Samsung electronics co., ltd. (20240096904). CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME simplified abstract
Contents
- 1 CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
Organization Name
Inventor(s)
Seung Hyun Cho of Suwon-si (KR)
CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096904 titled 'CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
Simplified Explanation
The chip-on-film package described in the abstract consists of a lower base film, an upper base film, semiconductor chips mounted on each film, and an interposer film between the two base films.
- Lower base film with first and second surfaces
- Upper base film with third and fourth surfaces
- First semiconductor chip mounted on the second surface of the lower base film
- Second semiconductor chip mounted on the third surface of the upper base film
- Interposer film between the lower and upper base films
Potential Applications
The technology could be used in various electronic devices such as smartphones, tablets, and laptops.
Problems Solved
This technology helps in reducing the overall size of electronic devices while maintaining functionality.
Benefits
The chip-on-film package allows for compact and efficient integration of multiple semiconductor chips in a small form factor.
Potential Commercial Applications
- "Compact Integration of Semiconductor Chips in Electronic Devices"
Possible Prior Art
There may be prior art related to chip-on-film packages in the semiconductor industry, but specific examples are not provided in the abstract.
Unanswered Questions
How does the chip-on-film package impact the overall cost of electronic devices?
The abstract does not mention the cost implications of implementing this technology.
What are the environmental considerations of using chip-on-film packages in electronic devices?
The environmental impact of this technology is not addressed in the abstract.
Original Abstract Submitted
a chip-on-film package includes: a lower base film including a first surface and a second surface, which are opposite to each other; an upper base film including a third surface and a fourth surface, which are opposite to each other, and is disposed on the lower base film; a first semiconductor chip mounted on the second surface of the lower base film; a second semiconductor chip mounted on the third surface of the upper base film; and an interposer film interposed between the lower and upper base films, wherein the second and third surfaces face each other.
