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24 May 2024
N 07:31 | 18054211. PACKAGE SUBSTRATE WITH ALTERNATING DIELECTRIC MATERIAL LAYER PAIRS simplified abstract (Intel Corporation) diffhist +3,829 Wikipatents talk contribs Creating a new page |
N 07:31 | 18055605. PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES simplified abstract (Intel Corporation) diffhist +4,642 Wikipatents talk contribs Creating a new page |
N 07:31 | 17988051. BUMPLESS HYBRID ORGANIC GLASS INTERPOSER simplified abstract (Intel Corporation) diffhist +3,794 Wikipatents talk contribs Creating a new page |
N 01:17 | Intel corporation (20240162191). PACKAGE SUBSTRATE WITH ALTERNATING DIELECTRIC MATERIAL LAYER PAIRS simplified abstract diffhist +4,065 Wikipatents talk contribs Creating a new page |
N 01:17 | Intel corporation (20240162158). PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES simplified abstract diffhist +4,806 Wikipatents talk contribs Creating a new page |
N 01:17 | Intel corporation (20240162157). BUMPLESS HYBRID ORGANIC GLASS INTERPOSER simplified abstract diffhist +4,096 Wikipatents talk contribs Creating a new page |