Difference between revisions of "Taiwan Semiconductor Manufacturing Co., Ltd. patent applications published on October 5th, 2023"
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==Patent applications for Taiwan Semiconductor Manufacturing Co., Ltd. on October 5th, 2023== | ==Patent applications for Taiwan Semiconductor Manufacturing Co., Ltd. on October 5th, 2023== | ||
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'''Inventor''' | '''Inventor''' | ||
Chen-Hua Yu | Chen-Hua Yu | ||
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===EXTREME ULTRAVIOLET MASK AND METHOD FOR FORMING THE SAME (17744567)=== | ===EXTREME ULTRAVIOLET MASK AND METHOD FOR FORMING THE SAME (17744567)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Yun-Yue LIN | Yun-Yue LIN | ||
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===High-Density Memory Cells and Layouts Thereof (17664465)=== | ===High-Density Memory Cells and Layouts Thereof (17664465)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Jen-Chieh Liu | Jen-Chieh Liu | ||
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===WORK FUNCTION TUNING IN SEMICONDUCTOR DEVICES (17807513)=== | ===WORK FUNCTION TUNING IN SEMICONDUCTOR DEVICES (17807513)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Hsin-Yi LEE | Hsin-Yi LEE | ||
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===Varying Temperature Anneal for Film and Structures Formed Thereby (18332056)=== | ===Varying Temperature Anneal for Film and Structures Formed Thereby (18332056)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Shu Ling Liao | Shu Ling Liao | ||
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===Gate Structure Passivating Species Drive-In Method and Structure Formed Thereby (18330885)=== | ===Gate Structure Passivating Species Drive-In Method and Structure Formed Thereby (18330885)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Hsiao-Kuan Wei | Hsiao-Kuan Wei | ||
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===Semiconductor Device and Methods of Forming the Same (17711885)=== | ===Semiconductor Device and Methods of Forming the Same (17711885)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Bor Chiuan Hsieh | Bor Chiuan Hsieh | ||
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===Integrated Circuit Package and Method of Forming Thereof (18329302)=== | ===Integrated Circuit Package and Method of Forming Thereof (18329302)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Hsien-Wei Chen | Hsien-Wei Chen | ||
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===SYSTEMS AND METHODS FOR AUTOMATED PROCESSING PORTS (18206544)=== | ===SYSTEMS AND METHODS FOR AUTOMATED PROCESSING PORTS (18206544)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Tsung-Sheng KUO | Tsung-Sheng KUO | ||
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===Metal Loss Prevention Using Implantation (18330466)=== | ===Metal Loss Prevention Using Implantation (18330466)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Li-Chieh Wu | Li-Chieh Wu | ||
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===Semiconductor Device and Method of Manufacture (18331387)=== | ===Semiconductor Device and Method of Manufacture (18331387)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Chun-Yen Peng | Chun-Yen Peng | ||
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===Gate Structure of a Semiconductor Device and Method of Forming Same (18314200)=== | ===Gate Structure of a Semiconductor Device and Method of Forming Same (18314200)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Shahaji B. More | Shahaji B. More | ||
