TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. patent applications published on November 30th, 2023

Summary of the patent applications from TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. on November 30th, 2023

Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) has recently filed several patents related to various aspects of semiconductor device manufacturing and circuit operation. These patents cover methods for forming interconnect structures, operating circuits, manufacturing integrated circuit devices, fabricating semiconductor devices, and creating high-voltage devices. Notable applications include improved optical coupling capabilities, enhanced performance and functionality of high-voltage devices, improved dielectric properties for multilayer structures, and manufacturing methods for CMOS image sensors.

Summary:

- TSMC has filed patents for methods of forming interconnect structures over substrates, including memory devices with transistors. - They have also filed patents for methods of operating circuits, such as operational amplifiers, sampling switches, holding switches, and combined switches. - TSMC's patents also cover methods for manufacturing integrated circuit devices using photonic structures and improved optical coupling capabilities. - They have developed a semiconductor device with a metal gate layer, channel, and ferroelectric layer made of a hafnium oxide-based material with different phases. - TSMC's patents also include methods for fabricating semiconductor devices, such as forming semiconductor fins, isolation regions, and recesses in substrates. - They have developed a high-voltage device with specific structural features and doping configurations to enhance performance and functionality. - TSMC's patents also cover multilayer structures with improved dielectric properties for use in electronic devices. - They have developed semiconductor structures with capacitor structures and contact structures for improved electrical connections. - TSMC's patents also include methods for manufacturing semiconductor structures for CMOS image sensors with improved performance and reliability. - They have developed semiconductor structures with fins protruding from substrates and gate electrodes with conductive portions.

Notable Applications:

• Improved optical coupling capabilities in integrated circuit devices.
• Enhanced performance and functionality of high-voltage devices.
• Improved dielectric properties for multilayer structures in electronic devices.
• Manufacturing methods for CMOS image sensors with improved performance and reliability.

Patent applications for TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. on November 30th, 2023

APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE (17824930)

Main Inventor

CHUN-HSI HUANG

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE (18359900)

Main Inventor

YI-CHUAN TENG

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME (18359892)

Main Inventor

CHING-KAI SHEN

ELECTRONIC CIRCUIT AND METHOD OF ERROR CORRECTION (17827834)

Main Inventor

CHIA-CHUN LIAO

VERTICAL POLARIZING BEAMSPLITTER FOR PHOTONICS (17751777)

Main Inventor

Tai-Chun Huang

VERTICAL GRATING COUPLER (17751773)

Main Inventor

Tai-Chun Huang

VERTICAL GRATING FILTERS FOR PHOTONICS (17751787)

Main Inventor

Tai-Chun Huang

EUV PHOTOMASK AND MANUFACTURING METHOD OF THE SAME (18361891)

Main Inventor

FENG YUAN HSU

METHOD AND SYSTEM FOR SCANNING WAFER (18359871)

Main Inventor

PEI-HSUAN LEE

WET PROCESSING SYSTEM AND SYSTEM AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE (17824926)

Main Inventor

YING-CHIEH MENG

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE (17752976)

Main Inventor

You-Ru Lin

METHOD OF FORMING HIGH VOLTAGE TRANSISTOR AND STRUCTURE RESULTING THEREFROM (17824942)

Main Inventor

YUAN-CHENG YANG

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (17824936)

Main Inventor

JHU-MIN SONG

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME (18360855)

Main Inventor

WEI-LUN CHEN

SEMICONDUCTOR STRUCTURE OF BACKSIDE ILLUMINATION CMOS IMAGE SENSOR AND METHOD FOR FORMING THE SAME (17824922)

Main Inventor

CHING-HUNG KAO

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (17824924)

Main Inventor

JUI-LIN CHU

MULTILAYER STRUCTURE, CAPACITOR STRUCTURE AND ELECTRONIC DEVICE (17827837)

Main Inventor

HAI-DANG TRINH

HIGH VOLTAGE DEVICE AND METHOD FOR FORMING THE SAME (17827824)

Main Inventor

YU-YING LAI

METHODS FOR DOPING SEMICONDUCTORS IN TRANSISTORS (17826298)

Main Inventor

Po-Hsun Ho

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF (18232533)

Main Inventor

Ya-Yi Tsai

HIGH-ELECTRON-MOBILITY TRANSISTOR AND METHOD OF MANUFACTURING (17752970)

Main Inventor

Pravanshu Mohanta

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SEMICONDUCTOR STRUCTURE (18360804)

Main Inventor

CHUN-YEN PENG

METHOD FOR MANUFACTURING INTEGRATED CIRCUIT DEVICE AND INTEGRATED CIRCUIT DEVICE THEREOF (17824923)

Main Inventor

WEI-KANG LIU

HIGH-IMPLANT CHANNEL SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME (18227236)

Main Inventor

Chia-Chung CHEN

CIRCUIT AND METHOD TO ENHANCE EFFICIENCY OF SEMICONDUCTOR DEVICE (18360849)

Main Inventor

BEI-SHING LIEN

MEMORY DEVICE WITH BACK-GATE TRANSISTOR AND METHOD OF FORMING THE SAME (17829324)

Main Inventor

MENG-HAN LIN