Pages that link to "US Patent Application 17659214. INTEGRATED CIRCUITS (ICS) EMPLOYING MULTI-PATTERN METALLIZATION TO OPTIMIZE METAL INTERCONNECT SPACING FOR IMPROVED PERFORMANCE AND RELATED FABRICATION METHODS simplified abstract"
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The following pages link to US Patent Application 17659214. INTEGRATED CIRCUITS (ICS) EMPLOYING MULTI-PATTERN METALLIZATION TO OPTIMIZE METAL INTERCONNECT SPACING FOR IMPROVED PERFORMANCE AND RELATED FABRICATION METHODS simplified abstract:
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