Samsung display co., ltd. (20240111194). DISPLAY DEVICE simplified abstract
Contents
- 1 DISPLAY DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 DISPLAY DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
DISPLAY DEVICE
Organization Name
Inventor(s)
Dae Geun Lee of Hwaseong-si (KR)
Su Jeong Kim of Gimcheon-si (KR)
Sang Won Yeo of Cheonan-si (KR)
Kyung Mok Lee of Bucheon-si (KR)
DISPLAY DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240111194 titled 'DISPLAY DEVICE
Simplified Explanation
The patent application describes a display device with conductive pads arranged in rows on a substrate, and a drive circuit chip with bumps arranged in rows to connect with the pads. The pads in the same row are parallel, while the bumps in the same row are in a zigzag form, partially shifted.
- Conductive pads arranged in rows on a substrate
- Drive circuit chip with bumps arranged in rows
- Pads in the same row are parallel
- Bumps in the same row are in a zigzag form, partially shifted
Potential Applications
The technology could be applied in various display devices such as smartphones, tablets, and monitors.
Problems Solved
This technology allows for more efficient and reliable electrical connections between the substrate and drive circuit chip in display devices.
Benefits
- Improved electrical connections
- Enhanced display performance
- Increased reliability
Potential Commercial Applications
- Consumer electronics industry
- Display manufacturing companies
Possible Prior Art
There may be prior art related to the arrangement of conductive pads and bumps in display devices, but specific examples are not provided in the abstract.
Unanswered Questions
How does this technology impact the overall cost of manufacturing display devices?
The abstract does not mention the cost implications of implementing this technology in display devices.
What are the potential challenges in mass-producing display devices using this technology?
The abstract does not address any potential challenges that may arise in large-scale production of display devices with this technology.
Original Abstract Submitted
a display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.
