Samsung electronics co., ltd. (20240128105). COVER FOR MODULE TRAY AND MODULE TRAY FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME simplified abstract

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COVER FOR MODULE TRAY AND MODULE TRAY FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME

Organization Name

samsung electronics co., ltd.

Inventor(s)

Taegeon Kim of Suwon-si (KR)

COVER FOR MODULE TRAY AND MODULE TRAY FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240128105 titled 'COVER FOR MODULE TRAY AND MODULE TRAY FOR SEMICONDUCTOR DEVICE INCLUDING THE SAME

Simplified Explanation

The abstract describes a cover for a module tray that includes a structure to cover a semiconductor device and a card accommodation portion on the upper surface to accommodate a card. The card accommodation portion consists of three brackets with accommodation guides extending in horizontal directions to secure the card in place.

  • The cover for a module tray includes a card accommodation portion with multiple brackets and accommodation guides.
  • The first bracket has a first accommodation guide in the first horizontal direction.
  • The second bracket has second and third accommodation guides, with the second guide facing the first guide.
  • The third bracket has fourth and fifth accommodation guides, with the fourth guide facing the first guide and the fifth guide facing the third guide.

Potential Applications

This technology could be applied in the manufacturing of electronic devices where secure placement of cards is required, such as in servers, computers, or other electronic equipment.

Problems Solved

This innovation solves the problem of securely accommodating cards within a module tray, ensuring they are held in place during transportation or operation.

Benefits

The benefits of this technology include improved card security, reduced risk of damage during handling, and ease of installation and removal of cards from the module tray.

Potential Commercial Applications

The potential commercial applications of this technology include the production of server racks, computer systems, and other electronic devices that require secure card accommodation within a module tray.

Possible Prior Art

One possible prior art could be the use of brackets and guides in electronic enclosures to secure components in place. However, the specific design of the card accommodation portion described in this patent application may be a novel improvement in the field.

Unanswered Questions

How does this technology compare to existing solutions in terms of cost-effectiveness?

The article does not provide information on the cost implications of implementing this technology compared to other methods of securing cards in module trays.

What materials are recommended for the construction of the cover and card accommodation portion?

The article does not specify the materials that would be most suitable for ensuring the durability and effectiveness of the cover and card accommodation portion.


Original Abstract Submitted

a cover for a module tray includes a cover structure to cover a case of a semiconductor device, and a card accommodation portion on an upper surface of the cover structure to accommodate a card. the card accommodation portion includes a first bracket having a first accommodation guide extending in the first horizontal direction, a second bracket spaced apart from the first bracket and having second and third accommodation guides, the second accommodation guide extending in the first horizontal direction to face the first accommodation guide, and the third accommodation guide extending in the second horizontal direction, and a third bracket spaced apart from the first and second brackets, and having fourth and fifth accommodation guides, the fourth accommodation guide extending in the first horizontal direction to face the first accommodation guide, and the fifth accommodation guide extending in the second horizontal direction to face the third accommodation guide.