Samsung electronics co., ltd. (20240128109). APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract
Contents
- 1 APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
Organization Name
Inventor(s)
Sang Hyuk Park of Suwon-si (KR)
Kyu-Sik Jeong of Suwon-si (KR)
APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128109 titled 'APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
Simplified Explanation
The patent application describes an apparatus for manufacturing a semiconductor device, including a substrate transfer unit, a rail unit, and a lifting unit.
- The substrate transfer unit is responsible for transferring a substrate.
- The rail unit consists of a driving rail and a stopper to guide the movement of the substrate transfer unit.
- The lifting unit moves in multiple directions to remove the substrate transfer unit from the rail unit, contacting the stopper to facilitate this process.
Potential Applications
This technology could be applied in semiconductor manufacturing facilities to improve the efficiency of substrate handling processes.
Problems Solved
1. Streamlining substrate transfer processes in semiconductor device manufacturing. 2. Enhancing the precision and control of substrate movement within the manufacturing apparatus.
Benefits
1. Increased efficiency in semiconductor device manufacturing. 2. Improved accuracy and reliability in substrate handling. 3. Enhanced automation capabilities in the manufacturing process.
Potential Commercial Applications
Optimizing Substrate Transfer in Semiconductor Manufacturing Processes
Possible Prior Art
There may be existing patents or technologies related to substrate transfer units in semiconductor manufacturing processes, but specific prior art is not provided in this abstract.
Unanswered Questions
How does this technology impact the overall production output in semiconductor manufacturing facilities?
This technology could potentially increase production output by streamlining substrate handling processes and reducing downtime associated with manual interventions.
What are the potential cost savings associated with implementing this technology in semiconductor manufacturing facilities?
By improving efficiency and reducing errors in substrate handling, this technology could lead to cost savings in terms of labor, material waste, and overall production time.
Original Abstract Submitted
an apparatus for manufacturing a semiconductor device includes a substrate transfer unit configured to transfer a substrate, a rail unit including a driving rail extending in a first direction that the substrate transfer unit moves and a stopper on a side of the driving rail in a second direction crossing the first direction, and a lifting unit configured to move in the first direction and a third direction perpendicular to the first and second directions to remove the substrate transfer unit from the rail unit, wherein the lifting unit is configured to contact the stopper to move the stopper from a closed state to an open state.
