Samsung electronics co., ltd. (20240096909). CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME simplified abstract
Contents
- 1 CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
Organization Name
Inventor(s)
Seunghyun Cho of Suwon-si (KR)
CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096909 titled 'CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
Simplified Explanation
The chip on film (COF) package described in the patent application includes a film substrate with a base film, main line pattern, and branch line pattern, a semiconductor chip overlapping the mounting region, first and second bump structures for electrical connections, and specific positioning of the branch line pattern to avoid overlap with the bump structures.
- Film substrate with base film, main line pattern, and branch line pattern
- Semiconductor chip positioned over mounting region
- First bump structure connected to main line pattern
- Second bump structure connected to branch line pattern
- Branch line pattern positioned to avoid overlap with bump structures
Potential Applications
The technology described in this patent application could be applied in the manufacturing of electronic devices such as smartphones, tablets, and other consumer electronics that require compact and efficient packaging of semiconductor chips.
Problems Solved
This technology solves the problem of efficiently connecting semiconductor chips to film substrates in a compact and reliable manner, ensuring proper electrical connections without interference between different components.
Benefits
The benefits of this technology include improved reliability and efficiency in the packaging of semiconductor chips, leading to enhanced performance and durability of electronic devices. Additionally, the compact design allows for smaller and thinner devices.
Potential Commercial Applications
- "Compact and Efficient Semiconductor Chip Packaging Technology for Electronic Devices"
Possible Prior Art
One possible prior art in semiconductor chip packaging technology is the use of wire bonding or flip chip technology for connecting chips to substrates. However, the specific design and positioning of bump structures and branch line patterns as described in this patent application may be a novel innovation.
Unanswered Questions
How does this technology compare to traditional wire bonding methods in terms of efficiency and reliability?
The article does not provide a direct comparison between this technology and traditional wire bonding methods in terms of efficiency and reliability. It would be interesting to see a study or analysis on how this new COF package design improves upon existing methods.
What are the potential cost implications of implementing this technology in mass production of electronic devices?
The article does not address the potential cost implications of implementing this technology in mass production. It would be valuable to understand how the design changes and materials used in this COF package may impact the overall production costs of electronic devices.
Original Abstract Submitted
a chip on film (cof) package includes a film substrate including a base film having a mounting region, a main line pattern extending on the base film, and a branch line pattern extending on the base film and electrically connected to the main line pattern, a semiconductor chip vertically overlapping the mounting region, a first bump structure disposed between the semiconductor chip and the film substrate and electrically connected to the main line pattern, and a second bump structure disposed between the semiconductor chip and the film substrate and electrically connected to the branch line pattern, the branch line pattern extends so as not to overlap a first edge of the first bump structure facing a first edge of the mounting region and a first edge of the second bump structure facing the first edge of the mounting region.
