Samsung electronics co., ltd. (20240128107). MODULE TRAY FOR SEMICONDUCTOR DEVICE simplified abstract
Contents
- 1 MODULE TRAY FOR SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MODULE TRAY FOR SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
MODULE TRAY FOR SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
MODULE TRAY FOR SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128107 titled 'MODULE TRAY FOR SEMICONDUCTOR DEVICE
Simplified Explanation
The module tray for a semiconductor device consists of a base plate, first and second sidewalls, a dividing wall, fastening guides, and guide grooves.
- Base plate, first and second sidewalls, and dividing wall define an accommodation space.
- Fastening guides with fastening grooves on inner surfaces of sidewalls and dividing wall.
- Guide grooves on inner surfaces of sidewalls and dividing wall have curved concave shapes.
- Upper end portion of fastening grooves gradually widens toward the top.
Potential Applications
The module tray can be used in the assembly and packaging of semiconductor devices, providing a secure and organized layout for components.
Problems Solved
The module tray helps prevent damage to delicate semiconductor components during handling and transportation by securely holding them in place.
Benefits
The design of the module tray allows for efficient and safe handling of semiconductor devices, reducing the risk of damage and improving overall product quality.
Potential Commercial Applications
"Module Tray for Semiconductor Devices: Applications and Benefits"
Possible Prior Art
There may be prior art related to module trays for semiconductor devices that have similar features, such as fastening guides and guide grooves. However, specific examples are not provided in this abstract.
Unanswered Questions
How does the design of the module tray improve the overall efficiency of semiconductor device assembly?
The design of the module tray streamlines the process of organizing and securing components, reducing the time and effort required for assembly.
What materials are typically used in the manufacturing of module trays for semiconductor devices?
Module trays for semiconductor devices are often made from materials such as plastic or metal, chosen for their durability and compatibility with semiconductor components.
Original Abstract Submitted
a module tray for a semiconductor device includes a base plate, first and second sidewalls extending in a vertical direction from opposite sides of the base plate to define an accommodation space, a dividing wall extending in the vertical direction from the base plate between the first and second sidewalls, first to fourth fastening guides with first to fourth fastening grooves, respectively, on inner surfaces of the first and second sidewalls and opposite side surfaces of the dividing wall, and first to fourth guide grooves on the inner surfaces of the first and second sidewalls and the opposite side surfaces of the dividing wall, respectively, the first to fourth guide grooves having curved concave shapes, and an upper end portion of each of the first to fourth fastening grooves gradually widening toward a top thereof.
