Samsung display co., ltd. (20240099115). BONDING DEVICE AND METHOD OF FABRICATING DISPLAY DEVICE USING THE SAME simplified abstract
Contents
BONDING DEVICE AND METHOD OF FABRICATING DISPLAY DEVICE USING THE SAME
Organization Name
Inventor(s)
TAEHYEOG Jung of Hwaseong-si (KR)
BONDING DEVICE AND METHOD OF FABRICATING DISPLAY DEVICE USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240099115 titled 'BONDING DEVICE AND METHOD OF FABRICATING DISPLAY DEVICE USING THE SAME
Simplified Explanation
The bonding device described in the patent application consists of a stage and a pressing part that can move towards the stage. The stage has a first layer with a flat portion and bending portions, while the pressing part has a second layer with a flat portion and bending portions. The bending portions are bent with curvatures, with the curvature of the second bending portions being smaller than that of the first bending portions.
- Explanation of the patent/innovation:
* Bonding device with stage and pressing part * First layer on stage with flat and bending portions * Second layer on pressing part with flat and bending portions * Bending portions bent with curvatures, second layer curvatures smaller than first layer
- Potential applications of this technology:
* Semiconductor manufacturing * Microelectronics assembly * Medical device fabrication
- Problems solved by this technology:
* Ensures uniform bonding between materials * Prevents damage to delicate components * Improves overall product quality
- Benefits of this technology:
* Enhanced precision in bonding process * Increased efficiency in production * Cost-effective solution for bonding applications
- Potential commercial applications of this technology:
* Electronics industry * Aerospace sector * Automotive manufacturing
- Possible prior art:
* Similar bonding devices with flat and bending portions * Devices with stages and pressing parts for bonding applications
- Unanswered questions:
- How does this bonding device compare to existing technologies in terms of efficiency and precision?
The article does not provide a direct comparison between this bonding device and existing technologies. Further research or testing may be needed to determine the advantages of this device over others.
- What materials are most suitable for use with this bonding device?
The patent application does not specify the types of materials that are best suited for bonding using this device. Additional information or experimentation may be required to identify the optimal materials for this technology.
Original Abstract Submitted
a bonding device includes: a stage and a pressing part, which is placed on the stage and is movable toward the stage. a first layer, which is disposed on an upper surface of the stage, includes a first flat portion and first bending portions. a second layer, which is disposed below a lower surface of the pressing part, includes a second flat portion and second bending portions. the first and second bending portions may be disposed between the stage and the pressing part, in a state bent with curvatures, respectively. the curvature of a lower surface of each of the second bending portions is smaller than the curvature of an upper surface of each of the first bending portions.
