 1.4 POLISHING METROLOGY (17898163)
- 1.5 CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD (18446842)
- 1.6 SYSTEM AND METHOD FOR REMOVING DEBRIS DURING CHEMICAL MECHANICAL PLANARIZATION (18447211)
- 1.7 MICROELECTROMECHANICAL SYSTEMS DEVICE HAVING A MECHANICALLY ROBUST ANTI-STICTION/OUTGASSING STRUCTURE (18364702)
- 1.8 MEMS MICROPHONE AND MEMS ACCELEROMETER ON A SINGLE SUBSTRATE (18446741)
- 1.9 WIRE-BOND DAMPER FOR SHOCK ABSORPTION (18446740)
- 1.10 DIELECTRIC PROTECTION LAYER CONFIGURED TO INCREASE PERFORMANCE OF MEMS DEVICE (17825225)
- 1.11 SHUTTER DISC FOR A SEMICONDUCTOR PROCESSING TOOL (18447543)
- 1.12 STRUCTURES AND METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE (18446392)
- 1.13 DEPOSITION SYSTEM AND METHOD (18447911)
- 1.14 Apparatus and Method for Use with a Substrate Chamber (18447493)
- 1.15 APPARATUS FOR STORING AND TRANSPORTING SEMICONDUCTOR ELEMENTS, AND METHOD OF MAKING THE SAME (18231763)
- 1.16 WAFER DRYING SYSTEM (18446858)
- 1.17 TEMPERATURE SENSOR CIRCUITS AND CONTROL CIRCUITS AND METHOD FOR TEMPERATURE SENSOR CIRCUITS (18150772)
- 1.18 TEMPERATURE SENSING BASED ON METAL RAILS WITH DIFFERENT THERMAL-RESISTANCE COEFFICIENTS (18170401)
- 1.19 CAPACITOR-BASED TEMPERATURE-SENSING DEVICE (18232329)
- 1.20 ON-LINE ANALYSIS SYSTEM AND METHOD FOR SPECIALTY GASSES (17752730)
- 1.21 IN-SITU APPARATUS FOR DETECTING ABNORMALITY IN PROCESS TUBE (18361777)
- 1.22 INTEGRATED BIOLOGICAL SENSING PLATFORM (18232318)
- 1.23 On-Chip Heater (18232719)
- 1.24 STRUCTURE AND PROCESS FOR PHOTONIC PACKAGES (18366758)
- 1.25 PACKAGED DEVICE WITH OPTICAL PATHWAY (18447560)
- 1.26 METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE (18362983)
- 1.27 FIBER TO CHIP COUPLER AND METHOD OF MAKING THE SAME (18448032)
- 1.28 METHOD OF MAKING PHOTONIC DEVICE (18448046)
- 1.29 METHOD OF USING FIBER TO CHIP COUPLER AND METHOD OF MAKING (18448095)
- 1.30 METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING OPTICAL THROUGH VIA AND METHOD OF USING (18358790)
- 1.31 STRUCTURES AND PROCESS FLOW FOR INTEGRATED PHOTONIC-ELECTRIC IC PACKAGE BY USING POLYMER WAVEGUIDE (18232317)
- 1.32 Thermo-Electric Cooler for Dissipating Heat of Optical Engine (17896249)
- 1.33 PELLICLE FOR AN EUV LITHOGRAPHY MASK AND A METHOD OF MANUFACTURING THEREOF (18232674)
- 1.34 EUV Lithography Mask With A Porous Reflective Multilayer Structure (18366136)
- 1.35 PHOTOMASK ASSEMBLY AND METHOD OF FORMING THE SAME (18362046)
- 1.36 SUB-RESOLUTION ASSIST FEATURES (18447425)
- 1.37 PHOTORESIST COMPOSITION AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE (18232264)
- 1.38 PHOTORESIST MATERIALS AND ASSOCIATED METHODS (18447568)
- 1.39 PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN (18232225)
- 1.40 Polymer Layer in Semiconductor Device and Method of Manufacture (18446562)
- 1.41 PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE (18232220)
- 1.42 UNDERLAYER COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE (18232774)
- 1.43 PHOTORESIST UNDER-LAYER AND METHOD OF FORMING PHOTORESIST PATTERN (18232717)
- 1.44 SYSTEM AND METHOD FOR SUPPLYING AND DISPENSING BUBBLE-FREE PHOTOLITHOGRAPHY CHEMICAL SOLUTIONS (18365529)
- 1.45 APPARATUS, SYSTEM AND METHOD (18447104)
- 1.46 PHOTORESIST WITH POLAR-ACID-LABILE-GROUP (18447441)
- 1.47 METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEMICONDUCTOR (18358904)
- 1.48 SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION (18446870)
- 1.49 OPTIMIZED MASK STITCHING (18231070)
- 1.50 OPTICAL PROXIMITY CORRECTION AND PHOTOMASKS (18361879)
- 1.51 ENHANCING LITHOGRAPHY OPERATION FOR MANUFACTURING SEMICONDUCTOR DEVICES (18232745)
- 1.52 MODULE VESSEL WITH SCRUBBER GUTTERS SIZED TO PREVENT OVERFLOW (18447361)
- 1.53 SEMICONDUCTOR WAFER COOLING (18362037)
- 1.54 MEMORY ADDRESS PROTECTION CIRCUIT AND METHOD OF OPERATING SAME (18355222)
- 1.55 FAULT DIAGNOSTICS (18303219)
- 1.56 METHOD AND SYSTEM FOR SEMICONDUCTOR WAFER DEFECT REVIEW (18447170)
- 1.57 INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME (17821559)
- 1.58 METHOD FOR CHIP INTEGRATION (17828648)
- 1.59 SEMICONDUCTOR DEVICE (18361815)
- 1.60 ANTI-FUSE ARRAY (18446684)
- 1.61 INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME (18446771)
- 1.62 METHOD OF GENERATING NETLIST INCLUDING PROXIMITY-EFFECT-INDUCER (PEI) PARAMETERS (18447964)
- 1.63 SILICON PHOTONICS SYSTEM (18155980)
- 1.64 INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME (18354377)
- 1.65 TRANSMISSION GATE STRUCTURE (18362195)
- 1.66 DESIGN RULE CHECK VIOLATION PREDICTION SYSTEMS AND METHODS (18446745)
- 1.67 DESIGN RULE CHECK VIOLATION PREDICTION SYSTEMS AND METHODS (18447455)
- 1.68 SYSTEM AND METHOD FOR GENERATING LAYOUT DIAGRAM INCLUDING WIRING ARRANGEMENT (18448143)
- 1.69 METHOD AND APPARATUS FOR DEFECT-TOLERANT MEMORY-BASED ARTIFICIAL NEURAL NETWORK (18231769)
- 1.70 NEUROMORPHIC COMPUTING DEVICE WITH THREE-DIMENSIONAL MEMORY (17824306)
- 1.71 CIRCUITS AND METHODS FOR COMPENSATING A MISMATCH IN A SENSE AMPLIFIER (18232768)
- 1.72 MEMORY DEVICE WITH SOURCE LINE CONTROL (18232542)
- 1.73 Systems and Methods for Controlling Power Management Operations in a Memory Device (18446818)
- 1.74 ARRANGEMENTS OF MEMORY DEVICES AND METHODS OF OPERATING THE MEMORY DEVICES (18446072)
- 1.75 FIRST FIRE OPERATION FOR OVONIC THRESHOLD SWITCH SELECTOR (17826180)
- 1.76 MEMORY DEVICE WITH REDUCED AREA (17752662)
- 1.77 THREE-DIMENSIONAL ONE TIME PROGRAMMABLE MEMORY (18232539)
- 1.78 NON-VOLATILE MEMORY CIRCUIT AND METHOD (18448152)
- 1.79 REPELLENT ELECTRODE FOR ELECTRON REPELLING (18448026)
- 1.80 ATOM PROBE TOMOGRAPHY SPECIMEN PREPARATION (18448014)
- 1.81 FOCUS RING FOR A PLASMA-BASED SEMICONDUCTOR PROCESSING TOOL (18447410)
- 1.82 DEVICE FOR ADJUSTING POSITION OF CHAMBER AND PLASMA PROCESS CHAMBER INCLUDING THE SAME FOR SEMICONDUCTOR MANUFACTURING (18231165)
- 1.83 SYSTEM AND METHOD FOR PARTICLE CONTROL IN MRAM PROCESSING (18231740)
- 1.84 SYSTEM AND METHOD FOR RESIDUAL GAS ANALYSIS (18361767)
- 1.85 SYSTEM AND METHOD FOR RESIDUAL GAS ANALYSIS (18361771)
- 1.86 SEMICONDUCTOR TOOL FOR COPPER DEPOSITION (18447557)
- 1.87 METHOD FOR REDUCING CHARGING OF SEMICONDUCTOR WAFERS (18225576)
- 1.88 INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICES (18359552)
- 1.89 SEMICONDUCTOR DEVICE PRE-CLEANING (17804447)
- 1.90 APPARATUS FOR ELECTRO-CHEMICAL PLATING (18231196)
- 1.91 Forming Low-Stress Silicon Nitride Layer Through Hydrogen Treatment (18358508)
- 1.92 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE (18446953)
- 1.93 PRE-TREATMENT APPARATUS (18188929)
- 1.94 DEVICE AND METHOD FOR HIGH PRESSURE ANNEAL (18365517)
- 1.95 SYSTEM AND METHOD FOR MULTIPLE STEP DIRECTIONAL PATTERNING (18447869)
- 1.96 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES (17829154)
- 1.97 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES (18232758)
- 1.98 EUV PHOTOMASK AND RELATED METHODS (18366397)
- 1.99 Method of Forming a Semiconductor Device by Driving Hydrogen into a Dielectric Layer from Another Dielectric Layer (18358609)
- 1.100 SURFACE OXIDATION CONTROL OF METAL GATES USING CAPPING LAYER (18230712)
- 1.101 AMBIENT CONTROLLED TWO-STEP THERMAL TREATMENT FOR SPIN-ON COATING LAYER PLANARIZATION (18446416)
- 1.102 Plasma-Assisted Etching Of Metal Oxides (18447943)
- 1.103 METHODS FOR FORMING POLYCRYSTALLINE CHANNEL ON DIELECTRIC FILMS WITH CONTROLLED GRAIN BOUNDARIES (18446415)
- 1.104 METHOD FOR IMPROVED POLYSILICON ETCH DIMENSIONAL CONTROL (18447810)
- 1.105 NITRIDE-CONTAINING STI LINER FOR SIGE CHANNEL (18446652)
- 1.106 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE (18447389)
- 1.107 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE (18447409)
- 1.108 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING (18447443)
- 1.109 STACKED SEMICONDUCTOR DEVICES AND METHODS OF FORMING SAME (18447460)
- 1.110 Semiconductor Package and Method of Forming Thereof (18447428)
