Samsung electronics co., ltd. (20240130115). INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract
Contents
- 1 INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240130115 titled 'INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The abstract describes an integrated circuit (IC) device with various components such as word lines, conductive expanded pads, pad isolation structures, direct contacts, bit lines, conductive plugs, and separation fences.
- The IC device includes a substrate with active regions.
- Word lines extend horizontally across the active regions.
- Conductive expanded pads are connected to the active regions.
- Pad isolation structures separate the conductive expanded pads.
- Direct contacts are connected to the active regions.
- Bit lines run perpendicular to the word lines and are connected to the direct contacts.
- Conductive plugs extend vertically on the expanded pads and are connected to them.
- Separation fences pass through the expanded pads and plugs, with sidewalls extending vertically.
Potential Applications
The technology described in this patent application could be applied in various fields such as semiconductor manufacturing, integrated circuit design, and electronic device production.
Problems Solved
This technology helps in improving the efficiency and performance of integrated circuits by providing a structured layout for components, reducing interference, and enhancing connectivity between different parts of the IC device.
Benefits
The benefits of this technology include increased reliability, higher speed, improved signal integrity, and overall better functionality of integrated circuits.
Potential Commercial Applications
Potential commercial applications of this technology could include the production of advanced microprocessors, memory chips, sensors, and other electronic components used in various devices such as smartphones, computers, and IoT devices.
Possible Prior Art
One possible prior art for this technology could be the use of similar structures and layouts in previous generations of integrated circuits or semiconductor devices. Research in the field of IC design and fabrication may also have explored similar concepts in the past.
Unanswered Questions
How does this technology compare to existing IC design methodologies?
The article does not provide a direct comparison between this technology and existing IC design methodologies. It would be helpful to understand the specific advantages or differences that this innovation offers in comparison to current practices.
What are the specific performance metrics or test results of IC devices using this technology?
The article does not mention any specific performance metrics or test results of IC devices utilizing this technology. It would be beneficial to have data on how this innovation improves the performance, efficiency, or other key aspects of integrated circuits.
Original Abstract Submitted
an integrated circuit (ic) device is provided. the ic device includes: a substrate having active regions; word lines extending in a first horizontal direction across the active regions; conductive expanded pads on the substrate and connected to the active regions; pad isolation structures located between the conductive expanded pads; direct contacts connected to the active regions; bit lines extending in a second horizontal direction perpendicular to the first horizontal direction, on the direct contacts and the pad isolation structures, and connected to the direct contacts; conductive plugs extending in a vertical direction on the conductive expanded pads and connected to the conductive expanded pads; and separation fences passing through the conductive expanded pads and the conductive plugs, and having sidewalls extending linearly in the vertical direction.
