Samsung electronics co., ltd. (20240120234). SEMICONDUCTOR MANUFACTURING APPARATUS simplified abstract
Contents
- 1 SEMICONDUCTOR MANUFACTURING APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR MANUFACTURING APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR MANUFACTURING APPARATUS
Organization Name
Inventor(s)
SEMICONDUCTOR MANUFACTURING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240120234 titled 'SEMICONDUCTOR MANUFACTURING APPARATUS
Simplified Explanation
The semiconductor manufacturing apparatus described in the abstract includes structures and pins for holding a substrate in place during the manufacturing process. The apparatus also includes a locking plate and a coupling member for securing the pins in place.
- The apparatus consists of a first structure with a hole, a second structure with a space for a substrate and a lower plate with a hole, and pins for securing the substrate in place.
- The first pin is inserted into the first hole, while the second pin is inserted into the second hole and on top of the first pin. A locking plate is placed between the two pins to secure them in place.
- A coupling member is used to connect or disconnect the first pin from the second pin.
Potential Applications
The technology described in this patent application could be used in the manufacturing of various semiconductor devices, such as integrated circuits, transistors, and diodes.
Problems Solved
This technology solves the problem of securely holding a substrate in place during the semiconductor manufacturing process, ensuring precise and accurate production of semiconductor devices.
Benefits
The benefits of this technology include improved manufacturing efficiency, increased accuracy in device production, and reduced risk of substrate misalignment or damage.
Potential Commercial Applications
One potential commercial application of this technology is in the semiconductor manufacturing industry, where precise and reliable substrate positioning is crucial for the production of high-quality semiconductor devices.
Possible Prior Art
One possible prior art for this technology could be similar apparatus used in other industries for holding substrates or materials in place during manufacturing processes.
Unanswered Questions
How does this technology compare to existing substrate holding mechanisms in semiconductor manufacturing?
This article does not provide a direct comparison between this technology and existing substrate holding mechanisms in semiconductor manufacturing.
What are the specific dimensions and materials used for the pins and locking plate in this apparatus?
The article does not provide detailed information about the specific dimensions and materials used for the pins and locking plate in this semiconductor manufacturing apparatus.
Original Abstract Submitted
a semiconductor manufacturing apparatus includes a first structure having a first hole, a second structure on the first structure, the second structure including a space for accommodating a substrate and a lower plate with a second hole, a first pin insertable into the first hole, the first pin having a same diameter as the first hole and a length smaller than a length of the first hole in a vertical direction, a second pin insertable into the second hole and on the first pin, the second pin having a same diameter as the second hole, a locking plate between the first pin and the second pin, the locking plate overhanging a side wall of the first pin, and a coupling member configured to couple the first pin to or separate the first pin from the second pin.
