Samsung electronics co., ltd. (20240105689). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105689 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes a lower redistribution wiring layer, a logic semiconductor chip, a first sealing member, conductive connectors, an upper redistribution wiring layer, and at least one memory semiconductor chip mounted using conductive bumps.
- Lower redistribution wiring layer:
- Includes a first chip mounting region, a peripheral region, and lower redistribution wirings.
- Logic semiconductor chip:
- Mounted in the first chip mounting region with first through electrodes connected to lower redistribution wirings.
- First sealing member:
- Covers the logic semiconductor chip.
- Conductive connectors:
- Penetrate the first sealing member in the peripheral region.
- Upper redistribution wiring layer:
- Provided on the first seal with upper redistribution wirings connected to the conductive connectors and at least one second chip mounting region overlapping the first chip mounting region.
- Memory semiconductor chip:
- Mounted in the second chip mounting region using first and second conductive bumps.
Potential Applications
The technology described in the patent application could be applied in the semiconductor industry for advanced packaging solutions, particularly in the development of high-performance electronic devices.
Problems Solved
This technology addresses the need for efficient and reliable connections between semiconductor chips in a package, ensuring optimal performance and functionality of the integrated circuits.
Benefits
- Improved electrical connectivity between chips - Enhanced overall performance of electronic devices - Increased reliability and durability of semiconductor packages
Potential Commercial Applications
"Advanced Semiconductor Packaging Solutions for Enhanced Electronic Devices"
Possible Prior Art
There may be prior art related to semiconductor packaging techniques involving redistribution wiring layers, conductive connectors, and the mounting of multiple chips within a single package. Further research and analysis would be needed to identify specific examples of prior art in this field.
Unanswered Questions
How does this technology compare to existing semiconductor packaging solutions?
The article does not provide a direct comparison with existing semiconductor packaging solutions in terms of performance, cost-effectiveness, or scalability.
What are the specific technical challenges faced in implementing this technology on a large scale?
The article does not delve into the specific technical challenges that may arise when implementing this technology on a large scale, such as manufacturing complexities, material compatibility issues, or thermal management concerns.
Original Abstract Submitted
a semiconductor package includes: a lower redistribution wiring layer having: a first chip mounting region; a peripheral region, and lower redistribution wirings; a logic semiconductor chip mounted in the first chip mounting region, the logic semiconductor chip having a plurality of first through electrodes that are electrically connected to at least some of the lower redistribution wirings; a first sealing member covering the logic semiconductor chip, a plurality of conductive connectors penetrating the first sealing member in the peripheral region; an upper redistribution wiring layer provided on the first seal and having upper redistribution wirings that are electrically connected to the plurality of conductive connectors, the upper redistribution wiring layer having at least one second chip mounting region that overlaps at least a portion of the first chip mounting region; and at least one memory semiconductor chip mounted in the second chip mounting region using first and second conductive bumps.
