Samsung electronics co., ltd. (20240120232). SUBSTRATE TRANSFERRING UNIT, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD simplified abstract
Contents
- 1 SUBSTRATE TRANSFERRING UNIT, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE TRANSFERRING UNIT, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SUBSTRATE TRANSFERRING UNIT, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD
Organization Name
Inventor(s)
Sangjine Park of Suwon-si (KR)
Jihwan Park of Hwaseong-si (KR)
Seungmin Shin of Suwon-si (KR)
SUBSTRATE TRANSFERRING UNIT, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240120232 titled 'SUBSTRATE TRANSFERRING UNIT, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD
Simplified Explanation
The substrate processing apparatus described in the patent application consists of multiple process chambers for different operations on the substrate, along with a substrate transferring unit. The operations include developing, drying, baking, and cooling the substrate at different stages of the process.
- The first process chamber performs a developing process by supplying a developer to a dry substrate.
- The second process chamber conducts a drying process using a supercritical fluid on the wet substrate from the developing process.
- The third process chamber carries out a bake operation on the dry substrate from the drying process.
- The fourth process chamber executes a cooling operation on the dry substrate from the bake operation.
- A substrate transferring unit moves the substrate between the different process chambers.
Potential Applications
The technology described in this patent application could be applied in semiconductor manufacturing, photolithography, and other industries requiring precise substrate processing.
Problems Solved
This innovation solves the challenge of efficiently and effectively processing substrates through multiple stages without exposing them to external contaminants or environmental factors.
Benefits
The benefits of this technology include improved process control, reduced contamination risks, enhanced substrate quality, and increased overall efficiency in substrate processing operations.
Potential Commercial Applications
Potential commercial applications of this technology could be in the semiconductor industry, microelectronics manufacturing, and research institutions focusing on advanced materials processing.
Possible Prior Art
One possible prior art in this field could be the use of multiple process chambers in semiconductor manufacturing for different processing steps, but the specific combination of operations and the use of supercritical fluids may be unique to this patent application.
Unanswered Questions
How does this technology compare to traditional substrate processing methods in terms of efficiency and cost-effectiveness?
This article does not provide a direct comparison between this technology and traditional substrate processing methods in terms of efficiency and cost-effectiveness.
What are the potential limitations or challenges in implementing this substrate processing apparatus on an industrial scale?
The article does not address the potential limitations or challenges in implementing this substrate processing apparatus on an industrial scale, such as scalability, maintenance requirements, or compatibility with existing manufacturing processes.
Original Abstract Submitted
a substrate processing apparatus includes: a first process chamber in which a developing process is performed by supplying a developer to a substrate that is in a dry state; a second process chamber in which a drying process is performed on the substrate by supplying a supercritical fluid to the substrate on which the developing process is performed and which is in a wet state; a third process chamber in which a bake operation is performed on the substrate on which the drying operation is performed and is in a dry state; a fourth process chamber in which a cooling operation is performed on the substrate on which the bake operation is performed and is in a dry state; and a substrate transferring unit configured to transfer the substrate between the first to fourth process chambers.