- 1.111 CHEMICAL DISPENSING SYSTEM (18447353)
- 1.112 UNDER BOAT SUPPORT WITH ELECTROSTATIC DISCHARGE STRUCTURE (18162538)
- 1.113 SYSTEMS AND METHODS FOR AIR FLOW OPTIMIZATION IN ENVIRONMENT FOR SEMICONDUCTOR DEVICE (18358517)
- 1.114 SEMICONDUCTOR PROCESSING METHOD AND APPARATUS (18447519)
- 1.115 SYSTEM AND METHOD FOR RING FRAME CLEANING AND INSPECTION (18231751)
- 1.116 SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF (18446549)
- 1.117 ETCH METHOD FOR INTERCONNECT STRUCTURE (18447134)
- 1.118 LOCAL INTERCONNECT (18447549)
- 1.119 SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP AND METHODS OF FORMING THE SAME (18230338)
- 1.120 FINFET STRUCTURE WITH CONTROLLED AIR GAPS (18360617)
- 1.121 Semiconductor Device with Air Gaps and Method of Fabrication Thereof (18446183)
- 1.122 Integrated Circuit Package and Method (18446521)
- 1.123 Semiconductor Package Including Step Seal Ring and Methods Forming Same (17819341)
- 1.124 Methods of Performing Chemical-Mechanical Polishing Process in Semiconductor Devices (18359486)
- 1.125 IMPROVED CONTACT RESISTANCE BETWEEN VIA AND CONDUCTIVE LINE (18447084)
- 1.126 Contact Structure For Semiconductor Device (18232718)
- 1.127 SOURCE/DRAIN CONTACT FORMATION METHODS AND DEVICES (18361770)
- 1.128 METHODS OF FORMING SEMICONDUCTOR DEVICE STRUCTURES (17825307)
- 1.129 METHOD FOR FORMING A CONTACT PLUG BY BOTTOM-UP METAL GROWTH (17825678)
- 1.130 GATE CONTACT STRUCTURE (18446326)
- 1.131 METHOD OF FORMING CONTACT METAL (18360587)
- 1.132 SEMICONDUCTOR PACKAGE AND METHOD COMPRISING FORMATION OF REDISTRIBUTION STRUCTURE AND INTERCONNECTING DIE (18446748)
- 1.133 METAL GATE PROCESS AND RELATED STRUCTURE (17804146)
- 1.134 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE (18446728)
- 1.135 METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A DUMMY SECTION (18360814)
- 1.136 FinFETs With Epitaxy Regions Having Mixed Wavy and Non-Wavy Portions (18361354)
- 1.137 Semiconductor Device With Isolation Structures (18232171)
- 1.138 Semiconductor Device and Method of Manufacture (18363945)
- 1.139 Local Gate Height Tuning by CMP and Dummy Gate Design (18365405)
- 1.140 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE (18361501)
- 1.141 MULTI-LAYERED INSULATING FILM STACK (18363439)
- 1.142 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF (18447125)
- 1.143 Self-Aligned Structure For Semiconductor Devices (18447922)
- 1.144 SEMICONDUCTOR DEVICE STRUCTURE WITH SOURCE/DRAIN STRUCTURE AND METHOD FOR FORMING THE SAME (17824249)
- 1.145 Dual Channel Gate All Around Transistor Device and Fabrication Methods Thereof (18366562)
- 1.146 REPLACEMENT GATE PROCESS FOR SEMICONDUCTOR DEVICES (18359747)
- 1.147 HIGH-K DIELECTRIC MATERIALS WITH DIPOLE LAYER (18447239)
- 1.148 METHOD FOR FORMING SEMICONDUCTOR STRUCTURE (17824263)
- 1.149 MANUFACTURING PROCESS WITH ATOMIC LEVEL INSPECTION (18359206)
- 1.150 DEPOSITION SYSTEM AND METHOD (18361729)
- 1.151 SYSTEMS AND METHODS OF TESTING MEMORY DEVICES (18232518)
- 1.152 SEMICONDUCTOR PACKAGE INCLUDING TEST LINE STRUCTURE (18232520)
- 1.153 SEMICONDUCTOR DEVICE AND METHOD (18446591)
- 1.154 Package and Method for Forming the Same (17828691)
- 1.155 SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME (18447416)
- 1.156 MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE (18363742)
- 1.157 STACKED SEMICONDUCTOR DEVICE INCLUDING A COOLING STRUCTURE (18446076)
- 1.158 SEMICONDUCTOR DEVICE HAVING A THERMAL CONTACT AND METHOD OF MAKING (18447927)
- 1.159 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (17827992)
- 1.160 INVERTED TRAPEZOIDAL HEAT DISSIPATING SOLDER STRUCTURE AND METHOD OF MAKING THE SAME (17829243)
- 1.161 VIA CONNECTION STRUCTURE HAVING MULTIPLE VIA TO VIA CONNECTIONS (17825336)
- 1.162 Through-Circuit Vias In Interconnect Structures (18232200)
- 1.163 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (18361917)
- 1.164 PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME (18446146)
- 1.165 Semiconductor Device Having Backside Interconnect Structure on Through Substrate Via (18447871)
- 1.166 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (18359864)
- 1.167 Semiconductor Device and Method of Manufacture (18446006)
- 1.168 SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH (18232523)
- 1.169 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (18363766)
- 1.170 Semiconductor Devices Including Decoupling Capacitors (18446648)
- 1.171 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF (18446873)
- 1.172 BACK-END-OF-LINE PASSIVE DEVICE STRUCTURE (18447722)
- 1.173 SEMICONDUCTOR DEVICES WITH REDUCED EFFECT OF CAPACITIVE COUPLING (17825698)
- 1.174 SOURCE/DRAIN ISOLATION STRUCTURE, LAYOUT, AND METHOD (17752704)
- 1.175 Functional Component Within Interconnect Structure of Semiconductor Device and Method of Forming Same (18366771)
- 1.176 CONDUCTIVE RAIL STRUCTURE FOR SEMICONDUCTOR DEVICES (18447664)
- 1.177 DIAGONAL VIA STRUCTURE (18448125)
- 1.178 DUAL-MODE WIRELESS CHARGING DEVICE (18232312)
- 1.179 SEMICONDUCTOR DEVICE INCLUDING BACK SIDE POWER SUPPLY CIRCUIT (18232306)
- 1.180 ADVANCED NODE INTERCONNECT ROUTING METHODOLOGY (18446025)
- 1.181 Semiconductor Structures And Methods Of Forming The Same (18446113)
- 1.182 FIRST METAL STRUCTURE, LAYOUT, AND METHOD (17752737)
- 1.183 Semiconductor Devices Including Backside Power Via and Methods of Forming the Same (17819679)
- 1.184 POWER RAIL AND SIGNAL LINE ARRANGEMENT IN INTEGRATED CIRCUITS HAVING STACKED TRANSISTORS (18361666)
- 1.185 METHOD OF MANUFACTURING INTEGRATED CIRCUIT (18447572)
- 1.186 CELL STRUCTURE WITH INTERMEDIATE METAL LAYERS FOR POWER SUPPLIES (18448005)
- 1.187 METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING BURIED CONDUCTIVE FINGERS (18448028)
- 1.188 Liner-Free Conductive Structures With Anchor Points (18232722)
- 1.189 GRAPHENE LAYER FOR REDUCED CONTACT RESISTANCE (18359383)
- 1.190 INTEGRATED CHIP WITH GRAPHENE BASED INTERCONNECT (18360012)
- 1.191 INTERCONNECT STRUCTURE INCLUDING CHARGED DIELECTRIC LAYERS (17825345)
- 1.192 SEMICONDUCTOR DEVICE INCLUDING INTERCONNECTS WITH LOWER CONTACT RESISTANCE (17825741)
- 1.193 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (18446753)
- 1.194 DUAL-SIDED ROUTING IN 3D SIP STRUCTURE (18447769)
- 1.195 SEMICONDUCTOR PACKAGE DEVICE AND SEMICONDUCTOR WIRING SUBSTRATE THEREOF (17823063)
- 1.196 SEMICONDUCTOR PACKAGE CROSSTALK REDUCTION (17824353)
- 1.197 Semiconductor Devices With Backside Power Distribution Network And Frontside Through Silicon Via (18232713)
- 1.198 SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME (18230999)
- 1.199 SEMICONDCUTOR PACKAGES AND METHODS OF FORMING THEREOF (17881128)
- 1.200 Antenna Apparatus and Method (18366282)
- 1.201 POLYIMIDE PROFILE CONTROL (18446834)
- 1.202 BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING THE SAME (18446028)
- 1.203 INTEGRATED CIRCUIT PACKAGE AND METHOD (18365362)
- 1.204 SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE (18446732)
- 1.205 INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME (17664689)
- 1.206 Storage Layers For Wafer Bonding (18447968)
- 1.207 System and Method for Bonding Semiconductor Devices (18359416)
- 1.208 SEMICONDUCTOR STRUCTURE WITH INTEGRATED PASSIVE DEVICE HAVING OPPOSED SOLDER BUMPS (17824330)
- 1.209 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (18361953)
- 1.210 System Formed Through Package-In-Package Formation (18362649)
- 1.211 Semiconductor Devices and Methods of Manufacturing (18446291)
- 1.212 Integrated Circuit Packages and Methods of Forming the Same (17828310)
- 1.213 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING STAGGERED GATE-STUB-SIZE PROFILE AND SYSTEM FOR SAME (18447979)
- 1.214 Stacked Semiconductor Device and Method (18359578)
- 1.215 SEMICONDUCTOR DEVICE (18362030)
- 1.216 INTEGRATED CIRCUIT WITH BACKSIDE TRENCH FOR METAL GATE DEFINITION (18447881)
