Samsung electronics co., ltd. (20240112881). SUBSTRATE ANALYSIS SYSTEM simplified abstract

SUBSTRATE ANALYSIS SYSTEM

Organization Name

samsung electronics co., ltd.

Inventor(s)

Jonghyeok Park of Suwon-si (KR)

Kwangrak Kim of Suwon-si (KR)

Jiwoong Kim of Suwon-si (KR)

Hyenok Park of Suwon-si (KR)

Jeonghyeon Wang of Suwon-si (KR)

Myungjun Lee of Suwon-si (KR)

Yunje Cho of Suwon-si (KR)

Junghee Cho of Suwon-si (KR)

Yun Hwang of Suwon-si (KR)

SUBSTRATE ANALYSIS SYSTEM - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240112881 titled 'SUBSTRATE ANALYSIS SYSTEM

Simplified Explanation

The substrate analysis system described in the abstract is a sophisticated system designed to analyze and measure the milling depth of a pattern layer on a substrate. Here is a simplified explanation of the patent application:

• The system includes a load-lock module for loading and unloading substrates with pattern layers.
• A milling module is used to remove a portion of the pattern layer by forming a milling surface.
• A depth measuring module measures the milling depth of an analysis region on the milling surface.
• An imaging module captures a two-dimensional image of the analysis region.
• A control module coordinates the circulation of the substrate through the milling, depth measuring, and imaging modules.

Potential Applications: - Semiconductor manufacturing - Material analysis in research labs - Quality control in production processes

Problems Solved: - Accurate measurement of milling depth - Efficient analysis of pattern layers on substrates

Benefits: - Improved precision in material analysis - Enhanced quality control in manufacturing processes

Potential Commercial Applications:

1. 1. 1. Enhanced Substrate Analysis System for Semiconductor Manufacturing

Possible Prior Art: There are existing substrate analysis systems that perform similar functions, but the specific combination of modules and features described in this patent application may be novel and innovative.

Unanswered Questions:

1. 1. 1. How does this system compare to traditional methods of substrate analysis?

This article does not provide a direct comparison between this system and traditional methods of substrate analysis.

1. 1. 1. What are the potential limitations or challenges of implementing this technology?

The article does not address any potential limitations or challenges that may arise in implementing this technology.

Original Abstract Submitted

a substrate analysis system includes a load-lock module configured to load or unload a substrate on which a pattern layer is formed; a milling module configured to form a milling surface from which at least a portion of the pattern layer is removed; a depth measuring module configured to measure a milling depth of an analysis region formed on the milling surface; an imaging module configured to capture a two-dimensional image of the analysis region; and a control module controlling the substrate to circulate through the milling module, the depth measuring module, and the imaging module, when the milling depth is shallower than a set target depth, wherein the milling module adjusts a path of the ion beam so that the ion beam moves horizontally in the milling region according to a scanning profile received based on an intensity map of the ion beam.