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===ETCHING APPARATUS AND METHOD (18328656)=== | ===ETCHING APPARATUS AND METHOD (18328656)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Bo-Ting LIAO | Bo-Ting LIAO | ||
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===High Efficiency Heat Dissipation Using Thermal Interface Material Film (18328387)=== | ===High Efficiency Heat Dissipation Using Thermal Interface Material Film (18328387)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Chih-Hao Chen | Chih-Hao Chen | ||
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===DEVICE WITH BACKSIDE POWER RAIL AND METHOD (17882339)=== | ===DEVICE WITH BACKSIDE POWER RAIL AND METHOD (17882339)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Yun Ju FAN | Yun Ju FAN | ||
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===NON-DMSO STRIPPER FOR ADVANCE PACKAGE METAL PLATING PROCESS (17827415)=== | ===NON-DMSO STRIPPER FOR ADVANCE PACKAGE METAL PLATING PROCESS (17827415)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Tzu-Yang LIN | Tzu-Yang LIN | ||
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===Semiconductor Devices and Methods of Manufacture (17740618)=== | ===Semiconductor Devices and Methods of Manufacture (17740618)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Chen-Yu Tsai | Chen-Yu Tsai | ||
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===PREVENTION OF METAL PAD CORROSION DUE TO EXPOSURE TO HALOGEN (18329128)=== | ===PREVENTION OF METAL PAD CORROSION DUE TO EXPOSURE TO HALOGEN (18329128)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Chih-Fan Huang | Chih-Fan Huang | ||
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===Multi-Bump Connection to Interconnect Structure and Manufacturing Method Thereof (18327252)=== | ===Multi-Bump Connection to Interconnect Structure and Manufacturing Method Thereof (18327252)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Tsung-Yen Lee | Tsung-Yen Lee | ||
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===INTEGRATED CIRCUIT PACKAGES HAVING ADHESION LAYERS FOR THROUGH VIAS (18330616)=== | ===INTEGRATED CIRCUIT PACKAGES HAVING ADHESION LAYERS FOR THROUGH VIAS (18330616)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Hung-Chun Cho | Hung-Chun Cho | ||
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===SEMICONDUCTOR DEVICE AND METHOD HAVING HIGH-KAPPA BONDING LAYER (18151160)=== | ===SEMICONDUCTOR DEVICE AND METHOD HAVING HIGH-KAPPA BONDING LAYER (18151160)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Che Chi SHIH | Che Chi SHIH | ||
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===SEMICONDUCTOR DEVICE AND METHOD (17656935)=== | ===SEMICONDUCTOR DEVICE AND METHOD (17656935)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Kai-Qiang Wen | Kai-Qiang Wen | ||
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===INTEGRATED CIRCUIT (18331011)=== | ===INTEGRATED CIRCUIT (18331011)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Guo-Huei WU | Guo-Huei WU | ||
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===SEMICONDUCTOR DEVICE (18329218)=== | ===SEMICONDUCTOR DEVICE (18329218)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Zong-Jie WU | Zong-Jie WU | ||
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===ISOLATION STRUCTURES IN IMAGE SENSORS (17879556)=== | ===ISOLATION STRUCTURES IN IMAGE SENSORS (17879556)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Cheng-Ying Ho | Cheng-Ying Ho | ||
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===Source/Drain Regions of Semiconductor Device and Methods of Forming the Same (17712965)=== | ===Source/Drain Regions of Semiconductor Device and Methods of Forming the Same (17712965)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Yung-Chun Yang | Yung-Chun Yang | ||
