Samsung electronics co., ltd. (20240105567). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
Choong Bin Yim of SUWON-SI (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105567 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Simplified Explanation
The semiconductor package described in the patent application consists of a first package substrate with distinct areas, a first connection element with a semiconductor chip, a second connection element with a greater thickness, a third connection element, a second package substrate, and a second semiconductor chip.
- The semiconductor package includes a first package substrate with separate areas.
- A first connection element with a semiconductor chip is connected to the first area.
- A second connection element with a greater thickness is located on the second area.
- A third connection element is electrically connected to the second connection element.
- A second package substrate is placed on the third connection element.
- A second semiconductor chip is positioned on the second package substrate.
Potential Applications
The technology described in this patent application could be applied in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics.
Problems Solved
This technology solves the problem of efficiently connecting multiple semiconductor chips in a compact and reliable manner within a semiconductor package.
Benefits
The benefits of this technology include improved performance, increased functionality, and enhanced reliability of electronic devices.
Potential Commercial Applications
The semiconductor package innovation could be utilized in the manufacturing of advanced electronic devices for the consumer market, industrial applications, and automotive electronics.
Possible Prior Art
One possible prior art for this technology could be the development of multi-chip modules in the semiconductor industry, where multiple chips are integrated into a single package for improved performance and functionality.
Unanswered Questions
How does this technology compare to existing multi-chip packaging solutions in terms of size and performance?
This article does not provide a direct comparison with existing multi-chip packaging solutions in terms of size and performance.
What are the potential challenges in implementing this technology on a large scale for mass production?
The article does not address the potential challenges in implementing this technology on a large scale for mass production.
Original Abstract Submitted
a semiconductor package includes a first package substrate having a first area and a second area that is distinct and separate from the first area, a first connection element disposed on the first area and having a first thickness, a first semiconductor chip connected to the first connection element, a second connection element disposed on the second area and having a second thickness that is greater than the first thickness, a third connection element disposed on the second connection element and electrically connected to the second connection element, a second package substrate disposed on the third connection element, and a second semiconductor chip disposed on the second package substrate.
