Samsung electronics co., ltd. (20240120194). WAFER PROCESSING SYSTEM simplified abstract
Contents
- 1 WAFER PROCESSING SYSTEM
WAFER PROCESSING SYSTEM
Organization Name
Inventor(s)
Sung-Wook Jung of Suwon-si (KR)
WAFER PROCESSING SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240120194 titled 'WAFER PROCESSING SYSTEM
Simplified Explanation
The abstract describes a wafer processing system that utilizes an optical apparatus to split a laser beam into two beams with different states of linear polarization and a controlled delay between them.
- Optical apparatus splits laser beam into two beams with different states of linear polarization.
- Beam delayer introduces a delay between the two beams.
- First beam is in a first state of linear polarization.
- Second beam is in a second state of linear polarization.
- Pulse of the second beam is delayed with respect to the pulse of the first beam.
Potential Applications
The technology could be applied in semiconductor manufacturing for precise wafer processing, such as etching or patterning.
Problems Solved
The system allows for more controlled and accurate processing of wafers by manipulating the laser beams with different states of polarization and controlled delays.
Benefits
- Enhanced precision in wafer processing. - Improved efficiency in semiconductor manufacturing. - Customizable settings for different processing requirements.
Potential Commercial Applications
"Advanced Wafer Processing System for Semiconductor Manufacturing"
Possible Prior Art
There may be prior art related to optical systems for laser beam manipulation in semiconductor manufacturing processes.
Unanswered Questions
How does the system handle variations in the properties of the laser beams?
The article does not specify how the system compensates for any variations in the properties of the laser beams used in the wafer processing.
What is the impact of the delay time between the two beams on the processing results?
The article does not discuss the specific effects of the delay time between the two beams on the final processing outcomes of the wafers.
Original Abstract Submitted
a wafer processing system includes an optical apparatus including a beam splitter configured to receive a laser beam and to split the laser beam into a first beam in a first state of linear polarization and a second beam in a second state of linear polarization; and a beam delayer configured to delay the second beam so that a pulse of the second beam has a delay time with respect to a pulse of the first beam.
