Samsung electronics co., ltd. (20240136273). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136273 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes a complex arrangement of redistribution wiring layers, semiconductor chips, and a heat transfer medium. Here is a simplified explanation of the patent application:
- The package consists of multiple redistribution wiring layers, with semiconductor chips arranged on different regions of these layers.
- A heat transfer medium is placed on top of one of the redistribution wiring layers, overlapping with a semiconductor chip.
- The semiconductor chips are spaced apart from each other, with some chips placed between the redistribution wiring layers.
Potential Applications
The technology described in this patent application could be applied in various electronic devices that require efficient heat dissipation, such as high-performance computing systems, servers, and telecommunications equipment.
Problems Solved
This technology solves the problem of heat buildup in semiconductor packages, which can lead to reduced performance and reliability of electronic devices. By incorporating a heat transfer medium and optimizing the arrangement of semiconductor chips, heat dissipation is improved.
Benefits
The benefits of this technology include enhanced thermal management, improved performance and reliability of electronic devices, and potentially longer lifespan of semiconductor packages.
Potential Commercial Applications
The technology could be commercially applied in the development of advanced electronic devices, data centers, and telecommunications infrastructure. A potential SEO-optimized title for this section could be "Commercial Applications of Semiconductor Package with Enhanced Thermal Management."
Possible Prior Art
One possible prior art for this technology could be the use of heat sinks or thermal interface materials in semiconductor packages to improve heat dissipation. However, the specific arrangement of redistribution wiring layers and semiconductor chips described in this patent application may be a novel innovation.
Unanswered Questions
How does this technology compare to traditional heat dissipation methods in semiconductor packages?
This article does not provide a direct comparison between this technology and traditional heat dissipation methods. It would be interesting to know how the efficiency and effectiveness of this new approach stack up against more conventional solutions.
What are the potential challenges in implementing this technology on a large scale in commercial electronic devices?
The article does not address the potential challenges that may arise when implementing this technology on a large scale. Understanding the practical implications and limitations of this innovation in real-world applications would be crucial for its successful commercialization.
Original Abstract Submitted
a semiconductor package includes: a first redistribution wiring layer having first redistribution wirings; a second redistribution wiring layer arranged on the first redistribution wiring layer, and including a first region, a second region, and a second redistribution wirings; a first semiconductor chip arranged on the first region of the second redistribution wiring layer; a plurality of second semiconductor chips spaced apart from each other on the upper surface of the second region of the second redistribution wiring layer; a plurality of third semiconductor chips arranged in the second region of the second redistribution wiring layer and spaced apart from each other between the first and second redistribution wiring layers; and a heat transfer medium arranged on the first region of the second redistribution wiring layer and overlapping the first semiconductor chip with the second redistribution wiring layer interposed between the first semiconductor chip and the heat transfer medium.
