Samsung electronics co., ltd. (20240105694). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105694 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Simplified Explanation
The semiconductor package described in the abstract includes a semiconductor chip with a first area and a second area, a substrate with a second surface facing the first surface of the semiconductor chip, a first trench on the second surface overlapping the second area of the chip, a bump structure with first bumps on the first area and second bumps on the second area of the chip, and a first passive device in the first trench.
- The semiconductor package has a semiconductor chip with distinct areas and a substrate with a trench that overlaps one of the chip's areas.
- The package includes a bump structure with bumps on different areas of the chip, providing connections between the chip and the substrate.
- A passive device is integrated into the trench on the substrate, enhancing the functionality of the package.
Potential Applications
The technology described in the patent application could be applied in:
- Advanced electronic devices
- High-performance computing systems
- Communication equipment
Problems Solved
This technology helps solve:
- Enhanced connectivity between semiconductor chips and substrates
- Improved integration of passive devices in semiconductor packages
Benefits
The benefits of this technology include:
- Increased efficiency in electronic systems
- Enhanced performance of semiconductor packages
- Improved reliability and durability of electronic devices
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Consumer electronics
- Automotive electronics
- Aerospace industry
Possible Prior Art
One possible prior art for this technology could be the integration of passive devices in semiconductor packages using different bump structures and trench configurations.
Unanswered Questions
How does this technology impact the overall cost of semiconductor packages?
The cost implications of implementing this technology in semiconductor packages are not addressed in the abstract. It would be important to understand if the added features increase the overall cost of production or if they provide cost-saving benefits.
What are the environmental implications of using this technology in electronic devices?
The environmental impact of incorporating this technology into electronic devices, such as potential waste generation or recycling challenges, is not discussed in the abstract. Understanding the environmental implications of this technology is crucial for sustainable electronic manufacturing practices.
Original Abstract Submitted
a semiconductor package includes a semiconductor chip including a first area and a second area around the first area, and a substrate including a second surface, the second surface facing a first surface of the semiconductor chip, a first trench defined on the second surface, and the first trench at least partially overlapping the second area of the semiconductor chip. the semiconductor package includes a bump structure including first bumps on the first area of the semiconductor chip, and second bumps on the second area of the semiconductor chip, the bump structure between the substrate and the semiconductor chip, and a first passive device in the first trench. the second bumps are in contact with the first surface of the semiconductor chip and the first passive device.