- 1.217 Profile Control Of Gate Structures In Semiconductor Devices (18232181)
- 1.218 Semiconductor Device and Method (18359492)
- 1.219 FIN END ISOLATION STRUCTURE FOR SEMICONDUCTOR DEVICES (18360007)
- 1.220 Semiconductor Devices Having Gate Dielectric Layers of Varying Thicknesses and Methods of Forming the Same (18360166)
- 1.221 Backside Power Rail And Methods Of Forming The Same (18360895)
- 1.222 SEMICONDUCTOR DEVICE STRUCTURE WITH AIR GAP AND METHOD FOR FORMING THE SAME (17826604)
- 1.223 SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME (18229682)
- 1.224 Multi-Gate Device Integration with Separated Fin-Like Field Effect Transistor Cells and Gate-All-Around Transistor Cells (18360118)
- 1.225 SEMICONDUCTOR DEVICES WITH DIELECTRIC FINS AND METHOD FOR FORMING THE SAME (18361704)
- 1.226 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (18362862)
- 1.227 SEMICONDUCTOR DEVICE AND METHOD (18365391)
- 1.228 SEMICONDUCTOR STRUCTURE WITH SELF-ALIGNED BACKSIDE POWER RAIL (18366004)
- 1.229 INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME (17828981)
- 1.230 INTEGRATED CIRCUIT WITH ACTIVE REGION JOGS (18362868)
- 1.231 LOW-COST SEMICONDUCTOR-ON-INSULATOR (SOI) STRUCTURE (18366831)
- 1.232 METAL GRID STRUCTURE TO IMPROVE IMAGE SENSOR PERFORMANCE (18360214)
- 1.233 IMAGE SENSOR WITH A HIGH ABSORPTION LAYER (18364662)
- 1.234 PIXEL SENSOR INCLUDING A TRANSFER FINFET (18447340)
- 1.235 EMBEDDED LIGHT SHIELD STRUCTURE FOR CMOS IMAGE SENSOR (18364667)
- 1.236 IMAGE SENSOR WITH PASSIVATION LAYER FOR DARK CURRENT REDUCTION (18446572)
- 1.237 METHOD FOR FORMING LIGHT PIPE STRUCTURE WITH HIGH QUANTUM EFFICIENCY (18360966)
- 1.238 OPTICAL BIOSENSOR DEVICE WITH OPTICAL SIGNAL ENHANCEMENT STRUCTURE (17824183)
- 1.239 IMAGE SENSOR DEVICE (18362866)
- 1.240 BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR (18364682)
- 1.241 DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR (18364734)
- 1.242 Anchor Structures And Methods For Uniform Wafer Planarization And Bonding (18232751)
- 1.243 SYSTEMS AND METHODS FOR SHIELDED INDUCTIVE DEVICES (18232332)
- 1.244 INDUCTIVE DEVICE (18447482)
- 1.245 Resistor Structure (18358557)
- 1.246 A MULTI-LAYERED RESISTOR WITH A TIGHT TEMPERATURE COEFFICIENT OF RESISTANCE TOLERANCE (18366156)
- 1.247 HIGH DENSITY METAL INSULATOR METAL CAPACITOR (18231754)
- 1.248 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17824436)
- 1.249 SUPER JUNCTION STRUCTURE (18448013)
- 1.250 NOVEL SOI DEVICE STRUCTURE FOR ROBUST ISOLATION (18232545)
- 1.251 SOURCE/DRAIN SPACER WITH AIR GAP IN SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME (18366210)
- 1.252 SEMICONDUCTOR DEVICE WITH CORNER ISOLATION PROTECTION AND METHODS OF FORMING THE SAME (18446665)
- 1.253 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME (17824329)
- 1.254 SEMICONDUCTOR DEVICE AND METHOD (18359695)
- 1.255 GALLIUM NITRIDE DRAIN STRUCTURES AND METHODS OF FORMING THE SAME (17804751)
- 1.256 EPITAXIAL SOURCE/DRAIN STRUCTURE WITH HIGH DOPANT CONCENTRATION (17824915)
- 1.257 INTEGRATION OF LOW AND HIGH VOLTAGE DEVICES ON SUBSTRATE (18363077)
- 1.258 SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATION THEREOF (17752211)
- 1.259 Semiconductor Gate-All-Around Device (18360080)
- 1.260 SILICON-GERMANIUM FINS AND METHODS OF PROCESSING THE SAME IN FIELD-EFFECT TRANSISTORS (18447149)
- 1.261 PROCESS AND STRUCTURE FOR SOURCE/DRAIN CONTACTS (18361262)
- 1.262 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE (18447053)
- 1.263 SEMICONDUCTOR DEVICE AND METHOD (18447212)
- 1.264 SEMICONDUCTOR STRUCTURE WITH WRAPAROUND BACKSIDE AMORPHOUS LAYER (18446864)
- 1.265 SEMICONDUCTOR DEVICES WITH BACKSIDE VIA AND METHODS THEREOF (18360085)
- 1.266 SEMICONDUCTOR DEVICE INTERCONNECTS AND METHODS OF FORMATION (18447344)
- 1.267 CONTACT PLUG STRUCTURE OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME (18366469)
- 1.268 NOVEL STRUCTURE FOR METAL GATE ELECTRODE AND METHOD OF FABRICATION (18446567)
- 1.269 Interconnect Features With Sharp Corners and Method Forming Same (18366352)
- 1.270 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES (17752461)
- 1.271 NANO TRANSISTORS WITH SOURCE/DRAIN HAVING SIDE CONTACTS TO 2-D MATERIAL (18365995)
- 1.272 MULTIGATE DEVICE WITH AIR GAP SPACER AND BACKSIDE RAIL CONTACT AND METHOD OF FABRICATING THEREOF (18446151)
- 1.273 SEMICONDUCTOR DEVICE INCLUDING GRAPHENE BARRIER AND METHOD OF FORMING THE SAME (17825411)
- 1.274 SOURCE/DRAIN SILICIDE FOR MULTIGATE DEVICE PERFORMANCE AND METHOD OF FABRICATING THEREOF (18447183)
- 1.275 SCHOTTKY DIODE AND METHOD OF FABRICATION THEREOF (17804125)
- 1.276 Spacer Structures for Nano-Sheet-Based Devices (18446733)
- 1.277 PARTIAL METAL GRAIN SIZE CONTROL TO IMPROVE CMP LOADING EFFECT (18447685)
- 1.278 Gate Spacers In Semiconductor Devices (18232191)
- 1.279 METHODS OF FORMING GATE STRUCTURES WITH UNIFORM GATE LENGTH (18446958)
- 1.280 Semiconductor Device with Air-Spacer (18446190)
- 1.281 3D CAPACITOR AND METHOD OF MANUFACTURING SAME (18366596)
- 1.282 GATE PROFILE MODULATION FOR SEMICONDUCTOR DEVICE (17824690)
- 1.283 SELF-ALIGNED INNER SPACER ON GATE-ALL-AROUND STRUCTURE AND METHODS OF FORMING THE SAME (18359597)
- 1.284 TRANSISTOR ISOLATION STRUCTURES (18446674)
- 1.285 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THEREOF (18446632)
- 1.286 CIRCUIT DEVICES WITH GATE SEALS (18447467)
- 1.287 TRANSISTOR SPACER STRUCTURES (18447680)
- 1.288 Optimized Proximity Profile for Strained Source/Drain Feature and Method of Fabricating Thereof (18446998)
- 1.289 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17826174)
- 1.290 Channel Structures For Semiconductor Devices (18232159)
- 1.291 Controlling Fin-Thinning Through Feedback (18361540)
- 1.292 Liner for A Bi-Layer Gate Helmet and the Fabrication Thereof (18365315)
- 1.293 Nanowire Stack GAA Device with Inner Spacer and Methods for Producing the Same (18366297)
- 1.294 STRUCTURE FOR REDUCING SOURCE/DRAIN CONTACT RESISTANCE AT WAFER BACKSIDE (18366370)
- 1.295 SEMICONDUCTOR DEVICE AND METHOD (18446905)
- 1.296 Isolation Structures Of Semiconductor Devices (18447953)
- 1.297 EPITAXIAL STRUCTURES FOR FIN-LIKE FIELD EFFECT TRANSISTORS (18359542)
- 1.298 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE (18232289)
- 1.299 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF (18232544)
- 1.300 SYSTEM AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES (18446738)
- 1.301 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE (18447489)
- 1.302 Method of Gap Filling for Semiconductor Device (18447618)
- 1.303 GATED METAL-INSULATOR-SEMICONDUCTOR (MIS) TUNNEL DIODE HAVING NEGATIVE TRANSCONDUCTANCE (18361758)
- 1.304 INTEGRATION OF P-CHANNEL AND N-CHANNEL E-FET III-V DEVICES WITH OPTIMIZATION OF DEVICE PERFORMANCE (18364679)
- 1.305 FERROELECTRIC FIELD EFFECT TRANSISTOR AND METHODS OF FORMING THE SAME (17827755)
- 1.306 SEMICONDUCTOR DEVICE AND METHOD (18447153)
- 1.307 DEVICES WITH STRAINED ISOLATION FEATURES (18446960)
- 1.308 SOURCE/DRAIN FEATURES WITH IMPROVED STRAIN PROPERTIES (18447483)
- 1.309 SPACER STRUCTURES FOR SEMICONDUCTOR DEVICES (18227712)
- 1.310 METHOD OF FABRICATING A SOURCE/DRAIN RECESS IN A SEMICONDUCTOR DEVICE (18446539)
- 1.311 SEMICONDUCTOR DEVICE WITH SELF-ALIGNED WAVY CONTACT PROFILE AND METHOD OF FORMING THE SAME (18447855)
- 1.312 HIGH-VOLTAGE SEMICONDUCTOR DEVICES AND METHODS OF FORMATION (17804438)
- 1.313 Ferroelectric Semiconductor Device and Method (18447453)
- 1.314 ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME IN FIELD-EFFECT TRANSISTORS (18446664)
- 1.315 SEMICONDUCTOR DEVICE HAVING ISOLATION STRUCTURE TO REDUCE CURRENT LEAKAGE (17824669)
- 1.316 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME (17825516)
- 1.317 Semiconductor Device With Fish Bone Structure And Methods Of Forming The Same (18359280)
- 1.318 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME (18359690)
