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| − | '''Summary of the patent applications from TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. on November 30th, 2023'''
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| − | Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) has recently filed several patents related to various aspects of semiconductor device manufacturing and circuit operation. These patents cover methods for forming interconnect structures, operating circuits, manufacturing integrated circuit devices, fabricating semiconductor devices, and creating high-voltage devices. Notable applications include improved optical coupling capabilities, enhanced performance and functionality of high-voltage devices, improved dielectric properties for multilayer structures, and manufacturing methods for CMOS image sensors.
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| − | Summary:
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| − | - TSMC has filed patents for methods of forming interconnect structures over substrates, including memory devices with transistors.
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| − | - They have also filed patents for methods of operating circuits, such as operational amplifiers, sampling switches, holding switches, and combined switches.
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| − | - TSMC's patents also cover methods for manufacturing integrated circuit devices using photonic structures and improved optical coupling capabilities.
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| − | - They have developed a semiconductor device with a metal gate layer, channel, and ferroelectric layer made of a hafnium oxide-based material with different phases.
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| − | - TSMC's patents also include methods for fabricating semiconductor devices, such as forming semiconductor fins, isolation regions, and recesses in substrates.
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| − | - They have developed a high-voltage device with specific structural features and doping configurations to enhance performance and functionality.
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| − | - TSMC's patents also cover multilayer structures with improved dielectric properties for use in electronic devices.
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| − | - They have developed semiconductor structures with capacitor structures and contact structures for improved electrical connections.
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| − | - TSMC's patents also include methods for manufacturing semiconductor structures for CMOS image sensors with improved performance and reliability.
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| − | - They have developed semiconductor structures with fins protruding from substrates and gate electrodes with conductive portions.
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| − | Notable Applications:
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| − | * Improved optical coupling capabilities in integrated circuit devices.
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| − | * Enhanced performance and functionality of high-voltage devices.
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| − | * Improved dielectric properties for multilayer structures in electronic devices.
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| − | * Manufacturing methods for CMOS image sensors with improved performance and reliability.
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| | ==Patent applications for TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. on November 30th, 2023== | | ==Patent applications for TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. on November 30th, 2023== |
