Samsung electronics co., ltd. (20240120224). SEMICONDUCTOR MANUFACTURING EQUIPMENT, AND METHOD FOR TRANSPORTING REPLACEABLE COMPONENTS IN THE SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract

SEMICONDUCTOR MANUFACTURING EQUIPMENT, AND METHOD FOR TRANSPORTING REPLACEABLE COMPONENTS IN THE SEMICONDUCTOR MANUFACTURING EQUIPMENT

Organization Name

samsung electronics co., ltd.

Inventor(s)

Jin Hyuk Choi of Suwon-si (KR)

Beom Soo Hwang of Suwon-si (KR)

Kong Woo Lee of Suwon-si (KR)

Myung Ki Song of Suwon-si (KR)

Ja-Yul Kim of Suwon-si (KR)

Kyu Sang Lee of Suwon-si (KR)

Hyun Joo Jeon of Suwon-si (KR)

Nam Young Cho of Suwon-si (KR)

SEMICONDUCTOR MANUFACTURING EQUIPMENT, AND METHOD FOR TRANSPORTING REPLACEABLE COMPONENTS IN THE SEMICONDUCTOR MANUFACTURING EQUIPMENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240120224 titled 'SEMICONDUCTOR MANUFACTURING EQUIPMENT, AND METHOD FOR TRANSPORTING REPLACEABLE COMPONENTS IN THE SEMICONDUCTOR MANUFACTURING EQUIPMENT

Simplified Explanation

The semiconductor manufacturing equipment described in the abstract includes a process chamber, a front-end module with a transfer robot, a transfer chamber, and a cassette for replaceable components.

• The process chamber is used for treating substrates.
• The front-end module includes a transfer robot that transports substrates in containers.
• The transfer chamber loads and unloads substrates into or out of the process chamber.
• The cassette can hold replaceable components for the process chamber.
• The front-end module has a seat plate that can retract or extend to load cassettes.
• The cassette can be loaded into the front-end module while seated on the seat plate.

Potential Applications

This technology can be applied in semiconductor manufacturing processes where precise handling and treatment of substrates are required.

Problems Solved

This technology solves the problem of efficiently loading and unloading substrates in a semiconductor manufacturing process, as well as providing a convenient way to store and replace components.

Benefits

The benefits of this technology include improved efficiency, accuracy, and flexibility in semiconductor manufacturing processes.

Potential Commercial Applications

This technology can be used in the production of various semiconductor devices, such as microchips, processors, and memory modules.

Possible Prior Art

One possible prior art for this technology could be automated semiconductor manufacturing equipment with similar features for substrate handling and component storage.

How does this technology improve substrate treatment efficiency in comparison to existing methods?

This technology streamlines the process of loading and unloading substrates, reducing downtime and increasing overall production efficiency.

What are the specific types of replaceable components that can be stored in the cassette?

The cassette can hold a variety of replaceable components, such as filters, chambers, or other parts used in the process chamber.

Original Abstract Submitted

a semiconductor manufacturing equipment may include a process chamber for treating a substrate; a front-end module including a first transfer robot, wherein the first transfer robot may be configured to transport the substrate received in a container; a transfer chamber between the front-end module and the process chamber, wherein the transfer chamber may be configured to load or unload the substrate into or out of the process chamber; and a cassette capable of receiving a replaceable component capable of being used in the process chamber. the front-end module may include a seat plate configured to move in a sliding manner so as to retract or extend into or from the front-end module. the cassette may be configured to be loaded into the front-end module while the cassette is seated on the seat plate.