THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE WITH A BOTTOM DIE LAYER EMPLOYING AN EXTENDED INTERPOSER SUBSTRATE, AND RELATED FABRICATION METHODS: abstract simplified (17655394)

The abstract describes a three-dimensional integrated circuit (3DIC) package that uses an interposer substrate in the bottom die layer. This interposer substrate provides support for the bottom die(s) of the package and is longer in length than the top die. This allows for a larger top die to be bonded in the bottom die layer, providing additional die area. The fabrication process involves bonding the top die to the extended interposer substrate in a top die-to-bottom wafer process.