- 1.319 SEMICONDUCTOR DEVICE AND METHOD (18446918)
- 1.320 METHOD OF MAKING DECOUPLING CAPACITOR (18447194)
- 1.321 SEMICONDUCTOR DEVICE INCLUDING DEEP TRENCH CAPACITORS AND VIA CONTACTS (17827251)
- 1.322 DECOUPLING FINFET CAPACITORS (18358464)
- 1.323 VOLTAGE AMPLIFIER BASED ON CASCADED CHARGE PUMP BOOSTING (18446031)
- 1.324 CLOCK GATING CIRCUIT AND METHOD OF OPERATING THE SAME (18362916)
- 1.325 DATA RETENTION CIRCUIT AND METHOD (18363192)
- 1.326 Flip Flop Circuit (18366981)
- 1.327 SYSTEM AND SEMICONDUCTOR DEVICE THEREIN (17828834)
- 1.328 POST-DRIVER WITH LOW VOLTAGE OPERATION AND ELECTROSTATIC DISCHARGE PROTECTION (17828581)
- 1.329 Semiconductor Device Including a Level Shifter and Method of Mitigating a Delay Between Input and Output Signals (18446849)
- 1.330 Semiconductor Device Including a Level Shifter and Method of Mitigating a Delay Between Input and Output Signals (18447372)
- 1.331 Systems and Methods for Phase Locked Loop Realignment With Skew Cancellation (18446881)
- 1.332 Programmable Regulator Voltage Controlled Ring Oscillator (18366742)
- 1.333 Circuits and Methods for a Noise Shaping Analog To Digital Converter (18361949)
- 1.334 RADIO FREQUENCY SWITCH (18231772)
- 1.335 METHOD OF USING INTEGRATED TRANSMITTER AND RECEIVER FRONT END MODULE (18361816)
- 1.336 METHOD AND APPARATUS FOR LOGIC CELL-BASED PUF GENERATORS (18232336)
- 1.337 EUV LIGHT SOURCE AND APPARATUS FOR LITHOGRAPHY (18231017)
- 1.338 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (17826225)
- 1.339 IC INCLUDING STANDARD CELLS AND SRAM CELLS (18361185)
- 1.340 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF (18446094)
- 1.341 STATIC RANDOM ACCESS MEMORY WITH PRE-CHARGE CIRCUIT (18446546)
- 1.342 MULTI-LAYER HIGH-K GATE DIELECTRIC STRUCTURE (18446593)
- 1.343 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17828123)
- 1.344 MEMORY DEVICES AND METHODS FOR OPERATING THE SAME (17752580)
- 1.345 MEMORY DEVICE WITH IMPROVED ANTI-FUSE READ CURRENT (18447638)
- 1.346 SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF (18361249)
- 1.347 Polysilicon Removal In Word Line Contact Region Of Memory Devices (18447965)
- 1.348 MEMORY DEVICE AND MANUFACTURING METHOD THEREOF (18446582)
- 1.349 FERROELECTRIC-BASED MEMORY DEVICE AND METHOD OF FORMING THE SAME (18181229)
- 1.350 MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF (18361548)
- 1.351 THREE-DIMENSIONAL MEMORY DEVICE AND METHOD (18366740)
- 1.352 THREE-DIMENSIONAL MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF (18446894)
- 1.353 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME (18358966)
- 1.354 Memory Array and Methods of Forming Same (18365068)
- 1.355 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE (18447495)
- 1.356 MEMORY CELL ISOLATION (17826100)
- 1.357 EMBEDDED BACKSIDE MEMORY ON A FIELD EFFECT TRANSISTOR (18446557)
- 1.358 Memory Device and Methods of Forming Same (18446586)
- 1.359 METHOD OF FORMING SEMICONDUCTOR MEMORY DEVICE (17825440)
- 1.360 METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE (18448100)
- 1.361 SELF-ALIGNED ENCAPSULATION HARD MASK TO SEPARATE PHYSICALLY UNDER-ETCHED MTJ CELLS TO REDUCE CONDUCTIVE RE-DEPOSITION (18232027)
- 1.362 Metal/Dielectric/Metal Hybrid Hard Mask To Define Ultra-Large Height Top Electrode For Sub 60nm MRAM Devices (18361677)
- 1.363 SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FORMING THE SAME (18361832)
- 1.364 MRAM Fabrication and Device (18447383)
- 1.365 MEMORY DEVICE AND METHOD OF FABRICATING THE SAME (17827998)
- 1.366 MAGNETIC MEMORY DEVICE AND MANUFACTURING METHOD THEREOF (17900892)
- 1.367 MEMORY DEVICE AND FABRICATION METHOD THEREOF (18446703)
- 1.368 SIDEWALL SPACER STRUCTURE FOR MEMORY CELL (18364697)
- 1.369 MAGNETIC TUNNEL JUNCTION STRUCTURES WITH PROTECTION OUTER LAYERS (18446398)
- 1.370 STRUCTURE AND METHOD FOR MRAM DEVICES (18446563)
- 1.371 MAGNETIC TUNNELING JUNCTION WITH SYNTHETIC FREE LAYER FOR SOT-MRAM (18447912)
- 1.372 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE (18447232)
- 1.373 MEMORY DEVICE STRUCTURE WITH DATA STORAGE ELEMENT (18358685)
- 1.374 METHODS OF FORMING MEMORY DEVICES (18363751)
Patent applications for Taiwan Semiconductor Manufacturing Company, Ltd. on November 30th, 2023
PARTICLE REMOVER AND METHOD (18448963)
Main Inventor
Wen-Hao Cheng
TRANSDUCER DEVICE AND METHOD OF MANUFACTURE (17752558)
Main Inventor
Chi-Yuan Shih
DEVICE FOR FORMING CONDUCTIVE POWDER (18447161)
Main Inventor
You-Hua CHOU
POLISHING METROLOGY (17898163)
Main Inventor
Chih Hung CHEN
CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD (18446842)
Main Inventor
Chun-Hsi Huang
SYSTEM AND METHOD FOR REMOVING DEBRIS DURING CHEMICAL MECHANICAL PLANARIZATION (18447211)
Main Inventor
Chun-Wei HSU
MICROELECTROMECHANICAL SYSTEMS DEVICE HAVING A MECHANICALLY ROBUST ANTI-STICTION/OUTGASSING STRUCTURE (18364702)
Main Inventor
Kuei-Sung Chang
MEMS MICROPHONE AND MEMS ACCELEROMETER ON A SINGLE SUBSTRATE (18446741)
Main Inventor
Chun-Wen Cheng
WIRE-BOND DAMPER FOR SHOCK ABSORPTION (18446740)
Main Inventor
Tsung-Lin Hsieh
DIELECTRIC PROTECTION LAYER CONFIGURED TO INCREASE PERFORMANCE OF MEMS DEVICE (17825225)
Main Inventor
Wen-Chuan Tai
SHUTTER DISC FOR A SEMICONDUCTOR PROCESSING TOOL (18447543)
Main Inventor
Yi-Lin WANG
STRUCTURES AND METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE (18446392)
Main Inventor
Ming-Yi SHEN
DEPOSITION SYSTEM AND METHOD (18447911)
Main Inventor
Wen-Hao CHENG
Apparatus and Method for Use with a Substrate Chamber (18447493)
Main Inventor
Li-Ting Wang
APPARATUS FOR STORING AND TRANSPORTING SEMICONDUCTOR ELEMENTS, AND METHOD OF MAKING THE SAME (18231763)
Main Inventor
Tse-Lun HSU
WAFER DRYING SYSTEM (18446858)
Main Inventor
Wei-Chun Hsu
TEMPERATURE SENSOR CIRCUITS AND CONTROL CIRCUITS AND METHOD FOR TEMPERATURE SENSOR CIRCUITS (18150772)
Main Inventor
Jaw-Juinn HORNG
TEMPERATURE SENSING BASED ON METAL RAILS WITH DIFFERENT THERMAL-RESISTANCE COEFFICIENTS (18170401)
Main Inventor
Szu-Lin Liu
CAPACITOR-BASED TEMPERATURE-SENSING DEVICE (18232329)
Main Inventor
Shih-Lien Linus LU
ON-LINE ANALYSIS SYSTEM AND METHOD FOR SPECIALTY GASSES (17752730)
Main Inventor
Chiang Jeh CHEN
IN-SITU APPARATUS FOR DETECTING ABNORMALITY IN PROCESS TUBE (18361777)
Main Inventor
Yu-Jen YANG
INTEGRATED BIOLOGICAL SENSING PLATFORM (18232318)
Main Inventor
Tsung-Tsun CHEN
On-Chip Heater (18232719)
Main Inventor
Tung-Tsun Chen
STRUCTURE AND PROCESS FOR PHOTONIC PACKAGES (18366758)
Main Inventor
Chen-Hua Yu
PACKAGED DEVICE WITH OPTICAL PATHWAY (18447560)
Main Inventor
Hsien-Wei Chen
METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE (18362983)
Main Inventor
Feng-Wei KUO
FIBER TO CHIP COUPLER AND METHOD OF MAKING THE SAME (18448032)
Main Inventor
Chen-Hao HUANG
METHOD OF MAKING PHOTONIC DEVICE (18448046)
Main Inventor
Chien-Ying WU
METHOD OF USING FIBER TO CHIP COUPLER AND METHOD OF MAKING (18448095)
Main Inventor
Sui-Ying HSU
METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING OPTICAL THROUGH VIA AND METHOD OF USING (18358790)
Main Inventor
Yu-Hao CHEN
STRUCTURES AND PROCESS FLOW FOR INTEGRATED PHOTONIC-ELECTRIC IC PACKAGE BY USING POLYMER WAVEGUIDE (18232317)
Main Inventor
Yu-Hao CHEN
Thermo-Electric Cooler for Dissipating Heat of Optical Engine (17896249)
Main Inventor
Hsing-Kuo Hsia
PELLICLE FOR AN EUV LITHOGRAPHY MASK AND A METHOD OF MANUFACTURING THEREOF (18232674)
Main Inventor
Yun-Yue LIN
EUV Lithography Mask With A Porous Reflective Multilayer Structure (18366136)
Main Inventor
Chih-Tsung Shih
PHOTOMASK ASSEMBLY AND METHOD OF FORMING THE SAME (18362046)
Main Inventor
Kuo-Hao LEE
SUB-RESOLUTION ASSIST FEATURES (18447425)
Main Inventor
Kenji Yamazoe
PHOTORESIST COMPOSITION AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE (18232264)
Main Inventor
An-Ren ZI
PHOTORESIST MATERIALS AND ASSOCIATED METHODS (18447568)
Main Inventor
Ming-Hui WENG
