Samsung electronics co., ltd. (20240120286). SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Hyeonseok Lee of Suwon-si (KR)
Hyeonjeong Hwang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240120286 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes a lower redistribution structure, an internal semiconductor chip on the upper surface of the lower redistribution structure, an upper redistribution structure connected to the lower redistribution structure through a conductive post, and a molding layer between the upper and lower redistribution structures. The upper redistribution structure contains an insulating layer with a redistribution pattern and a first material that transmits light, as well as a fiducial mark made of the first material.
- Lower redistribution structure
- Internal semiconductor chip
- Upper redistribution structure
- Conductive post
- Molding layer
- Insulating layer
- Fiducial mark
Potential Applications
The technology described in this patent application could be used in various semiconductor packaging applications, such as in microprocessors, memory chips, and other electronic devices that require precise alignment and electrical connections.
Problems Solved
This technology solves the problem of ensuring accurate alignment and electrical connections between the internal semiconductor chip and the redistribution structures in a semiconductor package. The fiducial mark helps in achieving precise positioning during the manufacturing process.
Benefits
Some benefits of this technology include improved reliability and performance of semiconductor devices, enhanced light transmission capabilities, and increased efficiency in the manufacturing process due to the use of the fiducial mark for alignment.
Potential Commercial Applications
- Advanced semiconductor packaging industry
- Electronics manufacturing companies
- Semiconductor equipment suppliers
Possible Prior Art
One possible prior art in semiconductor packaging technology is the use of fiducial marks for alignment purposes in electronic devices. Previous patents may exist that describe similar methods for ensuring accurate positioning of components in semiconductor packages.
Unanswered Questions
How does this technology impact the overall cost of semiconductor packaging?
The abstract does not provide information on the cost implications of implementing this technology in semiconductor packaging. Further research or analysis would be needed to determine the cost-effectiveness of using this approach.
What are the environmental implications of the materials used in this semiconductor package?
The abstract does not address the environmental impact of the materials used in the semiconductor package. It would be important to consider the sustainability and recyclability of the components and materials involved in the manufacturing process.
Original Abstract Submitted
provided is a semiconductor package including a lower redistribution structure, an internal semiconductor chip on an upper surface of the lower redistribution structure, an upper redistribution structure electrically connected to the lower redistribution structure through a conductive post, and a molding layer between the upper redistribution structure and the lower redistribution structure, the molding layer being adjacent to the internal semiconductor chip, wherein the upper redistribution structure includes an insulating layer including a redistribution pattern and a first material configured to transmit light, and a fiducial mark formed of the first material, and a lower surface of the fiducial mark is in contact with an upper surface of the molding layer.