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===Semiconductor Device having Doped Gate Dielectric Layer and Method for Forming the Same (18152601)=== | ===Semiconductor Device having Doped Gate Dielectric Layer and Method for Forming the Same (18152601)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Yao-Teng Chuang | Yao-Teng Chuang | ||
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===SEMICONDUCTOR DEVICE WITH GATE DIELECTRIC FORMED USING SELECTIVE DEPOSITION (18324636)=== | ===SEMICONDUCTOR DEVICE WITH GATE DIELECTRIC FORMED USING SELECTIVE DEPOSITION (18324636)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Tung-Ying LEE | Tung-Ying LEE | ||
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===Gate Capping Structures In Semiconductor Devices (18206831)=== | ===Gate Capping Structures In Semiconductor Devices (18206831)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Chung-Liang CHENG | Chung-Liang CHENG | ||
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===TRANSISTOR GATE STRUCTURES AND METHODS OF FORMING THEREOF (17833348)=== | ===TRANSISTOR GATE STRUCTURES AND METHODS OF FORMING THEREOF (17833348)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Hsin-Yi Lee | Hsin-Yi Lee | ||
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===VOLTAGE SUPPLY SELECTION CIRCUIT (18330492)=== | ===VOLTAGE SUPPLY SELECTION CIRCUIT (18330492)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Chia-Chen KUO | Chia-Chen KUO | ||
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===Phase-Change Memory and Method of Forming Same (18321843)=== | ===Phase-Change Memory and Method of Forming Same (18321843)=== | ||
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'''Inventor''' | '''Inventor''' | ||
Jau-Yi Wu | Jau-Yi Wu | ||
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Revision as of 08:46, 11 October 2023
Contents
- 1 Patent applications for Taiwan Semiconductor Manufacturing Co., Ltd. on October 5th, 2023
- 1.1 INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME (17812530)
- 1.2 EXTREME ULTRAVIOLET MASK AND METHOD FOR FORMING THE SAME (17744567)
- 1.3 High-Density Memory Cells and Layouts Thereof (17664465)
- 1.4 WORK FUNCTION TUNING IN SEMICONDUCTOR DEVICES (17807513)
- 1.5 Varying Temperature Anneal for Film and Structures Formed Thereby (18332056)
- 1.6 Gate Structure Passivating Species Drive-In Method and Structure Formed Thereby (18330885)
- 1.7 Semiconductor Device and Methods of Forming the Same (17711885)
- 1.8 Integrated Circuit Package and Method of Forming Thereof (18329302)
- 1.9 SYSTEMS AND METHODS FOR AUTOMATED PROCESSING PORTS (18206544)
- 1.10 Metal Loss Prevention Using Implantation (18330466)
- 1.11 Semiconductor Device and Method of Manufacture (18331387)
- 1.12 Gate Structure of a Semiconductor Device and Method of Forming Same (18314200)
- 1.13 ETCHING APPARATUS AND METHOD (18328656)
- 1.14 High Efficiency Heat Dissipation Using Thermal Interface Material Film (18328387)
- 1.15 DEVICE WITH BACKSIDE POWER RAIL AND METHOD (17882339)
- 1.16 NON-DMSO STRIPPER FOR ADVANCE PACKAGE METAL PLATING PROCESS (17827415)
- 1.17 Semiconductor Devices and Methods of Manufacture (17740618)
- 1.18 PREVENTION OF METAL PAD CORROSION DUE TO EXPOSURE TO HALOGEN (18329128)
- 1.19 Multi-Bump Connection to Interconnect Structure and Manufacturing Method Thereof (18327252)
- 1.20 INTEGRATED CIRCUIT PACKAGES HAVING ADHESION LAYERS FOR THROUGH VIAS (18330616)
- 1.21 SEMICONDUCTOR DEVICE AND METHOD HAVING HIGH-KAPPA BONDING LAYER (18151160)