PHOTORESIST COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN (18232225)
Main Inventor
An-Ren Zi
Polymer Layer in Semiconductor Device and Method of Manufacture (18446562)
Main Inventor
Sih-Hao Liao
PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE (18232220)
Main Inventor
Yen-Hao CHEN
UNDERLAYER COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE (18232774)
Main Inventor
Ming-Hui WENG
PHOTORESIST UNDER-LAYER AND METHOD OF FORMING PHOTORESIST PATTERN (18232717)
Main Inventor
An-Ren ZI
SYSTEM AND METHOD FOR SUPPLYING AND DISPENSING BUBBLE-FREE PHOTOLITHOGRAPHY CHEMICAL SOLUTIONS (18365529)
Main Inventor
Wen-Zhan Zhou
APPARATUS, SYSTEM AND METHOD (18447104)
Main Inventor
Po-Han Wang
PHOTORESIST WITH POLAR-ACID-LABILE-GROUP (18447441)
Main Inventor
An-Ren Zi
METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEMICONDUCTOR (18358904)
Main Inventor
Hung-Jui Kuo
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION (18446870)
Main Inventor
Kai-Chieh CHANG
OPTIMIZED MASK STITCHING (18231070)
Main Inventor
Sagar TRIVEDI
OPTICAL PROXIMITY CORRECTION AND PHOTOMASKS (18361879)
Main Inventor
Dong-Yo Jheng
ENHANCING LITHOGRAPHY OPERATION FOR MANUFACTURING SEMICONDUCTOR DEVICES (18232745)
Main Inventor
Yih-Chen SU
MODULE VESSEL WITH SCRUBBER GUTTERS SIZED TO PREVENT OVERFLOW (18447361)
Main Inventor
Chun-Kai CHANG
SEMICONDUCTOR WAFER COOLING (18362037)
Main Inventor
Yung-Yao LEE
MEMORY ADDRESS PROTECTION CIRCUIT AND METHOD OF OPERATING SAME (18355222)
Main Inventor
Saman M. I. ADHAM
FAULT DIAGNOSTICS (18303219)
Main Inventor
Sandeep Kumar Goel
METHOD AND SYSTEM FOR SEMICONDUCTOR WAFER DEFECT REVIEW (18447170)
Main Inventor
Chung-Pin CHOU
INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME (17821559)
Main Inventor
Johnny Chiahao LI
METHOD FOR CHIP INTEGRATION (17828648)
Main Inventor
Yung Feng Chang
SEMICONDUCTOR DEVICE (18361815)
Main Inventor
Yu-Jen CHEN
ANTI-FUSE ARRAY (18446684)
Main Inventor
Meng-Sheng CHANG
INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME (18446771)
Main Inventor
Yu-Jung CHANG
METHOD OF GENERATING NETLIST INCLUDING PROXIMITY-EFFECT-INDUCER (PEI) PARAMETERS (18447964)
Main Inventor
Yen-Pin CHEN
SILICON PHOTONICS SYSTEM (18155980)
Main Inventor
Feng-Wei KUO
INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME (18354377)
Main Inventor
John LIN
TRANSMISSION GATE STRUCTURE (18362195)
Main Inventor
Shao-Lun CHIEN
DESIGN RULE CHECK VIOLATION PREDICTION SYSTEMS AND METHODS (18446745)
Main Inventor
Yi-Lin CHUANG
DESIGN RULE CHECK VIOLATION PREDICTION SYSTEMS AND METHODS (18447455)
Main Inventor
Yi-Lin CHUANG
SYSTEM AND METHOD FOR GENERATING LAYOUT DIAGRAM INCLUDING WIRING ARRANGEMENT (18448143)
Main Inventor
Fong-Yuan CHANG
METHOD AND APPARATUS FOR DEFECT-TOLERANT MEMORY-BASED ARTIFICIAL NEURAL NETWORK (18231769)
Main Inventor
Win-San KHWA
NEUROMORPHIC COMPUTING DEVICE WITH THREE-DIMENSIONAL MEMORY (17824306)
Main Inventor
Chieh Lee
CIRCUITS AND METHODS FOR COMPENSATING A MISMATCH IN A SENSE AMPLIFIER (18232768)
Main Inventor
Ku-Feng LIN
MEMORY DEVICE WITH SOURCE LINE CONTROL (18232542)
Main Inventor
Perng-Fei Yuh
Systems and Methods for Controlling Power Management Operations in a Memory Device (18446818)
Main Inventor
Sanjeev Kumar Jain
ARRANGEMENTS OF MEMORY DEVICES AND METHODS OF OPERATING THE MEMORY DEVICES (18446072)
Main Inventor
Chien-Yuan Chen
FIRST FIRE OPERATION FOR OVONIC THRESHOLD SWITCH SELECTOR (17826180)
Main Inventor
Elia Ambrosi
MEMORY DEVICE WITH REDUCED AREA (17752662)
Main Inventor
Chun-Ying Lee
THREE-DIMENSIONAL ONE TIME PROGRAMMABLE MEMORY (18232539)
Main Inventor
Meng-Sheng Chang
NON-VOLATILE MEMORY CIRCUIT AND METHOD (18448152)
Main Inventor
Gu-Huan LI
REPELLENT ELECTRODE FOR ELECTRON REPELLING (18448026)
Main Inventor
Ching-Heng YEN
ATOM PROBE TOMOGRAPHY SPECIMEN PREPARATION (18448014)
Main Inventor
Shih-Wei HUNG
FOCUS RING FOR A PLASMA-BASED SEMICONDUCTOR PROCESSING TOOL (18447410)
Main Inventor
Sheng-Chieh HUANG
DEVICE FOR ADJUSTING POSITION OF CHAMBER AND PLASMA PROCESS CHAMBER INCLUDING THE SAME FOR SEMICONDUCTOR MANUFACTURING (18231165)
Main Inventor
Ming Che CHEN
SYSTEM AND METHOD FOR PARTICLE CONTROL IN MRAM PROCESSING (18231740)
Main Inventor
Tsung-Han Kuo
SYSTEM AND METHOD FOR RESIDUAL GAS ANALYSIS (18361767)
Main Inventor
Yen-Liang CHEN
SYSTEM AND METHOD FOR RESIDUAL GAS ANALYSIS (18361771)
Main Inventor
Yen-Liang CHEN
SEMICONDUCTOR TOOL FOR COPPER DEPOSITION (18447557)
Main Inventor
Chia-Hung TSAI
METHOD FOR REDUCING CHARGING OF SEMICONDUCTOR WAFERS (18225576)
Main Inventor
Wei-Lin CHANG
INTERCONNECT STRUCTURE FOR SEMICONDUCTOR DEVICES (18359552)
Main Inventor
Po-Chuan Wang
SEMICONDUCTOR DEVICE PRE-CLEANING (17804447)
Main Inventor
Yi-Hsiang CHAO
APPARATUS FOR ELECTRO-CHEMICAL PLATING (18231196)
Main Inventor
Kuo-Lung HOU
Forming Low-Stress Silicon Nitride Layer Through Hydrogen Treatment (18358508)
Main Inventor
Wei-Che Hsieh
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE (18446953)
Main Inventor
Chun-Yen Peng
PRE-TREATMENT APPARATUS (18188929)
Main Inventor
Chun-Hsiang WANG
DEVICE AND METHOD FOR HIGH PRESSURE ANNEAL (18365517)
Main Inventor
Szu-Ying Chen
SYSTEM AND METHOD FOR MULTIPLE STEP DIRECTIONAL PATTERNING (18447869)
Main Inventor
Chih-Kai YANG
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES (17829154)
Main Inventor
Po-Han LIN
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES (18232758)
Main Inventor
Chun-Wei LIAO
EUV PHOTOMASK AND RELATED METHODS (18366397)
Main Inventor
Chi-Hung LIAO
Method of Forming a Semiconductor Device by Driving Hydrogen into a Dielectric Layer from Another Dielectric Layer (18358609)
Main Inventor
Hongfa Luan
SURFACE OXIDATION CONTROL OF METAL GATES USING CAPPING LAYER (18230712)
Main Inventor
Pei-Yu Chou
AMBIENT CONTROLLED TWO-STEP THERMAL TREATMENT FOR SPIN-ON COATING LAYER PLANARIZATION (18446416)
Main Inventor
Chen-Fong TSAI
Plasma-Assisted Etching Of Metal Oxides (18447943)
Main Inventor
Chansyun David YANG
METHODS FOR FORMING POLYCRYSTALLINE CHANNEL ON DIELECTRIC FILMS WITH CONTROLLED GRAIN BOUNDARIES (18446415)
Main Inventor
Cheng-Hsien WU
METHOD FOR IMPROVED POLYSILICON ETCH DIMENSIONAL CONTROL (18447810)
Main Inventor
Yun-Jui HE
NITRIDE-CONTAINING STI LINER FOR SIGE CHANNEL (18446652)
Main Inventor
Ya-Wen Chiu
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE (18447389)
Main Inventor
Wei-Chih Chen
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE (18447409)
Main Inventor
Wei-Yu Chen
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING (18447443)
Main Inventor
Po-Chen Lai
STACKED SEMICONDUCTOR DEVICES AND METHODS OF FORMING SAME (18447460)
Main Inventor
Hsien-Wei Chen
Semiconductor Package and Method of Forming Thereof (18447428)
Main Inventor
Jiun Yi Wu
CHEMICAL DISPENSING SYSTEM (18447353)
Main Inventor
Ming-Chieh HSU
UNDER BOAT SUPPORT WITH ELECTROSTATIC DISCHARGE STRUCTURE (18162538)
Main Inventor
Ying-Hao WANG
SYSTEMS AND METHODS FOR AIR FLOW OPTIMIZATION IN ENVIRONMENT FOR SEMICONDUCTOR DEVICE (18358517)
Main Inventor
Yi-Fam Shiu
SEMICONDUCTOR PROCESSING METHOD AND APPARATUS (18447519)
Main Inventor
Shuang-Shiuan DENG
SYSTEM AND METHOD FOR RING FRAME CLEANING AND INSPECTION (18231751)
Main Inventor
Chien-Fa Lee
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF (18446549)
Main Inventor
Soon-Kang HUANG
ETCH METHOD FOR INTERCONNECT STRUCTURE (18447134)
Main Inventor
Chun-Cheng Chou
LOCAL INTERCONNECT (18447549)
Main Inventor
Cheng-Hsien Wu
SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP AND METHODS OF FORMING THE SAME (18230338)
Main Inventor
Ting-Ya LO
FINFET STRUCTURE WITH CONTROLLED AIR GAPS (18360617)
Main Inventor
Wen-Che Tsai
Semiconductor Device with Air Gaps and Method of Fabrication Thereof (18446183)
Main Inventor
Chia-Hao Chang
Integrated Circuit Package and Method (18446521)
Main Inventor
Ting-Chen Tseng
Semiconductor Package Including Step Seal Ring and Methods Forming Same (17819341)
Main Inventor
Sheng-Han Tsai
