Samsung electronics co., ltd. (20240112933). SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD USING THE SAME simplified abstract
Contents
- 1 SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD USING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD USING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD USING THE SAME
Organization Name
Inventor(s)
Jeonghee Choi of Suwon-si (KR)
Bongcheol Kim of Suwon-si (KR)
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240112933 titled 'SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD USING THE SAME
Simplified Explanation
The patent application describes a substrate processing system that includes various apparatuses for coating, exposing, developing, cleaning, and heating a photoresist film on a semiconductor substrate.
- The coating apparatus applies a photoresist film onto the semiconductor substrate.
- The exposure apparatus irradiates light onto the photoresist film to create a pattern region.
- The developing system removes unnecessary regions from the photoresist film to form a pattern, using both wet and dry developing methods.
- The cleaning apparatus removes edge beads and excess photoresist from the substrate.
- The heating apparatus is used to heat the photoresist film or pattern.
Potential Applications
The technology described in this patent application could be applied in the semiconductor manufacturing industry for the production of integrated circuits and other electronic devices.
Problems Solved
This technology helps in the precise formation of patterns on semiconductor substrates, ensuring the quality and accuracy of the final product.
Benefits
The benefits of this technology include improved efficiency, accuracy, and quality in the manufacturing process of semiconductor devices.
Potential Commercial Applications
The potential commercial applications of this technology could be in semiconductor fabrication facilities, where precise patterning of photoresist films is crucial for the production of high-quality electronic components.
Possible Prior Art
One possible prior art for this technology could be similar substrate processing systems used in the semiconductor industry for patterning photoresist films on substrates.
Unanswered Questions
How does this technology compare to traditional methods of photoresist patterning in terms of efficiency and accuracy?
This article does not provide a direct comparison between this technology and traditional methods of photoresist patterning.
What are the specific parameters for the heating apparatus in terms of temperature and duration for optimal results?
The article does not specify the exact parameters for the heating apparatus in terms of temperature and duration for optimal results.
Original Abstract Submitted
a substrate processing system includes a coating apparatus configured to coat a photoresist film on a semiconductor substrate, an exposure apparatus configured to irradiate light onto the photoresist film to form a photoresist pattern region, a developing system configured to remove an unnecessary region from the photoresist film except for the photoresist pattern region to form a photoresist pattern, the developing system including a wet developing apparatus and a dry developing apparatus, the wet developing apparatus configured to remove the unnecessary region using a developing solution, the dry developing apparatus configured to remove the unnecessary region using a developing gas, a cleaning apparatus including a cleaning chamber and configured to remove an edge bead of the photoresist film or the photoresist pattern on an edge region of the semiconductor substrate, and a heating apparatus configured to heat the photoresist film or the photoresist pattern.
