Samsung electronics co., ltd. (20240136334). SEMICONDUCTOR PACKAGES simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGES
Organization Name
Inventor(s)
Kwangjin Moon of Suwon-si (KR)
SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136334 titled 'SEMICONDUCTOR PACKAGES
Simplified Explanation
The semiconductor package described in the abstract includes a first semiconductor chip with an integrated circuit, and a second structure on top of the first structure. The second structure consists of a second semiconductor chip with an integrated circuit, a semiconductor pattern spaced apart from the second chip, an insulating pattern between the second chip and the semiconductor pattern, and through-electrode structures that penetrate either the second chip or the semiconductor pattern.
- The semiconductor package includes a first semiconductor chip with an integrated circuit.
- The second structure on top of the first structure includes a second semiconductor chip with an integrated circuit.
- A semiconductor pattern is horizontally spaced apart from the second chip.
- An insulating pattern is present between the second chip and the semiconductor pattern.
- Through-electrode structures penetrate either the second chip or the semiconductor pattern.
- The semiconductor pattern has two side surfaces, one facing the second chip and the other vertically aligned with the first semiconductor chip.
Potential Applications
The technology described in this patent application could be applied in:
- Advanced semiconductor packaging
- High-density integrated circuits
- Miniaturized electronic devices
Problems Solved
This technology helps in:
- Increasing integration density
- Enhancing electrical connectivity
- Improving thermal management
Benefits
The benefits of this technology include:
- Improved performance of semiconductor devices
- Enhanced reliability and durability
- Cost-effective manufacturing processes
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Consumer electronics
- Automotive electronics
- Telecommunications industry
Possible Prior Art
One possible prior art for this technology could be the development of through-electrode structures in semiconductor packaging to improve electrical connectivity and thermal dissipation.
Unanswered Questions
How does this technology impact the overall size of the semiconductor package?
The abstract does not provide information on whether this technology leads to a reduction or increase in the overall size of the semiconductor package.
What are the specific materials used in the insulating pattern mentioned in the abstract?
The abstract does not detail the specific materials used in the insulating pattern between the second semiconductor chip and the semiconductor pattern.
Original Abstract Submitted
a semiconductor package includes a first structure including a first semiconductor chip comprising a first semiconductor integrated circuit, and a second structure on the first structure. the second structure includes a second semiconductor chip including a second semiconductor integrated circuit, a semiconductor pattern horizontally spaced apart from the second semiconductor chip and on a side surface of the second semiconductor chip, an insulating pattern between the second semiconductor chip and the semiconductor pattern, and through-electrode structures. at least one of the through-electrode structures penetrates through at least a portion of the second semiconductor chip or penetrates through the semiconductor pattern. the semiconductor pattern has a first side surface facing the side surface of the second semiconductor chip and a second side surface opposing the first side surface. the second side surface of the semiconductor pattern is vertically aligned with a side surface of the first semiconductor chip.