Methods of Performing Chemical-Mechanical Polishing Process in Semiconductor Devices (18359486)
Main Inventor
Shih-Kang Fu
IMPROVED CONTACT RESISTANCE BETWEEN VIA AND CONDUCTIVE LINE (18447084)
Main Inventor
Chun-Yuan Chen
Contact Structure For Semiconductor Device (18232718)
Main Inventor
Hsu-Kai CHANG
SOURCE/DRAIN CONTACT FORMATION METHODS AND DEVICES (18361770)
Main Inventor
Cheng-Wei Chang
METHODS OF FORMING SEMICONDUCTOR DEVICE STRUCTURES (17825307)
Main Inventor
Yu-Chen KO
METHOD FOR FORMING A CONTACT PLUG BY BOTTOM-UP METAL GROWTH (17825678)
Main Inventor
Chung-Liang CHENG
GATE CONTACT STRUCTURE (18446326)
Main Inventor
Cheng-Chi Chuang
METHOD OF FORMING CONTACT METAL (18360587)
Main Inventor
Chun-Hsien Huang
SEMICONDUCTOR PACKAGE AND METHOD COMPRISING FORMATION OF REDISTRIBUTION STRUCTURE AND INTERCONNECTING DIE (18446748)
Main Inventor
Jiun Yi Wu
METAL GATE PROCESS AND RELATED STRUCTURE (17804146)
Main Inventor
Chih-Lun LU
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE (18446728)
Main Inventor
Chan Syun David Yang
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A DUMMY SECTION (18360814)
Main Inventor
Osamu KOIKE
FinFETs With Epitaxy Regions Having Mixed Wavy and Non-Wavy Portions (18361354)
Main Inventor
Shahaji B. More
Semiconductor Device With Isolation Structures (18232171)
Main Inventor
Pei-Wei Lee
Semiconductor Device and Method of Manufacture (18363945)
Main Inventor
Chia-Ching Lee
Local Gate Height Tuning by CMP and Dummy Gate Design (18365405)
Main Inventor
Ming-Chang Wen
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE (18361501)
Main Inventor
Chung-Ting KO
MULTI-LAYERED INSULATING FILM STACK (18363439)
Main Inventor
Chieh-Ping Wang
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF (18447125)
Main Inventor
Shu-Uei Jang
Self-Aligned Structure For Semiconductor Devices (18447922)
Main Inventor
Kuo-Cheng CHIANG
SEMICONDUCTOR DEVICE STRUCTURE WITH SOURCE/DRAIN STRUCTURE AND METHOD FOR FORMING THE SAME (17824249)
Main Inventor
Ta-Chun LIN
Dual Channel Gate All Around Transistor Device and Fabrication Methods Thereof (18366562)
Main Inventor
Wei-Sheng Yun
REPLACEMENT GATE PROCESS FOR SEMICONDUCTOR DEVICES (18359747)
Main Inventor
Yu-Jen Shen
HIGH-K DIELECTRIC MATERIALS WITH DIPOLE LAYER (18447239)
Main Inventor
Huiching Chang
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE (17824263)
Main Inventor
Chih-Hsin Yang
MANUFACTURING PROCESS WITH ATOMIC LEVEL INSPECTION (18359206)
Main Inventor
I-Che Lee
DEPOSITION SYSTEM AND METHOD (18361729)
Main Inventor
Wen-Hao CHENG
SYSTEMS AND METHODS OF TESTING MEMORY DEVICES (18232518)
Main Inventor
Meng-Han Lin
SEMICONDUCTOR PACKAGE INCLUDING TEST LINE STRUCTURE (18232520)
Main Inventor
Tsung-Yang Hsieh
SEMICONDUCTOR DEVICE AND METHOD (18446591)
Main Inventor
Yin-Jie Pan
Package and Method for Forming the Same (17828691)
Main Inventor
Yu-Sheng Lin
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME (18447416)
Main Inventor
Ting-Chen Tseng
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE (18363742)
Main Inventor
Meng-Liang Lin
STACKED SEMICONDUCTOR DEVICE INCLUDING A COOLING STRUCTURE (18446076)
Main Inventor
Jen-Yuan CHANG
SEMICONDUCTOR DEVICE HAVING A THERMAL CONTACT AND METHOD OF MAKING (18447927)
Main Inventor
Jian WU
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (17827992)
Main Inventor
Wei-Ming Wang
INVERTED TRAPEZOIDAL HEAT DISSIPATING SOLDER STRUCTURE AND METHOD OF MAKING THE SAME (17829243)
Main Inventor
Chang-Jung HSUEH
VIA CONNECTION STRUCTURE HAVING MULTIPLE VIA TO VIA CONNECTIONS (17825336)
Main Inventor
Ting-Yu Yeh
Through-Circuit Vias In Interconnect Structures (18232200)
Main Inventor
Jian-Hong LIN
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (18361917)
Main Inventor
Jen-Chun Liao
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME (18446146)
Main Inventor
Chen-Hua Yu
Semiconductor Device Having Backside Interconnect Structure on Through Substrate Via (18447871)
Main Inventor
Yung-Chi Lin
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (18359864)
Main Inventor
Ting-Yu Yeh
Semiconductor Device and Method of Manufacture (18446006)
Main Inventor
Jiun Yi Wu
SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH (18232523)
Main Inventor
Yueh-Ting Lin
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (18363766)
Main Inventor
Chien-Hung Chen
Semiconductor Devices Including Decoupling Capacitors (18446648)
Main Inventor
Yu-Xuan Huang
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF (18446873)
Main Inventor
Chung-Ting Lu
BACK-END-OF-LINE PASSIVE DEVICE STRUCTURE (18447722)
Main Inventor
Tsung-Chieh Hsiao
SEMICONDUCTOR DEVICES WITH REDUCED EFFECT OF CAPACITIVE COUPLING (17825698)
Main Inventor
Chih-Yu Lu
SOURCE/DRAIN ISOLATION STRUCTURE, LAYOUT, AND METHOD (17752704)
Main Inventor
Chi-Yu LU
Functional Component Within Interconnect Structure of Semiconductor Device and Method of Forming Same (18366771)
Main Inventor
Hsien-Wei Chen
CONDUCTIVE RAIL STRUCTURE FOR SEMICONDUCTOR DEVICES (18447664)
Main Inventor
Yi-Bo LIAO
DIAGONAL VIA STRUCTURE (18448125)
Main Inventor
Shih-Wei PENG
DUAL-MODE WIRELESS CHARGING DEVICE (18232312)
Main Inventor
Shih-Wei LIANG
SEMICONDUCTOR DEVICE INCLUDING BACK SIDE POWER SUPPLY CIRCUIT (18232306)
Main Inventor
Gerben DOORNBOS
ADVANCED NODE INTERCONNECT ROUTING METHODOLOGY (18446025)
Main Inventor
Shih-Wei Peng
Semiconductor Structures And Methods Of Forming The Same (18446113)
Main Inventor
Lin-Yu Huang
FIRST METAL STRUCTURE, LAYOUT, AND METHOD (17752737)
Main Inventor
Chi-Yu LU
Semiconductor Devices Including Backside Power Via and Methods of Forming the Same (17819679)
Main Inventor
Po-Hsien Cheng
POWER RAIL AND SIGNAL LINE ARRANGEMENT IN INTEGRATED CIRCUITS HAVING STACKED TRANSISTORS (18361666)
Main Inventor
Chih-Liang CHEN
METHOD OF MANUFACTURING INTEGRATED CIRCUIT (18447572)
Main Inventor
Chih-Yu LAI
CELL STRUCTURE WITH INTERMEDIATE METAL LAYERS FOR POWER SUPPLIES (18448005)
Main Inventor
Li-Chun Tien
METHOD OF MAKING SEMICONDUCTOR DEVICE INCLUDING BURIED CONDUCTIVE FINGERS (18448028)
Main Inventor
Chih-Liang CHEN
Liner-Free Conductive Structures With Anchor Points (18232722)
Main Inventor
Hsu-Kai Chang
GRAPHENE LAYER FOR REDUCED CONTACT RESISTANCE (18359383)
Main Inventor
Shin-Yi Yang
INTEGRATED CHIP WITH GRAPHENE BASED INTERCONNECT (18360012)
Main Inventor
Shin-Yi Yang
INTERCONNECT STRUCTURE INCLUDING CHARGED DIELECTRIC LAYERS (17825345)
Main Inventor
Chien Hung Liu
SEMICONDUCTOR DEVICE INCLUDING INTERCONNECTS WITH LOWER CONTACT RESISTANCE (17825741)
Main Inventor
Hsi-Wen TIEN
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (18446753)
Main Inventor
Hung-Ming CHEN
DUAL-SIDED ROUTING IN 3D SIP STRUCTURE (18447769)
Main Inventor
Po-Hao Tsai
SEMICONDUCTOR PACKAGE DEVICE AND SEMICONDUCTOR WIRING SUBSTRATE THEREOF (17823063)
Main Inventor
Sheng-Fan YANG
SEMICONDUCTOR PACKAGE CROSSTALK REDUCTION (17824353)
Main Inventor
Shu-Chun Yang
Semiconductor Devices With Backside Power Distribution Network And Frontside Through Silicon Via (18232713)
Main Inventor
Kam-Tou SIO
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME (18230999)
Main Inventor
Cheng-Chieh HSIEH
SEMICONDCUTOR PACKAGES AND METHODS OF FORMING THEREOF (17881128)
Main Inventor
Sung-Yueh Wu
Antenna Apparatus and Method (18366282)
Main Inventor
Feng-Wei Kuo
POLYIMIDE PROFILE CONTROL (18446834)
Main Inventor
Chen-Chi HUANG
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING THE SAME (18446028)
Main Inventor
Chen-Yu Tsai
INTEGRATED CIRCUIT PACKAGE AND METHOD (18365362)
Main Inventor
Wen-Chih Chiou
SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE (18446732)
Main Inventor
Kuan-Yu Huang
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME (17664689)
Main Inventor
Yu-Sheng Lin
Storage Layers For Wafer Bonding (18447968)
Main Inventor
De-Yang CHIOU
System and Method for Bonding Semiconductor Devices (18359416)
Main Inventor
