Samsung electronics co., ltd. (20240136264). FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Seungmin Baek of Suwon-si (KR)
FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136264 titled 'FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes a chip-via composite substrate with a semiconductor chip, through vias, and redistribution wiring layers. The substrate has two regions, with the chip placed in the first region and the through vias in the second region. The first redistribution wiring layer is on the first surface of the substrate, connected to the chip pads and through vias, while the second redistribution wiring layer is on the second surface, also connected to the through vias.
- Chip-via composite substrate with semiconductor chip, through vias, and redistribution wiring layers
- Substrate with two regions for chip and through vias
- Redistribution wiring layers on both surfaces of the substrate
Potential Applications
The technology described in this patent application could be used in various semiconductor packaging applications, such as in microprocessors, memory chips, and other electronic devices where compact and efficient packaging is required.
Problems Solved
This technology solves the problem of efficiently connecting a semiconductor chip to external components through through vias and redistribution wiring layers in a compact and reliable manner.
Benefits
The benefits of this technology include improved electrical connectivity, reduced footprint, and enhanced performance of semiconductor devices due to the efficient packaging design.
Potential Commercial Applications
The potential commercial applications of this technology include the semiconductor industry, electronics manufacturing companies, and any other businesses involved in producing compact and high-performance electronic devices.
Possible Prior Art
One possible prior art for this technology could be the use of multilayer substrates with through vias and redistribution wiring layers in semiconductor packaging. However, the specific configuration and design described in this patent application may offer unique advantages and improvements over existing technologies.
Unanswered Questions
How does this technology compare to traditional semiconductor packaging methods?
This article does not provide a direct comparison between this technology and traditional semiconductor packaging methods. It would be interesting to know the specific advantages and disadvantages of this approach compared to more conventional packaging techniques.
What are the potential challenges in implementing this technology on a large scale?
The article does not address the potential challenges that may arise in implementing this technology on a large scale for mass production. Understanding the scalability and manufacturing implications of this technology would be crucial for its successful commercialization.
Original Abstract Submitted
a semiconductor package includes: a chip-via composite substrate including a substrate, a semiconductor chip, and a plurality of through vias, wherein the substrate has a first surface and a second surface opposite to the first surface and includes a first region and a second region around the first region, wherein the semiconductor chip is provided in the first region and has chip pads and circuit patterns that are electrically connected to the chip pads, and wherein the plurality of through vias is provided in the second region and penetrate the substrate; a first redistribution wiring layer provided on the first surface of the substrate and having first redistribution wirings that are electrically connected to the chip pads and the through vias; and a second redistribution wiring layer provided on the second surface of the substrate and having second redistribution wirings that are electrically connected to the through vias.
