Seiko epson corporation (20240109354). DRIVE CIRCUIT UNIT, HEAD UNIT, AND LIQUID DISCHARGE APPARATUS simplified abstract

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DRIVE CIRCUIT UNIT, HEAD UNIT, AND LIQUID DISCHARGE APPARATUS

Organization Name

seiko epson corporation

Inventor(s)

Hirokazu Yanagihara of Chino, Nagano (JP)

DRIVE CIRCUIT UNIT, HEAD UNIT, AND LIQUID DISCHARGE APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240109354 titled 'DRIVE CIRCUIT UNIT, HEAD UNIT, AND LIQUID DISCHARGE APPARATUS

Simplified Explanation

The drive circuit unit described in the patent application is a device that is connected to a head connector opposite a discharge port of a head. It includes a first substrate with a connector for the head, a third substrate with a drive circuit generating a signal, and a fan that generates wind to cool the system. The drive signal is supplied from the third substrate to the head connector via the first substrate, with the third substrate being connected back-to-back to the first substrate and standing upright. The fan also stands upright, with its rotation axis parallel to the surface of the third substrate.

  • The drive circuit unit is designed to be connected to a head connector opposite a discharge port of a head.
  • It includes a first substrate with a connector for the head, a third substrate with a drive circuit, and a fan for cooling.
  • The drive signal is supplied from the third substrate to the head connector via the first substrate.
  • The third substrate is connected back-to-back to the first substrate and stands upright.
  • The fan also stands upright, with its rotation axis parallel to the surface of the third substrate.

Potential Applications

The technology described in this patent application could be used in various cooling systems for electronic devices, such as hard drives, servers, or other equipment that requires efficient cooling to operate effectively.

Problems Solved

This technology solves the problem of overheating in electronic devices by providing a cooling system that efficiently dissipates heat generated during operation, ensuring optimal performance and longevity of the equipment.

Benefits

The benefits of this technology include improved performance and reliability of electronic devices, reduced risk of overheating-related malfunctions, and potentially longer lifespan of the equipment due to effective cooling.

Potential Commercial Applications

The technology described in this patent application could have commercial applications in the manufacturing of electronic devices, data centers, and server farms where efficient cooling systems are essential for maintaining optimal performance and preventing equipment failures.

Possible Prior Art

One possible prior art for this technology could be cooling systems used in computer servers or data centers, where fans are commonly used to dissipate heat generated by the equipment during operation.

Unanswered Questions

How does the design of the fan contribute to the overall efficiency of the cooling system?

The patent application mentions that the fan stands upright with its rotation axis parallel to the surface of the third substrate, but it does not elaborate on how this design feature impacts the cooling performance of the system.

Are there any specific materials or components used in the construction of the drive circuit unit that contribute to its effectiveness?

The patent application provides a general overview of the components and structure of the drive circuit unit, but it does not specify if there are any specific materials or components used in its construction that are crucial for its functionality.


Original Abstract Submitted

provided is a drive circuit unit that is coupled to a head connector located opposite to a discharge port of a head, the drive circuit unit including: a first substrate having a first connector coupled to the head connector; a third substrate on which a drive circuit generating a drive signal is mounted; and a fan that generates wind, in which the drive signal is supplied from the third substrate to the first connector via the first substrate, the third substrate is b-to-b-coupled to the first substrate and stands upright with respect to the first substrate, the fan stands upright with respect to the first substrate, and a rotation axis of the fan is substantially parallel to a surface of the third substrate.