TOKYO ELECTRON LIMITED patent applications published on March 21st, 2024
Contents
- 1 Patent applications for TOKYO ELECTRON LIMITED on March 21st, 2024
- 1.1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD (18255407)
- 1.2 LIQUID RAW MATERIAL SUPPLYING METHOD AND GAS SUPPLY APPARATUS (18244532)
- 1.3 Optical Emission Spectroscopy for Advanced Process Characterization (17948407)
- 1.4 SUBSTRATE TREATMENT APPARATUS AND TREATMENT SOLUTION SUPPLY METHOD (18465420)
- 1.5 SUBSTRATE PROCESSING APPARATUS (18526350)
- 1.6 FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING (18524767)
- 1.7 Substrate Bombardment with Ions having Targeted Mass using Pulsed Bias Phase Control (17945408)
- 1.8 PLASMA MONITORING SYSTEM, PLASMA MONITORING METHOD, AND MONITORING DEVICE (18515220)
- 1.9 Method and Apparatus for In-Situ Dry Development (17950001)
- 1.10 METHODS TO PREVENT SURFACE CHARGE INDUCED CD-DEPENDENT ETCHING OF MATERIAL FORMED WITHIN FEATURES ON A PATTERNED SUBSTRATE (17946609)
- 1.11 SURFACE MODIFICATION TO ACHIEVE SELECTIVE ISOTROPIC ETCH (17945897)
- 1.12 High Aspect Ratio Contact (HARC) Etch (17948768)
- 1.13 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD (18367742)
- 1.14 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS (18519519)
- 1.15 ETCHING CONTROL SYSTEM AND ETCHING CONTROL METHOD (18468928)
- 1.16 ETCHING CONTROL SYSTEM AND ETCHING CONTROL METHOD (18468966)
- 1.17 ETCHING CONTROL DEVICE, ETCHING CONTROL METHOD, AND ETCHING CONTROL SYSTEM (18469673)
- 1.18 HIGH PERFORMANCE 3D COMPACT TRANSISTOR ARCHITECTURE (17945888)
- 1.19 BONDING APPARATUS AND BONDING METHOD (18467071)
Patent applications for TOKYO ELECTRON LIMITED on March 21st, 2024
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD (18255407)
Main Inventor
Yuichi FURUYA
LIQUID RAW MATERIAL SUPPLYING METHOD AND GAS SUPPLY APPARATUS (18244532)
Main Inventor
Hiroaki DEWA
Optical Emission Spectroscopy for Advanced Process Characterization (17948407)
Main Inventor
Sergey Voronin
SUBSTRATE TREATMENT APPARATUS AND TREATMENT SOLUTION SUPPLY METHOD (18465420)
Main Inventor
Makoto OGATA
SUBSTRATE PROCESSING APPARATUS (18526350)
Main Inventor
Kouichi Mizunaga
FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING (18524767)
Main Inventor
Kazuhide HASEBE
Substrate Bombardment with Ions having Targeted Mass using Pulsed Bias Phase Control (17945408)
Main Inventor
Sergey Voronin
PLASMA MONITORING SYSTEM, PLASMA MONITORING METHOD, AND MONITORING DEVICE (18515220)
Main Inventor
Satoru TERUUCHI
Method and Apparatus for In-Situ Dry Development (17950001)
Main Inventor
Steven Grzeskowiak
METHODS TO PREVENT SURFACE CHARGE INDUCED CD-DEPENDENT ETCHING OF MATERIAL FORMED WITHIN FEATURES ON A PATTERNED SUBSTRATE (17946609)
Main Inventor
Shan Hu
SURFACE MODIFICATION TO ACHIEVE SELECTIVE ISOTROPIC ETCH (17945897)
Main Inventor
Jonathan HOLLIN
High Aspect Ratio Contact (HARC) Etch (17948768)
Main Inventor
Pingshan Luan
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD (18367742)
Main Inventor
Shogo FUKUI
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS (18519519)
Main Inventor
Fumihiro KAMIMURA
ETCHING CONTROL SYSTEM AND ETCHING CONTROL METHOD (18468928)
Main Inventor
Toyohisa Tsuruda
ETCHING CONTROL SYSTEM AND ETCHING CONTROL METHOD (18468966)
Main Inventor
Toyohisa Tsuruda
ETCHING CONTROL DEVICE, ETCHING CONTROL METHOD, AND ETCHING CONTROL SYSTEM (18469673)
Main Inventor
Toyohisa Tsuruda
HIGH PERFORMANCE 3D COMPACT TRANSISTOR ARCHITECTURE (17945888)
Main Inventor
H. Jim Fulford
BONDING APPARATUS AND BONDING METHOD (18467071)
Main Inventor
Hideyuki Fukushima
