Samsung electronics co., ltd. (20240120276). THREE-DIMENSIONAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING INTER-DIE INTERFACE simplified abstract
Contents
- 1 THREE-DIMENSIONAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING INTER-DIE INTERFACE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 THREE-DIMENSIONAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING INTER-DIE INTERFACE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
THREE-DIMENSIONAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING INTER-DIE INTERFACE
Organization Name
Inventor(s)
Jae Seung Choi of Suwon-si (KR)
Chang Seok Kwak of Suwon-si (KR)
Sang Joon Cheon of Suwon-si (KR)
THREE-DIMENSIONAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING INTER-DIE INTERFACE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240120276 titled 'THREE-DIMENSIONAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING INTER-DIE INTERFACE
Simplified Explanation
The abstract describes a three-dimensional semiconductor integrated circuit device with an inter-die interface. The device includes a top die with micro cells on the top surface, micro bumps on the bottom surface, and wiring patterns connecting them. The bottom die has macro cells on its top surface, electrically connected to the micro bumps. The region for micro cells is smaller than the region for micro bumps.
- Explanation of the patent/innovation:
- Three-dimensional semiconductor integrated circuit device - Inter-die interface for communication between top and bottom dies - Top die with micro cells, micro bumps, and wiring patterns - Bottom die with macro cells connected to micro bumps - Optimization of space with smaller region for micro cells
Potential Applications
The technology can be applied in: - High-performance computing - Data centers - Artificial intelligence systems
Problems Solved
The technology solves: - Space constraints in semiconductor devices - Improved communication between different dies - Enhanced performance and efficiency
Benefits
The benefits of this technology include: - Increased integration density - Enhanced signal transmission - Improved overall performance
Potential Commercial Applications
The technology can be commercially applied in: - Semiconductor manufacturing industry - Electronics and consumer devices - Telecommunications sector
Possible Prior Art
One possible prior art could be the development of 2.5D integrated circuits, where multiple dies are stacked on top of each other with interposers for communication.
Unanswered Questions
How does this technology impact power consumption in semiconductor devices?
The article does not delve into the specific effects of this technology on power consumption. It would be interesting to know if the optimization of space and communication pathways leads to any improvements in power efficiency.
Are there any limitations to the size difference between the regions for micro cells and micro bumps?
The article mentions that the region for micro cells is smaller than the region for micro bumps. It would be valuable to understand if there are any constraints or drawbacks to this size difference in terms of performance or manufacturing processes.
Original Abstract Submitted
a three-dimensional semiconductor integrated circuit device including an inter-die interface is provided. the device includes a top die including a plurality of micro cells provided on a top surface of the top die, a plurality of micro bumps provided on a bottom surface of the top die, and wiring patterns connecting the plurality of micro cells to the plurality of micro bumps; and a bottom die including a plurality of macro cells provided on a top surface thereof, wherein the plurality of macro cells are electrically connected to the plurality of micro bumps, respectively, wherein a size of a region in which the plurality of micro cells are provided is smaller than a size of a region in which the plurality of micro bumps are provided.