Kai-Tai Chang
SEMICONDUCTOR STRUCTURE WITH INTEGRATED PASSIVE DEVICE HAVING OPPOSED SOLDER BUMPS (17824330)
Main Inventor
Fong-yuan Chang
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (18361953)
Main Inventor
Chung-Liang CHENG
System Formed Through Package-In-Package Formation (18362649)
Main Inventor
Chen-Hua Yu
Semiconductor Devices and Methods of Manufacturing (18446291)
Main Inventor
Chang-Yi Yang
Integrated Circuit Packages and Methods of Forming the Same (17828310)
Main Inventor
Pei-Haw Tsao
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING STAGGERED GATE-STUB-SIZE PROFILE AND SYSTEM FOR SAME (18447979)
Main Inventor
Te-Hsin CHIU
Stacked Semiconductor Device and Method (18359578)
Main Inventor
Min-Feng Kao
SEMICONDUCTOR DEVICE (18362030)
Main Inventor
Chung-Te LIN
INTEGRATED CIRCUIT WITH BACKSIDE TRENCH FOR METAL GATE DEFINITION (18447881)
Main Inventor
Kuo-Cheng CHIANG
Profile Control Of Gate Structures In Semiconductor Devices (18232181)
Main Inventor
Kai-Chi WU
Semiconductor Device and Method (18359492)
Main Inventor
Jen-Chih Hsueh
FIN END ISOLATION STRUCTURE FOR SEMICONDUCTOR DEVICES (18360007)
Main Inventor
JHON JHY Liaw
Semiconductor Devices Having Gate Dielectric Layers of Varying Thicknesses and Methods of Forming the Same (18360166)
Main Inventor
Ta-Chun Lin
Backside Power Rail And Methods Of Forming The Same (18360895)
Main Inventor
Huan-Chieh Su
SEMICONDUCTOR DEVICE STRUCTURE WITH AIR GAP AND METHOD FOR FORMING THE SAME (17826604)
Main Inventor
Yi-Ruei JHAN
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME (18229682)
Main Inventor
Jui-Chien HUANG
Multi-Gate Device Integration with Separated Fin-Like Field Effect Transistor Cells and Gate-All-Around Transistor Cells (18360118)
Main Inventor
Jhon Jhy Liaw
SEMICONDUCTOR DEVICES WITH DIELECTRIC FINS AND METHOD FOR FORMING THE SAME (18361704)
Main Inventor
Kuan-Ting Pan
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (18362862)
Main Inventor
Yu-Lien HUANG
SEMICONDUCTOR DEVICE AND METHOD (18365391)
Main Inventor
Shahaji B. More
SEMICONDUCTOR STRUCTURE WITH SELF-ALIGNED BACKSIDE POWER RAIL (18366004)
Main Inventor
Kuo-Cheng Chiang
INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME (17828981)
Main Inventor
Chin-Wei HSU
INTEGRATED CIRCUIT WITH ACTIVE REGION JOGS (18362868)
Main Inventor
Tian-Yu XIE
LOW-COST SEMICONDUCTOR-ON-INSULATOR (SOI) STRUCTURE (18366831)
Main Inventor
Harry-Hak-Lay Chuang
METAL GRID STRUCTURE TO IMPROVE IMAGE SENSOR PERFORMANCE (18360214)
Main Inventor
Ming Chyi Liu
IMAGE SENSOR WITH A HIGH ABSORPTION LAYER (18364662)
Main Inventor
Chien-Chang Huang
PIXEL SENSOR INCLUDING A TRANSFER FINFET (18447340)
Main Inventor
Feng-Chien HSIEH
EMBEDDED LIGHT SHIELD STRUCTURE FOR CMOS IMAGE SENSOR (18364667)
Main Inventor
Shih-Hsun Hsu
IMAGE SENSOR WITH PASSIVATION LAYER FOR DARK CURRENT REDUCTION (18446572)
Main Inventor
Hsiang-Lin Chen
METHOD FOR FORMING LIGHT PIPE STRUCTURE WITH HIGH QUANTUM EFFICIENCY (18360966)
Main Inventor
Tsun-Kai Tsao
OPTICAL BIOSENSOR DEVICE WITH OPTICAL SIGNAL ENHANCEMENT STRUCTURE (17824183)
Main Inventor
Yi-Hsien Chang
IMAGE SENSOR DEVICE (18362866)
Main Inventor
Yun-Wei CHENG
BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR (18364682)
Main Inventor
Cheng-Ta Wu
DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR (18364734)
Main Inventor
Feng-Chien HSIEH
Anchor Structures And Methods For Uniform Wafer Planarization And Bonding (18232751)
Main Inventor
Chia-Yu Wei
SYSTEMS AND METHODS FOR SHIELDED INDUCTIVE DEVICES (18232332)
Main Inventor
Feng Wei KUO
INDUCTIVE DEVICE (18447482)
Main Inventor
Wei-Yu CHOU
Resistor Structure (18358557)
Main Inventor
Chih-Fan Huang
A MULTI-LAYERED RESISTOR WITH A TIGHT TEMPERATURE COEFFICIENT OF RESISTANCE TOLERANCE (18366156)
Main Inventor
Szu-Hsien Lo
HIGH DENSITY METAL INSULATOR METAL CAPACITOR (18231754)
Main Inventor
Wei Kai SHIH
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17824436)
Main Inventor
Tsung-Chieh HSIAO
SUPER JUNCTION STRUCTURE (18448013)
Main Inventor
Shuai ZHANG
NOVEL SOI DEVICE STRUCTURE FOR ROBUST ISOLATION (18232545)
Main Inventor
Lin-Chen Lu
SOURCE/DRAIN SPACER WITH AIR GAP IN SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME (18366210)
Main Inventor
Ko-Cheng Liu
SEMICONDUCTOR DEVICE WITH CORNER ISOLATION PROTECTION AND METHODS OF FORMING THE SAME (18446665)
Main Inventor
Bwo-Ning Chen
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME (17824329)
Main Inventor
Lin-Yu HUANG
SEMICONDUCTOR DEVICE AND METHOD (18359695)
Main Inventor
Hsin-Yi Lee
GALLIUM NITRIDE DRAIN STRUCTURES AND METHODS OF FORMING THE SAME (17804751)
Main Inventor
Chi-Ming CHEN
EPITAXIAL SOURCE/DRAIN STRUCTURE WITH HIGH DOPANT CONCENTRATION (17824915)
Main Inventor
Chih Sheng Huang
INTEGRATION OF LOW AND HIGH VOLTAGE DEVICES ON SUBSTRATE (18363077)
Main Inventor
Hsin Fu Lin
SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATION THEREOF (17752211)
Main Inventor
Jui-Lin CHANG
Semiconductor Gate-All-Around Device (18360080)
Main Inventor
Jhon Jhy Liaw
SILICON-GERMANIUM FINS AND METHODS OF PROCESSING THE SAME IN FIELD-EFFECT TRANSISTORS (18447149)
Main Inventor
Yu-Shan Lu
PROCESS AND STRUCTURE FOR SOURCE/DRAIN CONTACTS (18361262)
Main Inventor
Meng-Huan Jao
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE (18447053)
Main Inventor
Chun-Hsien Huang
SEMICONDUCTOR DEVICE AND METHOD (18447212)
Main Inventor
Po-Chuan Wang
SEMICONDUCTOR STRUCTURE WITH WRAPAROUND BACKSIDE AMORPHOUS LAYER (18446864)
Main Inventor
Shih-Chuan Chiu
SEMICONDUCTOR DEVICES WITH BACKSIDE VIA AND METHODS THEREOF (18360085)
Main Inventor
Po-Yu Huang
SEMICONDUCTOR DEVICE INTERCONNECTS AND METHODS OF FORMATION (18447344)
Main Inventor
Te-Chih HSIUNG
CONTACT PLUG STRUCTURE OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME (18366469)
Main Inventor
Pei-Yu Chou
NOVEL STRUCTURE FOR METAL GATE ELECTRODE AND METHOD OF FABRICATION (18446567)
Main Inventor
Ru-Shang Hsiao
Interconnect Features With Sharp Corners and Method Forming Same (18366352)
Main Inventor
Tze-Liang Lee
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES (17752461)
Main Inventor
Yung-Hsiang CHAN
NANO TRANSISTORS WITH SOURCE/DRAIN HAVING SIDE CONTACTS TO 2-D MATERIAL (18365995)
Main Inventor
Chao-Ching Cheng
MULTIGATE DEVICE WITH AIR GAP SPACER AND BACKSIDE RAIL CONTACT AND METHOD OF FABRICATING THEREOF (18446151)
Main Inventor
Guan-Lin CHEN
SEMICONDUCTOR DEVICE INCLUDING GRAPHENE BARRIER AND METHOD OF FORMING THE SAME (17825411)
Main Inventor
Shin-Yi YANG
SOURCE/DRAIN SILICIDE FOR MULTIGATE DEVICE PERFORMANCE AND METHOD OF FABRICATING THEREOF (18447183)
Main Inventor
Chih-Ching Wang
SCHOTTKY DIODE AND METHOD OF FABRICATION THEREOF (17804125)
Main Inventor
Wen-Shun LO
Spacer Structures for Nano-Sheet-Based Devices (18446733)
Main Inventor
Shih-Cheng Chen
PARTIAL METAL GRAIN SIZE CONTROL TO IMPROVE CMP LOADING EFFECT (18447685)
Main Inventor
Anhao CHENG
Gate Spacers In Semiconductor Devices (18232191)
Main Inventor
Wei-Liang LU
METHODS OF FORMING GATE STRUCTURES WITH UNIFORM GATE LENGTH (18446958)
Main Inventor
Shahaji B. More
Semiconductor Device with Air-Spacer (18446190)
Main Inventor
Wei-Yang Lee
3D CAPACITOR AND METHOD OF MANUFACTURING SAME (18366596)
Main Inventor
Chi-Wen LIU
GATE PROFILE MODULATION FOR SEMICONDUCTOR DEVICE (17824690)
Main Inventor
Tien-Shun CHANG
SELF-ALIGNED INNER SPACER ON GATE-ALL-AROUND STRUCTURE AND METHODS OF FORMING THE SAME (18359597)
Main Inventor
Tsungyu Hung
TRANSISTOR ISOLATION STRUCTURES (18446674)
Main Inventor
Mrunal Abhijith KHADERBAD
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THEREOF (18446632)
Main Inventor
Chih-Hsuan Lin
CIRCUIT DEVICES WITH GATE SEALS (18447467)
Main Inventor
Sheng-Chou Lai
TRANSISTOR SPACER STRUCTURES (18447680)
Main Inventor
Chansyun David YANG
Optimized Proximity Profile for Strained Source/Drain Feature and Method of Fabricating Thereof (18446998)
Main Inventor
Chun-An Lin
