Samsung electronics co., ltd. (20240096815). SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096815 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the abstract includes a first package substrate with a first redistribution structure, a second package substrate with a second redistribution structure, a semiconductor chip positioned between the two substrates and attached to the first substrate, and a fiducial mark on the second substrate that is separate from the second redistribution structure in a plan view.
- The semiconductor package consists of two package substrates with redistribution structures.
- A semiconductor chip is placed between the substrates and attached to one of them.
- A fiducial mark is located on the second substrate, separate from its redistribution structure.
Potential Applications
This technology could be applied in:
- Advanced electronic devices
- Semiconductor manufacturing industry
Problems Solved
This technology helps to:
- Improve alignment accuracy
- Enhance semiconductor packaging efficiency
Benefits
The benefits of this technology include:
- Increased precision in semiconductor packaging
- Enhanced reliability of electronic devices
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Consumer electronics
- Telecommunications industry
Possible Prior Art
One possible prior art for this technology could be:
- Existing semiconductor packaging methods and structures
Unanswered Questions
How does this technology impact the overall cost of semiconductor packaging?
The abstract does not provide information on the cost implications of this technology.
What specific materials are used in the fabrication of the fiducial mark?
The abstract does not detail the materials used in creating the fiducial mark.
Original Abstract Submitted
a semiconductor package includes: a first package substrate including a first redistribution structure; a second package substrate including a second redistribution structure; a semiconductor chip provided between the first package substrate and the second package substrate, and attached to the first package substrate; and a fiducial mark provided on the second package substrate and separated from the second redistribution structure in a plan view.
