Samsung electronics co., ltd. (20240128176). SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEOK GEUN Ahn of SUWON-SI (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128176 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes a semiconductor substrate with redistribution layers, vias, and a circuit layer. The circuit layer contains a circuit element, a circuit wiring pattern, and a device interlayer dielectric layer.
- The semiconductor package includes a semiconductor substrate with a device region and an edge region.
- The package has a first redistribution layer on the lower surface and a second redistribution layer on the upper surface of the semiconductor substrate.
- Vias vertically penetrate the semiconductor substrate in the edge region to connect the first and second redistribution layers.
- A circuit layer is located between the lower surface of the semiconductor substrate and the first redistribution layer, containing a circuit element, a circuit wiring pattern, and a device interlayer dielectric layer.
Potential Applications
The technology described in this patent application could be used in various semiconductor devices, such as integrated circuits, microprocessors, and memory chips.
Problems Solved
This technology helps in improving the electrical connectivity and performance of semiconductor packages by providing a more efficient and reliable way to connect different layers within the package.
Benefits
The benefits of this technology include enhanced electrical performance, increased reliability, and potentially reduced manufacturing costs for semiconductor packages.
Potential Commercial Applications
The potential commercial applications of this technology could be in the semiconductor industry for manufacturing advanced and high-performance electronic devices.
Possible Prior Art
One possible prior art for this technology could be the use of through-silicon vias (TSVs) in semiconductor packaging to improve electrical connections between different layers.
Unanswered Questions
How does this technology compare to existing semiconductor packaging methods in terms of cost-effectiveness?
This article does not provide specific information on the cost-effectiveness of this technology compared to existing semiconductor packaging methods. Further research or analysis would be needed to determine the cost implications of implementing this technology.
What are the potential challenges in scaling up the production of semiconductor packages using this technology?
The article does not address the potential challenges in scaling up production using this technology. Factors such as manufacturing scalability, yield rates, and production efficiency could be important considerations that need to be explored further.
Original Abstract Submitted
a semiconductor package includes; a semiconductor substrate including a device region and an edge region, a first redistribution layer on a lower surface of the semiconductor substrate, a second redistribution layer on an upper surface of the semiconductor substrate, through vias vertically penetrating the semiconductor substrate in the edge region to electrically connect the first redistribution layer and the second redistribution layer, and a circuit layer between the lower surface of the semiconductor substrate and the first redistribution layer. the circuit layer may include; a circuit element on the lower surface of the semiconductor substrate, a circuit wiring pattern electrically connected to the circuit element and the first redistribution layer, and a device interlayer dielectric layer substantially encompassing the circuit element and the circuit wiring pattern, wherein the circuit element and the circuit wiring pattern are disposed in the device region and not in the edge region.