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17826174)
Main Inventor
Wang-Chun Huang
Channel Structures For Semiconductor Devices (18232159)
Main Inventor
Ding-Kang SHIH
Controlling Fin-Thinning Through Feedback (18361540)
Main Inventor
Tsu-Hui Su
Liner for A Bi-Layer Gate Helmet and the Fabrication Thereof (18365315)
Main Inventor
Huan-Chieh Su
Nanowire Stack GAA Device with Inner Spacer and Methods for Producing the Same (18366297)
Main Inventor
Tzu-Chung Wang
STRUCTURE FOR REDUCING SOURCE/DRAIN CONTACT RESISTANCE AT WAFER BACKSIDE (18366370)
Main Inventor
Huan-Chieh Su
SEMICONDUCTOR DEVICE AND METHOD (18446905)
Main Inventor
Shahaji B. More
Isolation Structures Of Semiconductor Devices (18447953)
Main Inventor
Jia-Chuan You
EPITAXIAL STRUCTURES FOR FIN-LIKE FIELD EFFECT TRANSISTORS (18359542)
Main Inventor
Chia-Ta Yu
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE (18232289)
Main Inventor
Chia-Chi YU
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF (18232544)
Main Inventor
Shih-Yao LIN
SYSTEM AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES (18446738)
Main Inventor
Chia-Ao Chang
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE (18447489)
Main Inventor
Wei-Chih KAO
Method of Gap Filling for Semiconductor Device (18447618)
Main Inventor
Te-Yang Lai
GATED METAL-INSULATOR-SEMICONDUCTOR (MIS) TUNNEL DIODE HAVING NEGATIVE TRANSCONDUCTANCE (18361758)
Main Inventor
Jenn-Gwo Hwu
INTEGRATION OF P-CHANNEL AND N-CHANNEL E-FET III-V DEVICES WITH OPTIMIZATION OF DEVICE PERFORMANCE (18364679)
Main Inventor
Man-Ho Kwan
FERROELECTRIC FIELD EFFECT TRANSISTOR AND METHODS OF FORMING THE SAME (17827755)
Main Inventor
Gerben Doornbos
SEMICONDUCTOR DEVICE AND METHOD (18447153)
Main Inventor
Bo-Feng Young
DEVICES WITH STRAINED ISOLATION FEATURES (18446960)
Main Inventor
Xusheng Wu
SOURCE/DRAIN FEATURES WITH IMPROVED STRAIN PROPERTIES (18447483)
Main Inventor
Chih-Ching Wang
SPACER STRUCTURES FOR SEMICONDUCTOR DEVICES (18227712)
Main Inventor
Cheng-Yi PENG
METHOD OF FABRICATING A SOURCE/DRAIN RECESS IN A SEMICONDUCTOR DEVICE (18446539)
Main Inventor
Eric PENG
SEMICONDUCTOR DEVICE WITH SELF-ALIGNED WAVY CONTACT PROFILE AND METHOD OF FORMING THE SAME (18447855)
Main Inventor
Chia-Ta Yu
HIGH-VOLTAGE SEMICONDUCTOR DEVICES AND METHODS OF FORMATION (17804438)
Main Inventor
Jhu-Min SONG
Ferroelectric Semiconductor Device and Method (18447453)
Main Inventor
Chia-Cheng Ho
ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME IN FIELD-EFFECT TRANSISTORS (18446664)
Main Inventor
Shi Ning Ju
SEMICONDUCTOR DEVICE HAVING ISOLATION STRUCTURE TO REDUCE CURRENT LEAKAGE (17824669)
Main Inventor
Hung-Yu YEN
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME (17825516)
Main Inventor
Shuen-Shin LIANG
Semiconductor Device With Fish Bone Structure And Methods Of Forming The Same (18359280)
Main Inventor
Chih-Chuan Yang
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME (18359690)
Main Inventor
Marcus Johannes Henricus VAN DAL
SEMICONDUCTOR DEVICE AND METHOD (18446918)
Main Inventor
Chunchieh Wang
METHOD OF MAKING DECOUPLING CAPACITOR (18447194)
Main Inventor
Szu-Lin LIU
SEMICONDUCTOR DEVICE INCLUDING DEEP TRENCH CAPACITORS AND VIA CONTACTS (17827251)
Main Inventor
Po-Chia Lai
DECOUPLING FINFET CAPACITORS (18358464)
Main Inventor
Chung-Hui Chen
VOLTAGE AMPLIFIER BASED ON CASCADED CHARGE PUMP BOOSTING (18446031)
Main Inventor
Chin-Ho Chang
CLOCK GATING CIRCUIT AND METHOD OF OPERATING THE SAME (18362916)
Main Inventor
Seid Hadi RASOULI
DATA RETENTION CIRCUIT AND METHOD (18363192)
Main Inventor
Kai-Chi HUANG
Flip Flop Circuit (18366981)
Main Inventor
Po-Chia Lai
SYSTEM AND SEMICONDUCTOR DEVICE THEREIN (17828834)
Main Inventor
Tsung-Che LU
POST-DRIVER WITH LOW VOLTAGE OPERATION AND ELECTROSTATIC DISCHARGE PROTECTION (17828581)
Main Inventor
Chin-Hua Wen
Semiconductor Device Including a Level Shifter and Method of Mitigating a Delay Between Input and Output Signals (18446849)
Main Inventor
Jerrin Pathrose Vareed
Semiconductor Device Including a Level Shifter and Method of Mitigating a Delay Between Input and Output Signals (18447372)
Main Inventor
Jerrin Pathrose Vareed
Systems and Methods for Phase Locked Loop Realignment With Skew Cancellation (18446881)
Main Inventor
Tsung-Hsien Tsai
Programmable Regulator Voltage Controlled Ring Oscillator (18366742)
Main Inventor
Tsung-Hsien Tsai
Circuits and Methods for a Noise Shaping Analog To Digital Converter (18361949)
Main Inventor
Martin Kinyua
RADIO FREQUENCY SWITCH (18231772)
Main Inventor
Jun-De JIN
METHOD OF USING INTEGRATED TRANSMITTER AND RECEIVER FRONT END MODULE (18361816)
Main Inventor
En-Hsiang YEH
METHOD AND APPARATUS FOR LOGIC CELL-BASED PUF GENERATORS (18232336)
Main Inventor
Shih-Lien Linus LU
EUV LIGHT SOURCE AND APPARATUS FOR LITHOGRAPHY (18231017)
Main Inventor
Shang-Chieh CHIEN
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (17826225)
Main Inventor
Chun-Hung CHEN
IC INCLUDING STANDARD CELLS AND SRAM CELLS (18361185)
Main Inventor
Jhon-Jhy LIAW
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF (18446094)
Main Inventor
Shih-Yao Lin
STATIC RANDOM ACCESS MEMORY WITH PRE-CHARGE CIRCUIT (18446546)
Main Inventor
Po-Sheng WANG
MULTI-LAYER HIGH-K GATE DIELECTRIC STRUCTURE (18446593)
Main Inventor
Chih-Yu Hsu
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (17828123)
Main Inventor
Jhon-Jhy LIAW
MEMORY DEVICES AND METHODS FOR OPERATING THE SAME (17752580)
Main Inventor
Hsiang-Wei Liu
MEMORY DEVICE WITH IMPROVED ANTI-FUSE READ CURRENT (18447638)
Main Inventor
Meng-Sheng CHANG
SEMICONDUCTOR MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF (18361249)
Main Inventor
Meng-Han Lin
Polysilicon Removal In Word Line Contact Region Of Memory Devices (18447965)
Main Inventor
Yen-Jou WU
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Feng-Ching Chu
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Yi-Hsuan Chen
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Meng-Han Lin
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Chia-Yu Ling
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Meng-Han Lin
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Gerben Doornbos
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Yu-Ming Lin
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Meng-Han Lin
MEMORY CELL ISOLATION (17826100)
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Tzu-Yu Chen
EMBEDDED BACKSIDE MEMORY ON A FIELD EFFECT TRANSISTOR (18446557)
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Kuan-Liang Liu
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Chenchen Jacob Wang
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Wei-Chih WEN
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Yu-Hao CHEN
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Yi Yang
Metal/Dielectric/Metal Hybrid Hard Mask To Define Ultra-Large Height Top Electrode For Sub 60nm MRAM Devices (18361677)
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Yi Yang
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Hsiang-Ku Shen
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Jung-Tang Wu
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Yen-Lin Huang
MAGNETIC MEMORY DEVICE AND MANUFACTURING METHOD THEREOF (17900892)
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Ming-Yuan Song
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Jun-Yao CHEN
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Yao-Wen Chang
MAGNETIC TUNNEL JUNCTION STRUCTURES WITH PROTECTION OUTER LAYERS (18446398)
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Sheng-Chang CHEN
STRUCTURE AND METHOD FOR MRAM DEVICES (18446563)
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Tsung-Chieh Hsiao
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Chien-Min Lee
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Hai-Dang TRINH
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Hung-Li Chiang
