Sk hynix inc. (20240120292). STACK PACKAGE INCLUDING INSERT DIE FOR REINFORCEMENT simplified abstract
Contents
- 1 STACK PACKAGE INCLUDING INSERT DIE FOR REINFORCEMENT
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 STACK PACKAGE INCLUDING INSERT DIE FOR REINFORCEMENT - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
STACK PACKAGE INCLUDING INSERT DIE FOR REINFORCEMENT
Organization Name
Inventor(s)
Jin Woong Kim of Icheon-si Gyeonggi-do (KR)
Jong Yeon Kim of Icheon-si Gyeonggi-do (KR)
STACK PACKAGE INCLUDING INSERT DIE FOR REINFORCEMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240120292 titled 'STACK PACKAGE INCLUDING INSERT DIE FOR REINFORCEMENT
Simplified Explanation
The abstract of the patent application describes a stack package consisting of a first die stack with first dies, a second die stack with second dies, and an insert die placed between the two stacks, which is thicker than the first and second dies.
- The innovation in this patent application is the use of an insert die that is thicker than the surrounding first and second dies in a stack package.
- This design allows for improved performance and functionality of the stack package by providing additional support and stability between the two die stacks.
Potential Applications
The technology described in this patent application could be applied in various industries such as semiconductor manufacturing, electronics, and telecommunications.
Problems Solved
This technology solves the problem of instability and lack of support in traditional stack packages by introducing a thicker insert die between the die stacks.
Benefits
The benefits of this technology include improved performance, increased durability, and enhanced functionality of stack packages.
Potential Commercial Applications
"Enhancing Stack Package Stability with Thicker Insert Die" could be used in the development of advanced electronic devices, high-performance computing systems, and cutting-edge telecommunications equipment.
Possible Prior Art
There may be prior art related to stack packages with insert dies, but the specific innovation of using a thicker insert die for improved stability may be unique to this patent application.
Unanswered Questions
How does this technology compare to existing stack package designs in terms of performance and reliability?
This article does not provide a direct comparison between this technology and existing stack package designs in terms of performance and reliability. Further research or testing may be needed to determine the advantages of this innovation over current solutions.
What are the potential manufacturing challenges associated with implementing this technology on a large scale?
The article does not address the potential manufacturing challenges that may arise when implementing this technology on a large scale. Factors such as cost, production efficiency, and compatibility with existing manufacturing processes could impact the widespread adoption of this innovation.
Original Abstract Submitted
a stack package includes a first die stack including first dies, a second die stack including second dies, and an insert die between the first die stack and the second die stack, wherein the insert die is thicker than each of the first and second dies.