- 1.22 SEMICONDUCTOR DEVICE AND METHOD (17656935)
- 1.23 INTEGRATED CIRCUIT (18331011)
- 1.24 SEMICONDUCTOR DEVICE (18329218)
- 1.25 ISOLATION STRUCTURES IN IMAGE SENSORS (17879556)
- 1.26 Source/Drain Regions of Semiconductor Device and Methods of Forming the Same (17712965)
- 1.27 Semiconductor Device having Doped Gate Dielectric Layer and Method for Forming the Same (18152601)
- 1.28 SEMICONDUCTOR DEVICE WITH GATE DIELECTRIC FORMED USING SELECTIVE DEPOSITION (18324636)
- 1.29 Gate Capping Structures In Semiconductor Devices (18206831)
- 1.30 TRANSISTOR GATE STRUCTURES AND METHODS OF FORMING THEREOF (17833348)
- 1.31 VOLTAGE SUPPLY SELECTION CIRCUIT (18330492)
- 1.32 Phase-Change Memory and Method of Forming Same (18321843)
Patent applications for Taiwan Semiconductor Manufacturing Co., Ltd. on October 5th, 2023
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME (17812530)
Inventor Chen-Hua Yu
EXTREME ULTRAVIOLET MASK AND METHOD FOR FORMING THE SAME (17744567)
Inventor Yun-Yue LIN
High-Density Memory Cells and Layouts Thereof (17664465)
Inventor Jen-Chieh Liu
WORK FUNCTION TUNING IN SEMICONDUCTOR DEVICES (17807513)
Inventor Hsin-Yi LEE
Varying Temperature Anneal for Film and Structures Formed Thereby (18332056)
Inventor Shu Ling Liao
Gate Structure Passivating Species Drive-In Method and Structure Formed Thereby (18330885)
Inventor Hsiao-Kuan Wei
Semiconductor Device and Methods of Forming the Same (17711885)
Inventor Bor Chiuan Hsieh
Integrated Circuit Package and Method of Forming Thereof (18329302)
Inventor Hsien-Wei Chen
SYSTEMS AND METHODS FOR AUTOMATED PROCESSING PORTS (18206544)
Inventor Tsung-Sheng KUO
Metal Loss Prevention Using Implantation (18330466)
Inventor Li-Chieh Wu
Semiconductor Device and Method of Manufacture (18331387)
Inventor Chun-Yen Peng
Gate Structure of a Semiconductor Device and Method of Forming Same (18314200)
Inventor Shahaji B. More
ETCHING APPARATUS AND METHOD (18328656)
Inventor Bo-Ting LIAO
High Efficiency Heat Dissipation Using Thermal Interface Material Film (18328387)
Inventor Chih-Hao Chen
DEVICE WITH BACKSIDE POWER RAIL AND METHOD (17882339)
Inventor Yun Ju FAN
NON-DMSO STRIPPER FOR ADVANCE PACKAGE METAL PLATING PROCESS (17827415)
Inventor Tzu-Yang LIN
Semiconductor Devices and Methods of Manufacture (17740618)
Inventor Chen-Yu Tsai
PREVENTION OF METAL PAD CORROSION DUE TO EXPOSURE TO HALOGEN (18329128)
Inventor Chih-Fan Huang
Multi-Bump Connection to Interconnect Structure and Manufacturing Method Thereof (18327252)
Inventor Tsung-Yen Lee
INTEGRATED CIRCUIT PACKAGES HAVING ADHESION LAYERS FOR THROUGH VIAS (18330616)
Inventor Hung-Chun Cho
SEMICONDUCTOR DEVICE AND METHOD HAVING HIGH-KAPPA BONDING LAYER (18151160)
Inventor Che Chi SHIH
SEMICONDUCTOR DEVICE AND METHOD (17656935)
Inventor Kai-Qiang Wen
INTEGRATED CIRCUIT (18331011)
Inventor Guo-Huei WU
SEMICONDUCTOR DEVICE (18329218)
Inventor Zong-Jie WU
ISOLATION STRUCTURES IN IMAGE SENSORS (17879556)
Inventor Cheng-Ying Ho
Source/Drain Regions of Semiconductor Device and Methods of Forming the Same (17712965)
Inventor Yung-Chun Yang
Semiconductor Device having Doped Gate Dielectric Layer and Method for Forming the Same (18152601)
Inventor Yao-Teng Chuang
SEMICONDUCTOR DEVICE WITH GATE DIELECTRIC FORMED USING SELECTIVE DEPOSITION (18324636)
Inventor Tung-Ying LEE
Gate Capping Structures In Semiconductor Devices (18206831)
Inventor Chung-Liang CHENG
TRANSISTOR GATE STRUCTURES AND METHODS OF FORMING THEREOF (17833348)
Inventor Hsin-Yi Lee
VOLTAGE SUPPLY SELECTION CIRCUIT (18330492)
Inventor Chia-Chen KUO
Phase-Change Memory and Method of Forming Same (18321843)
Inventor Jau-Yi Wu