Samsung display co., ltd. (20240107817). DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME simplified abstract
Contents
- 1 DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology compare to existing display technologies in terms of power consumption and durability?
- 1.11 What are the potential limitations or challenges in implementing this technology on a large scale for commercial production?
- 1.12 Original Abstract Submitted
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Jeongseok Lee of Yongin-si (KR)
Wooyong Sung of Yongin-si (KR)
Seungyong Song of Yongin-si (KR)
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240107817 titled 'DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The patent application describes a display apparatus with a metal bank layer, a first subpixel electrode, a bus electrode, an insulating layer, a first intermediate layer, and a first counter electrode.
- The display apparatus includes a metal bank layer with a first opening overlapping the first subpixel electrode.
- The metal bank layer is made up of a first metal layer and a second metal layer.
- An insulating layer is placed between the first subpixel electrode, the bus electrode, and the metal bank layer.
- A first intermediate layer overlaps the first subpixel electrode in the first opening of the metal bank layer.
- A first counter electrode is positioned on the first intermediate layer in the first opening of the metal bank layer.
Potential Applications
The technology described in the patent application could be used in the development of high-resolution displays for electronic devices such as smartphones, tablets, and televisions.
Problems Solved
This technology helps in improving the performance and efficiency of display screens by providing a more precise and reliable method for controlling individual subpixels.
Benefits
The benefits of this technology include enhanced image quality, increased display resolution, and improved overall display performance.
Potential Commercial Applications
The technology could be applied in the manufacturing of advanced display panels for consumer electronics, medical devices, automotive displays, and other high-tech products.
Possible Prior Art
One possible prior art for this technology could be the use of metal bank layers in display devices to improve electrical connections and pixel control.
Unanswered Questions
How does this technology compare to existing display technologies in terms of power consumption and durability?
The article does not provide information on the power consumption and durability of the display apparatus compared to existing technologies.
What are the potential limitations or challenges in implementing this technology on a large scale for commercial production?
The article does not address the potential limitations or challenges in scaling up the production of display apparatus with the described technology for commercial use.
Original Abstract Submitted
a display apparatus includes: a first subpixel electrode; a bus electrode adjacent to the first pixel electrode; a metal bank layer including a first opening overlapping the first subpixel electrode, the metal bank layer comprising a first metal layer and a second metal layer disposed on the first metal layer; an insulating layer disposed on the first subpixel electrode and the bus electrode and under the metal bank layer; a first intermediate layer overlapping the first subpixel electrode in the first opening of the metal bank layer; and a first counter electrode disposed on the first intermediate layer in the first opening of the metal bank layer, wherein the metal bank layer is electrically connected to the bus electrode through a contact hole defined in the insulating layer.
