Samsung electronics co., ltd. (20240127425). DEFECT DETECTION DEVICE AND METHOD THEREOF simplified abstract
Contents
- 1 DEFECT DETECTION DEVICE AND METHOD THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 DEFECT DETECTION DEVICE AND METHOD THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
DEFECT DETECTION DEVICE AND METHOD THEREOF
Organization Name
Inventor(s)
Sungwook Hwang of Suwon-si (KR)
DEFECT DETECTION DEVICE AND METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240127425 titled 'DEFECT DETECTION DEVICE AND METHOD THEREOF
Simplified Explanation
The patent application describes a defect detection device that uses an artificial neural network to determine the type and location of defects on a wafer based on inspection images.
- Memory stores layout image and dummy pattern
- Controller with artificial neural network learns layout image
- Determines if defect is in circuit pattern area or dummy pattern area
- Determines type of defect based on location
Potential Applications
This technology can be applied in the semiconductor industry for quality control and defect detection in wafer manufacturing processes.
Problems Solved
1. Efficient defect detection in semiconductor manufacturing 2. Accurate identification of defect types and locations
Benefits
1. Improved quality control in wafer production 2. Faster defect detection and classification 3. Enhanced overall manufacturing efficiency
Potential Commercial Applications
Optimizing semiconductor manufacturing processes with advanced defect detection technology
Possible Prior Art
Similar defect detection devices using artificial intelligence and neural networks have been developed in the semiconductor industry to improve quality control processes.
Unanswered Questions
How does the device handle variations in defect types and sizes?
The patent application does not specify how the device adapts to different types and sizes of defects during the detection process.
What is the accuracy rate of defect detection using this technology?
The patent application does not provide information on the accuracy rate of defect detection achieved by the device.
Original Abstract Submitted
a defect detection device includes: a memory configured to store a layout image indicating a circuit pattern and indicating a dummy pattern; and a controller comprising an artificial neural network configured to learn the layout image, the controller being configured to: determine, based on an inspection image obtained by photographing an area including a defect on a wafer, whether the defect is in a first area in which the circuit pattern is positioned or in a second area in which the dummy pattern is positioned, by using the artificial neural network, and determine a type of the defect based on whether the defect is positioned is in the first area or in the second area.
