Samsung electronics co., ltd. (20240128164). INTEGRATED CIRCUIT INCLUDING THROUGH-SILICON VIA AND METHOD OF DESIGNING THE INTEGRATED CIRCUIT simplified abstract
Contents
- 1 INTEGRATED CIRCUIT INCLUDING THROUGH-SILICON VIA AND METHOD OF DESIGNING THE INTEGRATED CIRCUIT
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INTEGRATED CIRCUIT INCLUDING THROUGH-SILICON VIA AND METHOD OF DESIGNING THE INTEGRATED CIRCUIT - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
INTEGRATED CIRCUIT INCLUDING THROUGH-SILICON VIA AND METHOD OF DESIGNING THE INTEGRATED CIRCUIT
Organization Name
Inventor(s)
Youngrok Park of Suwon-si (KR)
INTEGRATED CIRCUIT INCLUDING THROUGH-SILICON VIA AND METHOD OF DESIGNING THE INTEGRATED CIRCUIT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128164 titled 'INTEGRATED CIRCUIT INCLUDING THROUGH-SILICON VIA AND METHOD OF DESIGNING THE INTEGRATED CIRCUIT
Simplified Explanation
The abstract describes an integrated circuit with a bit cell array and a peripheral region containing a peripheral circuit. The peripheral region includes devices over a substrate, patterns providing voltage to devices, power lines under the substrate, and vias connecting patterns to power lines.
- Integrated circuit with bit cell array and peripheral region
- Peripheral region includes devices, patterns, power lines, and vias
- Vias pass through substrate to connect patterns to power lines
Potential Applications
The technology described in this patent application could be used in various electronic devices such as smartphones, tablets, computers, and other digital devices that require integrated circuits for processing and memory functions.
Problems Solved
This technology solves the problem of efficiently connecting patterns providing voltage to devices in the peripheral region to power lines under the substrate in an integrated circuit. It also addresses the challenge of optimizing space and layout in the peripheral region.
Benefits
The benefits of this technology include improved performance and reliability of integrated circuits, enhanced power distribution, and potentially reduced manufacturing costs due to optimized layout and design.
Potential Commercial Applications
- "Optimized Power Distribution in Integrated Circuits for Enhanced Performance and Reliability"
Possible Prior Art
One possible prior art could be the use of through-silicon vias (TSVs) in integrated circuits to connect different layers of the circuit vertically. This technology has been used to improve performance and reduce power consumption in integrated circuits.
Unanswered Questions
How does this technology impact the overall power consumption of the integrated circuit?
The abstract mentions power lines and vias for power distribution, but it does not specify how this affects the power efficiency of the circuit.
What are the specific types of devices and patterns used in the peripheral region of the integrated circuit?
While the abstract mentions devices and patterns, it does not provide details on the specific types or configurations of these components.
Original Abstract Submitted
an integrated circuit may include a bit cell array including a plurality of bit cells and a peripheral region including a peripheral circuit. the peripheral region may include a plurality of devices over a substrate, at least one pattern configured to provide a first voltage to at least one of the plurality of devices, at least one power line extending under the substrate, and at least one first via passing through the substrate in a vertical direction in the peripheral region and electrically connecting the at least one pattern to the at least one power line.
